EP2SGX90EF1152C3N vs EP2SGX90EF1152C5ES 비교
다음의 상세 나란히 비교: EP2SGX90EF1152C3N 제조: Intel 및 EP2SGX90EF1152C5ES 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
EP2SGX90EF1152C5ES - Stratix II GX FPGA, 90K LEs, 1152-FBGA | Intel
EP2SGX90EF1152C5ES Obsolete사양 비교
| 파라미터 | EP2SGX90EF1152C3N | EP2SGX90EF1152C5ES |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1,280.00 | $1,495.00 |
| Series | Stratix II GX | — |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LE) | 90960 | — |
| Number of LABs/CLBs | 4548 | — |
| Total Memory Bits | 4520448 | — |
| User I/Os | 558 | 558 |
| Number of Transceivers | [DATA_NEEDED: transceiver count per family] | 12 (up to 20 channels) |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Voltage | 1.2 V | 1.2 V (typical) |
| Operating Frequency (max) | 816.9 MHz | — |
| 동작 온도 | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch BGA) | — |
| Package Pin Count | 1152 balls | — |
| Package Dimensions | 34 mm x 34 mm | — |
| 실장 유형 | Surface Mount | — |
| Lead-Free / RoHS | Yes (RoHS compliant) | — |
| Speed Grade | EF | C5 (commercial, mid-tier) |
| Temperature Grade | C3 (Commercial) | — |
| Logic Elements | — | 90,960 |
| Embedded Memory (bits) | — | 4,520,448 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| DSP Blocks (18x18 multipliers) | — | 384 |
| 패키지 | — | 1152-FBGA (FineLine BGA) |
| Configuration Method | — | Fast passive parallel, active serial, JTAG |
| RoHS 상태 | — | Compliant |
| Lead-Free | — | Yes |