EP2SGX60CF780C3 vs EP2SGX60CF780C5 비교
다음의 상세 나란히 비교: EP2SGX60CF780C3 제조: Intel 및 EP2SGX60CF780C5 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP2SGX60CF780C3 | EP2SGX60CF780C5 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | NRND | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $870.00 | $162.00 |
| Family | Stratix II GX | — |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3,022 | 3,022 |
| On-chip RAM Bits | 2,544,192 (~317 KB) | — |
| User I/Os | 364 | — |
| Transceivers | Up to 12 multi-gigabit transceivers (per family datasheet) | Up to 20 multi-gigabit transceivers |
| Transceiver Data Rate (max) | 6.375 Gbps (per Stratix II GX family datasheet) | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm CMOS |
| Speed Grade | C3 (commercial) | C5 (commercial) |
| 패키지 | 780-ball FineLine BGA (FBGA-780), 29 mm x 29 mm, 1.0 mm pitch | 780-ball FC-FBGA (29x29 mm, 1 mm pitch) |
| 동작 온도 | Commercial (0C to +85C junction) | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| MSL 레벨 | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | Compliant |
| Device Family | — | Stratix II GX |
| Embedded Memory Bits | — | 2,544,192 bits |
| Maximum User I/Os | — | 364 |
| 핀 수 | — | 780 |
| Maximum Internal Frequency | — | 717 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay in ns] |
| Temperature Grade | — | Commercial (0C to +85C) |
| DSP Blocks | — | Yes (TriMatrix embedded multiplier blocks) |
| PLLs | — | 4 enhanced PLLs + 8 fast PLLs |
| Configuration Schemes | — | Passive Serial, Fast Passive Parallel, JTAG |
| Memory Interfaces | — | DDR/DDR2 SDRAM controllers with source-synchronous PHY |
| Lead-Free | — | Yes |