EP1M350B780C7 vs EP1M350F780C7ES 비교
다음의 상세 나란히 비교: EP1M350B780C7 제조: Altera 및 EP1M350F780C7ES 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP1M350B780C7 | EP1M350F780C7ES |
|---|---|---|
| 브랜드 | Altera | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | NRND | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $92.00 | $0.00 |
| Family | Mercury (EP1M) | — |
| Device Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Equivalent System Gates | 350,000 gates | — |
| 패키지 | 780-ball FineLine BGA | — |
| Core Voltage | 1.5 V | — |
| I/O Voltage Tolerance | 3.3 V | — |
| Maximum User I/O Count | [DATA_NEEDED: per-package I/O count for 780 BGA] | — |
| Transceivers | Multi-gigabit serial transceivers (up to 1.25 Gbps) | — |
| Logic Block Architecture | 4-input LUT-based fabric with embedded memory | — |
| Embedded Memory | [DATA_NEEDED: total RAM bits] | — |
| Peak Reflow Temperature | 220 C (per distributor datasheet) | — |
| 동작 온도 범위 | Commercial (0C to +85C) - C grade suffix | — |
| Configuration Interface | Altera enhanced configuration devices + JTAG | — |
| Development Tool | Quartus II (legacy) | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| RoHS 상태 | [DATA_NEEDED: confirm per lot] | unknown |
| MSL 레벨 | [DATA_NEEDED: MSL per JEDEC J-STD-020] | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Logic Family | — | CMOS |
| User I/O Count | — | 486 pins |
| Total Package Pins | — | 780 pins |
| Package Type | — | FINE LINE BGA-780 |
| Package Category | — | 780-BBGA |
| 공급 전압 | — | 1.8 V |
| Maximum Stated Transceiver Data Rate | — | 1.25 Gbps |
| Channels Supported at 1.25 Gbps | — | 8 channels |
| Remaining Channel Limit | — | 10 channels at 1.0 Gbps or less |
| 동작 온도 | — | 0 C to 85 C |
| Clock Data Recovery | — | Supported |
| High-Speed Transceivers | — | Integrated |
| REACH Status | — | unknown |
| Logic Element Count | — | [DATA_NEEDED: logic element count] |
| Embedded Memory Capacity | — | [DATA_NEEDED: embedded memory capacity] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| 열 저항 | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |