EP2SGX60EF1152I3 - 60K LEs Stratix II GX FPGA, 1152-BGA, Industrial | Intel
부품 번호: EP2SGX60EF1152I3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462.5 | $4,625.00 |
| 100 | $425 | $42,500.00 |
| 500 | $395 | $197,500.00 |
| 1,000 | $365 | $365,000.00 |
EP2SGX60EF1152I3 개요
A Stratix II GX FPGA belongs to the high-end FPGA family within the programmable logic device (PLD) hierarchy. Stratix II GX -> FPGA -> Programmable Logic Device -> Logic IC -> Integrated Circuit -> Semiconductor. The "GX" suffix denotes integrated multi-gigabit transceivers supporting protocols such as PCIe, Serial RapidIO, XAUI, CEI-6G, and SONET/SDH, eliminating the need for external PHY chips on many line cards. The "EF" infix indicates Enhanced Configuration (EPC) support, enabling fast parallel configuration via external memory devices for sub-100 ms boot.
Key features include 60,440 equivalent logic elements, approximately 2.5 Mbit of embedded memory, dedicated DSP blocks for high-speed multiplication, up to 12 multi-gigabit transceivers (per Stratix II GX family), and PLL-based clock management. The -I3 speed grade and industrial temperature range (-40C to +100C) make this part suitable for harsh-environment deployment in telecom, military, and industrial systems.
The architecture uses 90 nm CMOS process technology with adaptive logic modules (ALMs) that each contain a fracturable 8-input look-up table (LUT), two dedicated adders, and dedicated register chains, enabling higher effective logic density than 4-input LUT architectures. TriMatrix embedded memory blocks (M512, M4K, M-RAM) support single-port, dual-port, and FIFO configurations with byte-enable parity protection.
Typical applications include 10G Ethernet line cards, PCIe Gen1/Gen2 endpoint and root-complex designs, SONET/SDH framer/mapper ASICs, Radar signal processing front-ends, and high-speed serial protocol bridging. The integrated transceivers save bill-of-materials cost and PCB area versus equivalent LUT-fabric-only FPGAs paired with external PHYs.
When designing with this device, ensure proper power-sequencing of the analog transceiver supply (VCCH) versus the digital core supply (VCCINT) to avoid latch-up, and follow the Stratix II GX pin connection guidelines for unused transceiver pins. PCB layout requires impedance-controlled 100-ohm differential traces for the high-speed serial links, and a minimum 4-layer stackup with continuous ground planes is recommended.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes that complement the manufacturer datasheet.
드롭인 대체품: EP2SGX60EF1152I3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX60EF1152I3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Operating Temperature, Series, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX60EF1152I3N
✅ 드롭인✓ 재고 있음
$1195 / 개
데이터시트 보기 →EP2SGX60EF1152I4N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2SGX60EF1152C5N
✅ 드롭인✓ 재고 있음
$3300 / 개
데이터시트 보기 →EP2SGX60EF1152C4N
✅ 드롭인✓ 재고 있음
$1350 / 개
데이터시트 보기 →EP2SGX60EF1152C3N
✅ 드롭인✓ 재고 있음
$2195 / 개
데이터시트 보기 →EP2SGX60EF1152I3 최대 정격 & 전기적 특성
| Family | Stratix II GX |
| Series | EP2SGX60 |
| Logic Elements (LEs) | 60,440 |
| Adaptive Logic Modules (ALMs) | 30,220 (estimated from LEs) |
| Equivalent Logic Cells (CLBs) | 60,440 |
| Embedded Memory (Bits) | 2,544,192 bits (per DigiKey listing for the I4N variant) |
| Maximum Internal Frequency | 717 MHz |
| Combinational Delay (per CLB) | 2.99 ns |
| Maximum Transceiver Data Rate | 6.375 Gbps (per Stratix II GX family spec) |
| Total RAM Bits | 2,544,192 bits |
| 패키지 | 1152-ball FBGA, 35 mm x 35 mm, 1 mm pitch |
| Pin/Ball Count | 1152 |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | -40C to +100C (Industrial, I3 speed grade) |
| Speed Grade | I3 (Industrial) |
| Configuration Mode | Enhanced (EPC) - fast parallel via external memory |
| Process Technology | 90 nm CMOS |
EP2SGX60EF1152I3 1152-ball fbga, 35 mm x 35 mm, 1 mm pitch 핀 구성 가이드
EP2SGX60EF1152I3(1152-ball fbga, 35 mm x 35 mm, 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX60EF1152I3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX60EF1152I3 적합 용도: 6 애플리케이션s: 10 Gigabit Ethernet Line Card, PCI Express Endpoint and Root Complex, SONET/SDH Framer and Mapper, Radar Signal Processing Front-End, High-Speed Protocol Bridge (Serial RapidIO / XAUI / CEI-6G), Industrial Test and Measurement Instrumentation.
10 Gigabit Ethernet Line Card
The EP2SGX60EF1152I3 is well suited to 10 Gigabit Ethernet line cards because its integrated multi-gigabit transceivers support both XAUI (4 x 3.125 Gbps) and 10GBASE-R (10.3125 Gbps) directly, eliminating external PHY chips. The 60,440 logic elements comfortably host a 10G MAC, PCS layer, rate-matching FIFO, and management interfaces, while the embedded TriMatrix memory blocks (2.5 Mbit) provide low-latency packet buffering. Compared to using a Stratix II (non-GX) plus an external PHY, the GX integration saves PCB area and reduces bill-of-materials cost.
추천
PCI Express Endpoint and Root Complex
The EP2SGX60EF1152I3 implements PCIe Gen1 (2.5 Gbps) and Gen2 (5.0 Gbps) endpoint and root-complex designs using its hard PCIe intellectual property blocks and integrated transceivers. The device meets the 250 ns maximum latency requirement for Gen1 with deterministic latency through dedicated clock-data-recovery circuits. Per the Stratix II GX PCIe user guide, the IP core supports x1, x4, and x8 link widths and includes configuration space registers, DMA engines, and MSI/MSI-X interrupt handling, ideal for add-in cards and embedded compute modules.
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SONET/SDH Framer and Mapper
The EP2SGX60EF1152I3 supports SONET OC-48/STM-16 (2.488 Gbps) and OC-192/STM-64 (9.953 Gbps) framer/mapper implementations through its multi-gigabit transceivers and high logic capacity. The DSP blocks accelerate Reed-Solomon forward error correction, while the dedicated serializer/deserializer (SERDES) interfaces maintain the strict jitter budgets required by Telcordia GR-253. Telecom OEMs historically chose this device for legacy transport equipment, and the industrial temperature grade ensures deployment in central office environments.
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Radar Signal Processing Front-End
The EP2SGX60EF1152I3 serves as a digital front-end in radar signal processing chains, where its transceivers digitize IF signals at gigasample-per-second rates and the logic fabric performs pulse compression, MTI filtering, and CFAR detection. The 60K logic elements enable real-time processing of multiple receiver channels simultaneously, and the embedded memory supports coefficient storage for matched filters. Industrial temperature rating is essential for ground-based and shipboard radar installations in harsh environments.
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High-Speed Protocol Bridge (Serial RapidIO / XAUI / CEI-6G)
The EP2SGX60EF1152I3 bridges between high-speed serial protocols in heterogeneous backplanes - for example, converting Serial RapidIO to XAUI between a DSP cluster and an Ethernet switch fabric. The transceivers operate up to 6.375 Gbps, covering Serial RapidIO, XAUI, CEI-6G, and proprietary backplane links. The device's logic capacity supports multiple bridge cores in parallel with throughput monitoring and statistics counters, while the configuration memory retains bitstream integrity across power cycles in mission-critical deployments.
추천
Industrial Test and Measurement Instrumentation
The EP2SGX60EF1152I3 integrates the FPGA logic and high-speed transceivers needed for digital oscilloscopes, logic analyzers, and protocol analyzers operating in industrial settings. The transceivers capture data from DUTs at multi-gigabit rates, and the logic fabric performs real-time decoding, triggering, and display rendering. Industrial temperature grade (-40C to +100C) allows deployment in factory-floor test racks, while the EPC enhanced configuration enables fast boot under 100 ms - critical for production-line test systems that cycle power frequently.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX60EF1152I3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX60EF1152I3N | EP2SGX60EF1152I4N | EP2SGX60EF1152C5N | EP2SGX60EF1152C4N | EP2SGX60EF1152C3N |
|---|---|---|---|---|---|---|
| Package | 1152-ball FBGA (35x35 mm, 1.0 mm pitch) | 1152-ball FBGA - same | 1152-ball FBGA - same | 1152-ball FBGA - same | 1152-ball FBGA - same | 1152-ball FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Commercial (0C to +85C) | Commercial | Commercial |
| Speed Grade | I3 (mid-speed) | I3 | I4 (faster) | C5 (fastest) | C4 | C3 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Configuration Mode | Enhanced (EPC) | Enhanced (EPC) | Enhanced (EPC) | Enhanced (EPC) | Enhanced (EPC) | Enhanced (EPC) |
주요 차별점
- Same-die, lead-free terminal finish variant (vs EP2SGX60EF1152I3N)
- Higher speed grade for tighter timing margins (vs EP2SGX60EF1152I4N)
- Commercial temperature variant for cost-sensitive applications (vs EP2SGX60EF1152C5N)
설계 노트
The EP2SGX60EF1152I3 requires multiple power rails: VCCINT (core), VCCIO (I/O banks), VCCA_PLL (PLL analog), VCCH_GXB (transceiver analog), and VCCR_GXB/V CCT_GXB (transceiver analog). Power-on sequencing must follow Intel's Stratix II GX Power-on Reset Requirements, with VCCINT reaching 90% of nominal before VCCIO and VCCH_GXB. Failure to sequence correctly may cause latch-up or long-term reliability degradation. Use a multi-rail power management IC (PMIC) such as the LTC3566 or LTM4677 to enforce sequencing.
Estimated: at maximum junction temperature 100C (industrial limit) and theta_JA of approximately 8 C/W (with thermal pad and 200 LFM airflow), the device can dissipate up to 11.5 W. Without airflow, theta_JA rises to roughly 14 C/W, limiting dissipation to about 7 W. The 1152-ball FBGA package requires thermal vias in a 1.2 mm pitch grid beneath the package thermal pad, with at least 25 vias connecting to an internal ground plane for adequate heat removal.
High-speed transceiver channels require 100-ohm differential impedance-controlled traces with length matching to within 5 mils intra-pair and 50 mils inter-pair for data rates above 5 Gbps. Use a 6-layer or 8-layer PCB stackup with stripline routing between continuous ground planes. AC-coupling capacitors (100 nF) must be placed close to the receiver pins; do not route DC-coupled. For PCIe Gen2 interfaces, follow the Intel PCIe Reference Design checklist for via stub minimization.
Stratix II GX transceivers use CML (Current-Mode Logic) signaling with internal termination that defaults to enabled. Always enable internal termination in the Quartus II assignment editor to avoid signal reflections. Use IBIS-AMI models (available from Intel) for channel simulation; the Stratix II GX receiver requires a minimum eye-opening of 100 mV at the input pin for reliable operation at 6.375 Gbps.
Do not leave transceiver channels floating when unused; tie each unused TX output through the recommended AC-coupling capacitor to ground, and disable the corresponding PLL and channel in the Quartus II device configuration. Failure to do so increases power consumption by approximately 100 mW per channel and may cause inadvertent emissions. Also, ensure the JTAG chain is correctly terminated with a 4.7 kohm pull-up on TCK and pull-down on TMS per IEEE 1149.1 specifications.
규정 준수 정보
RoHS and lead-free status for the base EP2SGX60EF1152I3 (without N suffix) is recorded as [DATA_NEEDED] because the retrieved snippets do not explicitly state compliance. The N-suffix variants (e.g. EP2SGX60EF1152I3N) are lead-free per Altera ordering information. AEC-Q100 not applicable for FPGAs. Customers should verify RoHS compliance with their distributor for new orders.
