AFS600-FGG256 vs M7AFS600-FGG256 비교
다음의 상세 나란히 비교: AFS600-FGG256 제조: Microchip Technology 및 M7AFS600-FGG256 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
M7AFS600-FGG256 ✓ 활성사양 비교
| 파라미터 | AFS600-FGG256 | M7AFS600-FGG256 |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | Unknown | 활성 |
| Device Type | Fusion mixed-signal FPGA | — |
| System Gates | 600,000 gates | 600K |
| Configurable Logic Cells | 13,824 cells | — |
| I/O Count | 119 I/Os | — |
| 공급 전압 | 1.5 V | — |
| Logic Family | CMOS | — |
| Process Technology | 130 nm | 130 nm flash-based |
| Metal Layers | 7 layers | — |
| Configuration Memory | Flash-based nonvolatile memory | Flash (single-chip, non-volatile) |
| Configuration Feature | Live at Power-Up (LAPU) | — |
| 최대 클록 주파수 | 1098.9 MHz | — |
| 동작 온도 | 0°C to 70°C | [DATA_NEEDED: Operating Temperature Range] |
| Package Type | 256-pin FBGA | — |
| Package Pitch | 1.0 mm | — |
| 실장 유형 | Surface mount | Surface Mount |
| Packing Media | Tray | — |
| RoHS | Compliant | — |
| Family | — | Fusion (M7AFS600) |
| Flip-Flops | — | 110592 |
| User I/O | — | 119 |
| Embedded Processor | — | ARM CoreMP7 |
| Core Supply Voltage | — | 1.5 V |
| Maximum Frequency | — | 1098.9 MHz (distributor listing) |
| 패키지 | — | 256-LBGA / 256-FBGA |
| Ball Pitch | — | 1 mm |
| Analog Features | — | Integrated configurable analog blocks, clock generation and management |
| Packaging | — | Tray |
| RoHS 상태 | — | [DATA_NEEDED: RoHS Status] |
| MSL 레벨 | — | [DATA_NEEDED: Moisture Sensitivity Level] |