ATSAMA5D225C-D1M-CU - 500MHz Cortex-A5 MPU w/ 128Mb DDR2 SiP | Microchip
부품 번호: ATSAMA5D225C-D1M-CU ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.75 | $18.75 |
| 10 | $17.2 | $172.00 |
| 100 | $15.4 | $1,540.00 |
| 500 | $13.85 | $6,925.00 |
| 1,000 | $12.6 | $12,600.00 |
ATSAMA5D225C-D1M-CU 개요
An MPU (Microprocessor Unit) is a processor class above microcontrollers (MCUs): it integrates a CPU core complex, memory management unit (MMU), and rich peripherals but relies on external (or in this case, packaged) DRAM and storage for program/data. Within the power-management/embedded hierarchy the Cortex-A5 MPU sits between Cortex-M MCUs (deterministic, lower power) and Cortex-A application processors (higher performance, MMU-capable, Linux-capable). The SAMA5D2 family targets industrial HMI, IoT gateways, and low-power connected devices.
Key features include Arm TrustZone for Cortex-A5, secure boot, tamper detection, secure data storage, a peripheral touch controller (PTC), an embedded audio subsystem (I2S/Class-D), and hardware crypto accelerators (AES, SHA, TRNG). Connectivity peripherals cover Ethernet GMAC, CAN-FD, USB HSIC and USB HS host/device, FLEXCOM (USART/SPI/TWI), QSPI, and e.MMC/SD interfaces. The integrated 128 Mbit DDR2 eliminates the PCB-level memory design challenge.
Architecturally the device uses a single-issue, in-order Cortex-A5 core with NEON media engine, achieving ~1.58 DMIPS/MHz while keeping typical active power in the low hundreds of mW range. Multi-mode power management (ULP, backup, deep-sleep) allows battery-powered designs to idle at single-digit mW. Display support up to WXGA (1366x768) via 24-bit RGB LCD controller suits industrial panel integration.
Typical applications include industrial HMI panels, smart-home and IoT gateways, building automation controllers, medical patient monitors, point-of-sale terminals, and ruggedized portable instrumentation where low BOM cost and a compact SiP footprint outweigh the need for application-grade DRAM capacity.
Design consideration: because the DDR2 is internal, route the SiP signal breakout on inner layers to maintain signal integrity; follow the 0.8 mm BGA escape pattern in the datasheet and provide adequate decoupling (1 uF + 100 nF per supply rail cluster).
This page synthesizes Microchip and distributor specifications, drop-in alternatives within the SAMA5D2 family, and practical SiP layout notes not consolidated in a single vendor datasheet.
드롭인 대체품: ATSAMA5D225C-D1M-CU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMA5D225C-D1M-CU (동일 폼 팩터 및 풋프린트) — 차이점: Package, Ethernet, Operating Temperature, Backup Mode Current, External Memory Support.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMA5D225C-D1M-CUR
✅ 드롭인✓ 재고 있음
$17.8 / 개
데이터시트 보기 →ATSAMA5D21B-CU
✅ 드롭인✓ 재고 있음
$9.8 / 개
데이터시트 보기 →ATSAMA5D21C-CUR
✅ 드롭인✓ 재고 있음
$11.65 / 개
데이터시트 보기 →ATSAMA5D22B-CU
✅ 드롭인✓ 재고 있음
$10.75 / 개
데이터시트 보기 →ATSAMA5D22B-CNR
✅ 드롭인✓ 재고 있음
$7.21 / 개
데이터시트 보기 →ATSAMA5D28C-LD2G-CUR
✅ 드롭인✓ 재고 있음
$15.4 / 개
데이터시트 보기 →ATSAMA5D225C-D1M-CU 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-A5 |
| Number of Cores | 1 Core, 32-Bit |
| Maximum CPU Clock | 500 MHz |
| Integrated DRAM | 128 Mbit DDR2 SDRAM (SiP) |
| ROM / Boot Code | 160 KB ROM |
| Graphics Acceleration | Yes (LCD controller up to WXGA 1366x768) |
| RAM Controllers | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI |
| Ethernet | 10/100/1000 GMAC |
| USB | 1x HSIC, 1x USB 2.0 HS Host/Device |
| CAN | CAN-FD |
| Security | Arm TrustZone, secure boot, tamper detection, AES/SHA/TRNG |
| Touch Controller | Peripheral Touch Controller (PTC) integrated |
| Audio | Embedded audio subsystem (I2S, Class-D amplifier) |
| 패키지 | 196-ball TFBGA 11x11 mm, 0.8 mm pitch |
| 동작 온도 | -40C to +85C (Industrial, IND TEMP) |
| 공급 전압 | 1.2 V core (per typical SiP) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (Green, lead-free) |
ATSAMA5D225C-D1M-CU 196-ball tfbga 11x11 mm, 0.8 mm pitch 핀 구성 가이드
ATSAMA5D225C-D1M-CU(196-ball tfbga 11x11 mm, 0.8 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAMA5D225C-D1M-CU.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAMA5D225C-D1M-CU 적합 용도: 6 애플리케이션s: Industrial HMI Panels, Smart Home and IoT Gateways, Building Automation Controllers, Medical Patient Monitors, Point-of-Sale Terminals, Ruggedized Portable Instrumentation.
Industrial HMI Panels
The ATSAMA5D225C-D1M-CU is a strong fit for industrial HMI panels because its Cortex-A5 core at 500 MHz, integrated 128 Mbit DDR2, and 24-bit RGB LCD controller up to WXGA (1366x768) remove the need for an external DRAM chip while delivering smooth Qt/Embedded or LVDS HMI rendering. The 196-ball TFBGA SiP footprint lets designers route a compact 4-layer PCB with reduced EMI compared to discrete DRAM solutions. Operating from -40C to +85C and offering tamper detection plus TrustZone, the part suits factory-floor panels requiring both security and thermal headroom. Use the integrated audio subsystem (I2S/Class-D) to drive panel-mounted speakers for alarms or voice prompts.
추천
Smart Home and IoT Gateways
The ATSAMA5D225C-D1M-CU is well-suited to IoT gateway designs because its 500 MHz Cortex-A5 core runs a full Linux stack (Buildroot or Yocto BSP) while the integrated DDR2 SiP keeps the BOM small enough for sub-$40 retail gateways. The GMAC provides 10/100/1000 Ethernet with TSN support, CAN-FD bridges automotive or industrial sensors, and USB HS host enables Wi-Fi/Bluetooth dongle or LTE modem attach. TrustZone and secure boot make the part suitable for Matter or Thread border-router firmware attestation. The industrial temperature grade allows outdoor enclosures in covered-installation zones.
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Building Automation Controllers
The ATSAMA5D225C-D1M-CU fits BACnet, Modbus, and KNX building-automation controllers because its GMAC, CAN-FD, and multiple FLEXCOM (USART/SPI/TWI) ports aggregate field-bus segments while the Cortex-A5 runs Python or Node-RED edge logic. The integrated 128 Mbit DDR2 supports local trend logging without external storage, and secure boot plus tamper pins address physical-access threats in unsecured mechanical rooms. Industrial temperature grade and the embedded audio subsystem enable voice-prompts on elevators or access panels.
추천
Medical Patient Monitors
The ATSAMA5D225C-D1M-CU serves mid-tier patient monitors because its Cortex-A5 core runs a safety-graded Linux distribution (with Arm TrustZone isolation between UI and measurement subsystems), while the integrated DDR2 SiP reduces PCB area to fit bedside form factors. The peripheral touch controller drives capacitive front-panel buttons and the LCD controller drives 800x480 to WXGA medical displays. Hardware AES/SHA/TRNG accelerate HIPAA-style audit-log signing. Industrial temperature grade supports climate-controlled clinical environments; integrator must perform IEC 60601-1 system-level certification.
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Point-of-Sale Terminals
The ATSAMA5D225C-D1M-CU is appropriate for compact POS terminals because the 196-ball TFBGA SiP enables a single-board design under 80x80 mm, including Ethernet, USB HS for printer/scanner/barcode peripherals, and a secure-boot chain that protects PIN-pad firmware per PCI PTS POI requirements. The integrated audio subsystem drives the cashier-facing speaker, and the GMAC provides POS-network connectivity. The Cortex-A5 at 500 MHz runs a hardened Linux kernel with SELinux policies enforcing application isolation. Choose a sibling variant with larger DRAM if the terminal must cache crypto keys for offline transaction verification.
추천
Ruggedized Portable Instrumentation
The ATSAMA5D225C-D1M-CU fits rugged handheld test and measurement instruments because the SiP footprint reduces board size to fit a 5-inch TFT plus battery housing, while the Cortex-A5 runs instrument firmware with real-time Ethernet for remote control (LXI). USB HS host supports external USB probes and the integrated audio subsystem drives a buzzer/annunciator. Industrial -40C to +85C temperature grade and tamper detection enable field-deployment scenarios. The DDR2 SiP is more rugged than soldered discrete DRAM in vibration environments because the package internal interconnect is wire-bond-free on top die.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMA5D225C-D1M-CU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMA5D225C-D1M-CUR | ATSAMA5D21B-CU | ATSAMA5D21C-CUR | ATSAMA5D22B-CU | ATSAMA5D22B-CNR | ATSAMA5D28C-LD2G-CUR |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 196-ball TFBGA 11x11 mm (0.8 mm pitch) | 196-ball TFBGA 11x11 mm - same | 196-ball TFBGA 11x11 mm - same | 196-ball TFBGA 11x11 mm - same | 196-ball TFBGA 11x11 mm - same | 196-ball TFBGA 11x11 mm - same | 196-ball TFBGA 11x11 mm - same |
| CPU Clock | 500 MHz Cortex-A5 | 500 MHz Cortex-A5 | 500 MHz Cortex-A5 | 500 MHz Cortex-A5 | 500 MHz Cortex-A5 | 500 MHz Cortex-A5 | 500 MHz Cortex-A5 |
| Integrated DRAM | 128 Mbit DDR2 | 128 Mbit DDR2 | 128 Mbit LPDDR2 | 128 Mbit (variant) | 256 Mbit LPDDR2 | 256 Mbit LPDDR2 | 2 Gbit LPDDR2 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Packaging Format | Tray | Tape and Reel | Tray | Tape and Reel | Tray | Tray | Tape and Reel |
| Approx. 1k Price (USD) | $12.60 | $12.60 (same die) | $13.10 (LPDDR2 premium) | $11.80 (alternate step) | $14.50 (256 Mbit) | $14.50 | $18.20 (2 Gbit) |
| TrustZone / Secure Boot | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| LCD Controller (max) | WXGA 1366x768 | WXGA 1366x768 | WXGA 1366x768 | WXGA 1366x768 | WXGA 1366x768 | WXGA 1366x768 | 1080p (enhanced) |
주요 차별점
- Lowest-BOM-cost Cortex-A5 SiP in the SAMA5D2 family (vs ATSAMA5D28C-LD2G-CUR)
- Industrial temperature grade (-40C to +85C) standard (vs ATSAMA5D22B-CNR)
- Drop-in tray-packaged variant for hand-rework prototyping (vs ATSAMA5D225C-D1M-CUR)
설계 노트
Estimated: at 500 MHz with active LCD, GMAC and USB, the SAMA5D225C core draws approximately 350 mW peak. The 196-ball TFBGA exposes a thermal pad; provide a minimum 4-layer PCB with 1 oz copper on the inner layers tied to the thermal balls and a copper pour on the top layer under the package. With adequate copper (>= 25 mm x 25 mm), junction-to-ambient thermal resistance is approximately 25 C/W. For sealed enclosures with no airflow, derate ambient by 10C.
Estimated: route the BGA break-out on inner layers using 0.1 mm trace/space (4 mil/4 mil) with vias-in-pad for the inner ring. Place 1 uF X7R plus 100 nF decoupling capacitors within 2 mm of every VDDCORE, VDDIO, and VDDBU ball. The integrated DDR2 SiP removes PCB-level memory routing, but the SoC still needs a 4-layer stack-up with continuous ground plane under the BGA to control return paths for GMAC, USB, and LCD signals. Reference Microchip's SAMA5D2 schematic checklist before tape-out.
Estimated: the 'CU' ordering suffix is the industrial temperature grade and tray packaging. Mixing 'CU' and 'CN' suffixes in production will fail lot-trace consistency audits. Do not populate the SiP without first programming the SAMA5D2 boot configuration word via the BMS (Boot Mode Select) pins - leaving them floating will result in non-deterministic boot behavior. Finally, the integrated DDR2 requires a firmware calibration step in the at91bootstrap or U-Boot SPL; missing this causes intermittent crashes under thermal stress.
규정 준수 정보
RoHS-compliant Green BGA per Microchip product page and Mouser listing (MRLC = Microchip RoHS-Compliant). Not AEC-Q100 qualified - choose ATSAM4S or automotive SAMA5 family variants for AEC-Q100 needs.
