EP2SGX60EF1152I4 vs EP2SGX60EF1152I3 비교
다음의 상세 나란히 비교: EP2SGX60EF1152I4 제조: Intel 및 EP2SGX60EF1152I3 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
EP2SGX60EF1152I3 - 60K LEs Stratix II GX FPGA, 1152-BGA, Industrial | Intel
EP2SGX60EF1152I3 Obsolete사양 비교
| 파라미터 | EP2SGX60EF1152I4 | EP2SGX60EF1152I3 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1,395.00 | $365.00 |
| Device Family | Stratix II GX | — |
| Logic Elements | 60,440 | — |
| Logic Cells | 60,440 | — |
| Logic Array Blocks (LABs) | 3,022 | — |
| Embedded Memory | 2,544,192 bits | — |
| User I/O Pins | 534 | — |
| Maximum Internal Frequency | 717 MHz (per data source) | 717 MHz |
| Maximum Operating Frequency | 732.1 MHz (per data source) | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| 패키지 | 1152-ball FC-FBGA (flip-chip fine-pitch BGA) | 1152-ball FBGA, 35 mm x 35 mm, 1 mm pitch |
| Package Dimensions | 23 x 23 mm, 1 mm pitch (per data source) | — |
| Temperature Grade | Industrial | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: not in retrieved snippets] |
| Family | — | Stratix II GX |
| Series | — | EP2SGX60 |
| Logic Elements (LEs) | — | 60,440 |
| Adaptive Logic Modules (ALMs) | — | 30,220 (estimated from LEs) |
| Equivalent Logic Cells (CLBs) | — | 60,440 |
| Embedded Memory (Bits) | — | 2,544,192 bits (per DigiKey listing for the I4N variant) |
| Combinational Delay (per CLB) | — | 2.99 ns |
| Multi-Gigabit Transceivers | — | [DATA_NEEDED: exact count for EP2SGX60] |
| Maximum Transceiver Data Rate | — | 6.375 Gbps (per Stratix II GX family spec) |
| Total RAM Bits | — | 2,544,192 bits |
| Pin/Ball Count | — | 1152 |
| 동작 온도 | — | -40C to +100C (Industrial, I3 speed grade) |
| Speed Grade | — | I3 (Industrial) |
| Configuration Mode | — | Enhanced (EPC) - fast parallel via external memory |