EP3SE260F1152C4N vs EP3SE260F1152C3N 비교

다음의 상세 나란히 비교: EP3SE260F1152C4N 제조: Intel 및 EP3SE260F1152C3N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

사양 비교

파라미터 EP3SE260F1152C4N EP3SE260F1152C3N
브랜드 Intel Intel
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 Obsolete 활성
재고 상태 In Stock In Stock
단가 (USD) $1,620.00 $7,500.00
Series Stratix III E Stratix III E
Family Stratix III (Enhanced) —
Logic Elements (LEs) 255,000 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
Maximum User I/Os 744 —
Number of LABs/CLBs 10,200 —
DSP / 18x18 Multipliers 768 embedded multipliers —
Process Technology 65 nm CMOS 65 nm
Core Voltage 1.1 V 1.1 V
Maximum Operating Frequency 450 MHz —
패키지 1152-ball FC-FBGA (flip-chip) 1152-BBGA, FCBGA
Speed Grade -4 (commercial temperature) —
동작 온도 0C to +85C (commercial, 'C' suffix) 0 C to +85 C (Commercial)
실장 유형 Surface Mount (BGA) Surface Mount
Packaging Tray —
Lead-Free / RoHS Lead-free finish (RoHS compliant per distributor listing) —
메모리 유형 SRAM-based, volatile (requires configuration device) —
Configuration External EPCS / enhanced configuration via AS, PS, JTAG, or FPP —
Product Status Obsolete (per Xecor cross-reference data) —
Logic Elements / Cells — 255,000
Embedded Memory Bits — 16,672,768 bits
Logic Array Blocks (LABs) — 10,200
User I/O Count — 744
Transceivers — Integrated high-speed transceivers
DSP Blocks — Yes (dedicated multiplier/accumulator)
Embedded Memory Type — TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support — DDR3, DDR2, QDR II+, RLDRAM II
Configuration Modes — AS, AP, PS, FPP, JTAG
Partial Reconfiguration — Supported
Programmable Power Technology — Yes (up to 50% dynamic power reduction)
RoHS 상태 — Compliant

데이터시트 & 자료

모든 제품 보기 BOM 생성 견적 요청