EP3SE260F1152C3N vs EP3SE260F1152C4 비교
다음의 상세 나란히 비교: EP3SE260F1152C3N 제조: Intel 및 EP3SE260F1152C4 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ 활성
사양 비교
| 파라미터 | EP3SE260F1152C3N | EP3SE260F1152C4 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | NRND |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $7,500.00 | $8,900.00 |
| Series | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements / Cells | 255,000 | — |
| Embedded Memory Bits | 16,672,768 bits | 16,672,768 |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| User I/O Count | 744 | 744 |
| 패키지 | 1152-BBGA, FCBGA | 1152-pin FC-FBGA (Flip-Chip Fine-pitch BGA) |
| 실장 유형 | Surface Mount | Surface Mount (BGA) |
| Process Technology | 65 nm | 65 nm CMOS (TSMC) |
| Core Voltage | 1.1 V | 1.1 V |
| 동작 온도 | 0 C to +85 C (Commercial) | Commercial (0C to +85C) - inferred from speed grade C4 |
| Transceivers | Integrated high-speed transceivers | External PHY interface only (no integrated GXB) |
| DSP Blocks | Yes (dedicated multiplier/accumulator) | — |
| Embedded Memory Type | TriMatrix (true dual-port, FIFO, ROM, RAM) | — |
| External Memory Support | DDR3, DDR2, QDR II+, RLDRAM II | — |
| Configuration Modes | AS, AP, PS, FPP, JTAG | Passive Serial, Fast Passive Parallel, JTAG |
| Partial Reconfiguration | Supported | — |
| Programmable Power Technology | Yes (up to 50% dynamic power reduction) | — |
| RoHS 상태 | Compliant | Compliant (per distributor listings) |
| Family | — | Stratix III |
| Logic Elements (LE) | — | 255,000 |
| Speed Grade | — | C4 (slowest commercial grade) |
| Maximum Internal Frequency | — | ~450 MHz (per FPGAkey listing) |
| Package Code | — | BGA, square |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| DSP Blocks (18x18 Multipliers) | — | 384 |
| PLL Count | — | [DATA_NEEDED: PLL count] |