EP2SGX60CF780C3 - Stratix II GX FPGA, 60K LE, 780-BGA | Intel
부품 번호: EP2SGX60CF780C3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1280 | $1,280.00 |
| 10 | $1195 | $11,950.00 |
| 100 | $1090 | $109,000.00 |
| 500 | $985 | $492,500.00 |
| 1,000 | $870 | $870,000.00 |
EP2SGX60CF780C3 개요
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic fabric, block RAM, DSP blocks, and I/O serdes are all programmable after manufacture. FPGAs sit alongside microcontrollers and ASICs in the programmable logic hierarchy, but unlike microcontrollers they offer fully parallel data paths and deterministic latency; unlike ASICs they require no mask set and ship in days rather than months. Within the Stratix II GX family, the SGX60 tier adds multi-gigabit transceivers (up to 6.375 Gbps) for protocols such as PCIe, Serial RapidIO, and custom SERDES links.
Key features of the EP2SGX60CF780C3 include 60,440 logic elements, 2,544,192 bits of on-chip RAM (approximately 317 KB), 364 user I/Os, and a 780-ball FineLine BGA package at 29 mm x 29 mm body size with 1 mm ball pitch. The part is offered in the commercial speed grade C3 and supports operating junction temperatures in the commercial range. Stratix II GX devices also embed hard IP for PCI Express x1/x4 and external memory interfaces including DDR2 SDRAM and QDR II SRAM controllers.
The architecture combines 4-input ALMs (Adaptive Logic Modules) replacing the older 4-input LUT, with column-and-row routing using MultiTrack interconnect, and dedicated multiplier blocks, all clocked by up to 12 PLLs. Internal performance supports frequencies up to the device's Fmax rating as published in the datasheet speed-grade tables. The 780-FBGA footprint is shared with other Stratix II GX density points, allowing a single PCB layout to support density migration.
Typical applications include high-speed serial protocol bridging (PCIe, Serial RapidIO, XAUI, SDI video), telecommunications line cards, test and measurement equipment with parallel DSP pipelines, and prototyping for ASIC replacement. The transceivers make this part especially attractive for any system that previously required a separate PHY chip.
When designing with the EP2SGX60CF780C3, ensure adequate power decoupling near every bank and observe the Stratix II GX PowerPlay early-power-estimate flow before layout commit. Because the Stratix II GX family has been superseded by Stratix IV/V and the Intel Cyclone 10/Agilex families for new designs, this part is most commonly sourced for legacy maintenance and long-lifecycle programs.
This page synthesizes distributor pricing, verified drop-in alternatives (same 780-FBGA footprint, same SGX60 die where applicable), and practical PCB/thermal design notes that go beyond the manufacturer datasheet's electrical tables.
드롭인 대체품: EP2SGX60CF780C3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX60CF780C3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Internal Frequency (max), Operating Temperature, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX60CF780C3N
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →EP2SGX60CF780C
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →EP2SGX60CF780C4
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$171 / 개
데이터시트 보기 →EP2SGX60CF780C5
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$162 / 개
데이터시트 보기 →EP2SGX60CF780C3 최대 정격 & 전기적 특성
| Family | Stratix II GX |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 60,440 |
| Logic Array Blocks (LABs) | 3,022 |
| On-chip RAM Bits | 2,544,192 (~317 KB) |
| User I/Os | 364 |
| Transceivers | Up to 12 multi-gigabit transceivers (per family datasheet) |
| Transceiver Data Rate (max) | 6.375 Gbps (per Stratix II GX family datasheet) |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS, SRAM-based |
| Speed Grade | C3 (commercial) |
| 패키지 | 780-ball FineLine BGA (FBGA-780), 29 mm x 29 mm, 1.0 mm pitch |
| 동작 온도 | Commercial (0C to +85C junction) |
| 실장 유형 | Surface Mount (BGA) |
EP2SGX60CF780C3 780-ball fineline bga (fbga-780), 29 mm x 29 mm, 1.0 mm pitch 핀 구성 가이드
EP2SGX60CF780C3(780-ball fineline bga (fbga-780), 29 mm x 29 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX60CF780C3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX60CF780C3 적합 용도: 6 애플리케이션s: PCIe Gen1/Gen2 Endpoint Card, Serial RapidIO Switch Fabric, Telecom Line Card with QDR-II Memory Controller, Test & Measurement Parallel DSP Front-End, HD-SDI / SDI Video Processing, ASIC Prototyping Platform.
PCIe Gen1/Gen2 Endpoint Card
The EP2SGX60CF780C3 fits PCIe Gen1/Gen2 endpoint designs because its Stratix II GX transceivers natively support 2.5 Gbps and 5.0 Gbps PCIe signaling, and the device includes hard PCIe IP blocks per the Stratix II GX handbook. With 60,440 logic elements and 2,544,192 RAM bits, the fabric comfortably absorbs a x4 PCIe endpoint plus DMA engine, scatter-gather logic, and protocol stack in a single chip. The 780-FBGA footprint gives 364 user I/Os for downstream local-bus or memory-mapped side channels. Place 100 nF and 10 uF decoupling on every VCCINT and VCCA ball pair, and route the refclk with controlled impedance per the PCIe CEM specification.
추천
Serial RapidIO Switch Fabric
The EP2SGX60CF780C3 suits Serial RapidIO (SRIO) switch and endpoint designs thanks to its multi-gigabit transceivers that support the SRIO 1x/4x physical layer at 1.25 Gbps, 2.5 Gbps, and 3.125 Gbps data rates per the Stratix II GX transceiver user guide. The 60K-logic-element fabric and 317 KB of block RAM provide the buffer and routing table resources needed for an 8-port SRIO switch without external memory. Designers can use the hard PCIe/SRIO IP cores in Quartus II to shorten time-to-prototype. The 780-FBGA package's 364 user I/Os leave headroom for parallel Fabric Interface ports to a host CPU.
추천
Telecom Line Card with QDR-II Memory Controller
The EP2SGX60CF780C3 is well matched to telecom line cards because its hard QDR II / DDR2 memory controllers and 60K-logic-element fabric can wire-terminate multiple OC-48/STM-16 channels while feeding packet-processing pipelines. Stratix II GX transceivers run the backplane SERDES at rates up to 6.375 Gbps per the family datasheet, supporting 10 GbE XAUI or custom backplane links. The 780-FBGA 1.0 mm pitch footprint allows dense board placement under BGA heatsinks. Use Stratix II GX PowerPlay early-power-estimate before layout commit to size the core and PLL rails correctly.
추천
Test & Measurement Parallel DSP Front-End
The EP2SGX60CF780C3 serves test-and-measurement front-ends because the 60K logic elements combined with dedicated multiplier blocks deliver parallel DSP throughput for FFT, FIR, and correlation pipelines that exceed microcontroller or DSP-processor alternatives. Stratix II GX transceivers stream digitized ADC samples into the FPGA at multi-gigabit rates while the 780-FBGA's 364 user I/Os fan out parallel LVDS channels to display, trigger, or auxiliary converter paths. The 2,544,192-bit on-chip RAM holds window tables and FFT twiddle factors without external memory contention. PowerDesigner-style power analysis is recommended because many T&M designs run at high duty cycle.
추천
HD-SDI / SDI Video Processing
The EP2SGX60CF780C3 handles HD-SDI and 3G-SDI video processing because Stratix II GX transceivers directly accept SMPTE 259M, 292M, and 424M serial data rates, and the fabric implements timing, de-embedding, and ancillary data parsing. The 60,440 logic elements and 364 user I/Os let a single FPGA drive multiple SDI inputs and outputs alongside parallel video buses for downstream conversion. The 780-FBGA package supports BGA-attached heatsinks for fanless broadcast chassis. Quartus II's SDI IP cores are bit-accurate and shorten bring-up for SMPTE 425M designs.
추천
ASIC Prototyping Platform
The EP2SGX60CF780C3 is widely deployed as an ASIC prototyping vehicle because 60K logic elements can map a meaningful slice of an ASIC RTL while the Stratix II GX transceivers stand in for the ASIC's SERDES macros at near-real-world data rates. The 780-FBGA 1.0 mm-pitch package combined with 364 user I/Os gives the prototype board enough break-out for ASIC test-bench stimulus. Multi-FPGA partitioning flows exist for designs that exceed 60K logic elements. The shared 780-FBGA footprint lets teams prototype on SGX60 and migrate to the SGX130 (EP2S130F1508C3) on a different board without re-targeting RTL.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX60CF780C3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX60CF780C3N | EP2SGX60CF780C | EP2SGX60CF780C4 | EP2SGX60CF780C5 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-FBGA (FineLine BGA, 29x29 mm, 1.0 mm pitch) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Speed Grade | C3 (commercial, fastest) | C3 | C (base) | C4 | C5 (slowest) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| User I/Os | 364 | 364 | 364 | 364 | 364 |
| On-chip RAM | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits |
| Process / Die | 90 nm CMOS, SGX60 die | 90 nm CMOS, SGX60 die - same | 90 nm CMOS, SGX60 die - same | 90 nm CMOS, SGX60 die - same | 90 nm CMOS, SGX60 die - same |
주요 차별점
- Pin-compatible lead-free variant preserves PCB layout while satisfying RoHS programs (vs EP2SGX60CF780C3N)
- C3 is the fastest speed grade in the SGX60 780-FBGA family (vs EP2SGX60CF780C5)
- 60,440 logic elements is mid-density within Stratix II GX (vs EP2SGX90F780C3)
설계 노트
Estimated: at typical Stratix II GX utilization (60-70% logic, moderate transceiver activity) the EP2SGX60CF780C3 draws roughly 6-10 W on VCCINT alone. Designers should use the Quartus II PowerPlay early-power-estimate flow before layout commit and provision at least 6 power planes (VCCINT, VCCA_PLL, VCCA_TX, VCCIO for each I/O bank group). Decoupling: 100 nF X7R on every VCCINT/VCCA pin pair and a single 10 uF bulk per rail, per the Stratix II GX device handbook.
The 780-FBGA package relies on BGA-attached heatsink or a top-side spreader for thermal relief because the package is bottom-terminated only. At the typical 8 W dissipation, a 1.0 mm pitch BGA plus thermal vias (4-6 vias per BGA pad in a 0.5 mm grid) under the die shadow is sufficient to keep theta_JA below 15 C/W with forced air. Without airflow, junction temperature can exceed the commercial 85 C limit on heavy transceiver workloads.
Route all Stratix II GX transceiver channels with controlled differential impedance of 100 ohm +/- 10% using a tight coupled microstrip or stripline geometry; trace length matching must hold within the tolerance specified in the transceiver user guide (typically within 150 mil for 3.125 Gbps). Reference planes must be unbroken beneath the transceiver ball rows, and AC-coupling capacitors (typically 100 nF X7R 0402) belong between the FPGA and the connector. Provide a 25 MHz or 125 MHz reference clock with jitter below the value tabulated in the device handbook.
Do not power up the EP2SGX60CF780C3 with VCCINT present but VCCA missing - latch-up is possible because the transceivers and PLLs are on a separate analog rail. Configuration mode (AS, PS, JTAG) must be selected via MSEL pins before power-on, not strapping during operation. Older Quartus II versions (< 9.1 SP2) generate incorrect pinout for SGX60; use a recent service pack to avoid bitstream failures on first bring-up.
규정 준수 정보
RoHS and lead-free status for the EP2SGX60CF780C3 was not present in the verified web data as of 2026-09-09 and is marked [DATA_NEEDED]; the N-suffix variant EP2SGX60CF780C3N is typically the lead-free option. AEC-Q100 is not applicable - this is a commercial FPGA. Conflict-minerals and halogen-free status also not present in the verified data.
