ATSAMA5D24A-CU vs ATSAMA5D225C-D1M-CU 비교
다음의 상세 나란히 비교: ATSAMA5D24A-CU 제조: Microchip Technology 및 ATSAMA5D225C-D1M-CU 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
ATSAMA5D24A-CU - ARM Cortex-A5 MPU 500MHz 256-TFBGA | Microchip
ATSAMA5D24A-CU ✓ 활성Microchip Technology
ATSAMA5D225C-D1M-CU - 500MHz Cortex-A5 MPU w/ 128Mb DDR2 SiP | Microchip
ATSAMA5D225C-D1M-CU ✓ 활성사양 비교
| 파라미터 | ATSAMA5D24A-CU | ATSAMA5D225C-D1M-CU |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $9.85 | $12.60 |
| Manufacturer | Microchip Technology | — |
| Series | SAMA5D2 | — |
| Core Processor | ARM Cortex-A5 | ARM Cortex-A5 |
| Core Count | 1 | — |
| 데이터 버스 폭 | 32-bit | — |
| Maximum Clock Speed | 500 MHz | — |
| On-chip SRAM | 128 KB | — |
| Instruction Cache | 32 KB | — |
| Data Cache | 32 KB | — |
| 패키지 | 256-TFBGA (8x8 mm) | 196-ball TFBGA 11x11 mm, 0.8 mm pitch |
| 실장 유형 | Surface Mount | Surface Mount (BGA) |
| Memory Controllers | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | — |
| Graphics Acceleration | Yes (LCD controller) | Yes (LCD controller up to WXGA 1366x768) |
| NEON SIMD Engine | Yes | — |
| Floating Point Unit | Single-precision FPU | — |
| Cryptography | AES, SHA, AES-OTF, Secure Boot | — |
| Touch Controller | Peripheral Touch Controller (PTC) | Peripheral Touch Controller (PTC) integrated |
| USB | USB 2.0 + HSIC | 1x HSIC, 1x USB 2.0 HS Host/Device |
| Ethernet | 10/100 Mbps (1) | 10/100/1000 GMAC |
| 동작 온도 | -40C to +85C | -40C to +85C (Industrial, IND TEMP) |
| Backup Mode Current | 5 uA (typical) | — |
| I/O Voltage | 1.2 V, 1.8 V, 3.3 V | — |
| RoHS 상태 | Compliant | Compliant (Green, lead-free) |
| Number of Cores | — | 1 Core, 32-Bit |
| Maximum CPU Clock | — | 500 MHz |
| Integrated DRAM | — | 128 Mbit DDR2 SDRAM (SiP) |
| ROM / Boot Code | — | 160 KB ROM |
| RAM Controllers | — | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI |
| CAN | — | CAN-FD |
| Security | — | Arm TrustZone, secure boot, tamper detection, AES/SHA/TRNG |
| Audio | — | Embedded audio subsystem (I2S, Class-D amplifier) |
| 공급 전압 | — | 1.2 V core (per typical SiP) |