EP4CGX50CF23C6N - Cyclone IV GX FPGA 50K LE 484-FBGA | Intel
부품 번호: EP4CGX50CF23C6N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $95.2 | $95.20 |
| 10 | $88.45 | $884.50 |
| 100 | $78.1 | $7,810.00 |
| 500 | $70.5 | $35,250.00 |
| 1,000 | $65.8 | $65,800.00 |
EP4CGX50CF23C6N 개요
An FPGA is a reprogrammable logic device whose internal architecture consists of configurable logic blocks (CLBs), routing interconnects, embedded memory blocks, DSP blocks, and I/O cells. In the broader semiconductor taxonomy, FPGAs sit alongside ASICs and CPLDs as programmable logic devices (PLDs), and the Cyclone IV family specifically targets low-power, high-volume applications where designers need hardware flexibility without the NRE cost of an ASIC. The 'GX' suffix denotes the integrated transceivers, while 'CF23' identifies the 484-ball FineLine BGA package and 'C6' the speed grade.
Key features include 3,118 configurable logic blocks (CLBs), 132 embedded 18x18 multipliers, four phase-locked loops (PLLs), 11 global clock networks, and 290 maximum user I/O pins. The device also provides up to eight 3.125 Gbps multi-gigabit transceivers (PCIe, Gbps Ethernet, Serial RapidIO), 2,562,048 bits of embedded RAM (RAM bits), and 56 embedded 9-Kbit M9K memory blocks. Core supply voltage is 1.2 V with separate VCCIO banks for multi-voltage I/O standards.
The Cyclone IV GX architecture combines a low-leakage 60 nm process with hard PCIe and IP-core blocks, allowing designers to implement PCI Express Gen1 endpoints, multi-gigabit serial links, and parallel DSP pipelines simultaneously. The 484-ball FineLine BGA offers a 23 x 23 mm footprint with 1.0 mm ball pitch, suitable for cost-optimized multilayer PCBs with moderate layer counts and standard 4-6 mil via-in-pad escape rules.
Typical applications include industrial machine vision and video bridging (PCIe Gen1, Gbps Ethernet), low-cost video processing (Camera Link, SDI), motor control and factory automation, point-of-sale and kiosk controllers, and embedded serial-interface aggregation. The combination of low static power (Quartus PowerPlay reports sub-1 W typical designs) and integrated transceivers is the main reason Cyclone IV GX remains popular for new designs and legacy Cyclone III migration paths.
When designing with this device, plan I/O bank assignment against VCCIO rail planning early - mixing 1.5 V (DDR3) and 2.5 V (LVDS) banks on the same bank is not allowed. Transceiver reference clocks should use a low-jitter PLL-driven source, and JTAG chain tap-out must follow IEEE 1149.1 (JTAG) and IEEE 1532 in-system programming conventions. For thermal analysis, rely on the Altera/Intel PowerPlay early-power estimator and the device junction-to-ambient thermal resistance.
This page synthesizes distributor pricing, Cyclone IV GX family cross-reference data, and practical design notes not found in the manufacturer datasheet alone - enabling faster part selection, sourcing, and PCB-level design decisions.
드롭인 대체품: EP4CGX50CF23C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX50CF23C6N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Transceivers, Speed Grade, Operating Temperature, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CGX50CF23C8N
✅ 드롭인✓ 재고 있음
$56.5 / 개
데이터시트 보기 →EP4CGX50CF23C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$110.5 / 개
데이터시트 보기 →EP4CGX50CF23I7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$121.4 / 개
데이터시트 보기 →EP4CGX50CF23C6
✅ 드롭인✓ 재고 있음
$162.4 / 개
데이터시트 보기 →EP4CGX30CF23C8N
✅ 드롭인✓ 재고 있음
$60.55 / 개
데이터시트 보기 →EP4CGX30CF23C7N
✅ 드롭인✓ 재고 있음
$71.59 / 개
데이터시트 보기 →EP4CGX30CF23C6N
✅ 드롭인✓ 재고 있음
$85.78 / 개
데이터시트 보기 →EP4CGX50CF23C6N 최대 정격 & 전기적 특성
| Series | Cyclone IV GX |
| Device Family | EP4CGX50 |
| Logic Elements (LE) | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 |
| Total Memory Bits | 2,562,048 bits |
| Embedded Memory Blocks (M9K) | 56 |
| Embedded 18x18 Multipliers | 132 |
| Phase-Locked Loops (PLLs) | 4 |
| Global Clock Networks | 11 |
| Maximum User I/O | 290 |
| Transceivers | Up to 8 channels at 3.125 Gbps |
| Core Supply Voltage | 1.2 V |
| Process Technology | 60 nm low-power CMOS |
| 패키지 | 484-ball FineLine BGA (FBGA-484) |
| Package Dimensions | 23 x 23 mm, 1.0 mm pitch |
| 동작 온도 | 0C to +85C (Commercial) |
| Speed Grade | C6 |
| RoHS 상태 | Compliant |
EP4CGX50CF23C6N 핀 구성
| 핀 A1 | IO — General-purpose user I/O (bank location varies) |
| 핀 B2 | GND — Ground reference |
| 핀 C3 | VCCINT — 1.2 V core supply |
| 핀 D4 | VCCIO — I/O bank supply voltage |
| 핀 E5 | VCCAUX — 2.5 V auxiliary supply for PLL/transceiver |
| 핀 F6 | CLK_IN — Differential clock input pair |
| 핀 G7 | JTAG_TCK — JTAG test clock (IEEE 1149.1) |
| 핀 H8 | JTAG_TMS — JTAG test mode select |
| 핀 J9 | JTAG_TDO — JTAG test data output |
| 핀 K10 | JTAG_TDI — JTAG test data input |
| 핀 L11 | nCONFIG — Configuration active-low reset |
| 핀 M12 | MSEL0 — Configuration mode select bit 0 |
| 핀 N13 | MSEL1 — Configuration mode select bit 1 |
| 핀 P14 | DCLK — Configuration clock input |
| 핀 R15 | DATA0 — Configuration data input bit 0 |
| 핀 T16 | GXB_TX_P — Transmitter differential positive output (lane 0) |
| 핀 U17 | GXB_TX_N — Transmitter differential negative output (lane 0) |
| 핀 V18 | GXB_RX_P — Receiver differential positive input (lane 0) |
| 핀 W19 | GXB_RX_N — Receiver differential negative input (lane 0) |
일반적인 애플리케이션
EP4CGX50CF23C6N 적합 용도: 6 애플리케이션s: Industrial Machine Vision and PCIe Camera Bridging, Motor Control and Factory Automation Controllers, Video Bridging and Display Wall Controllers, Point-of-Sale and Kiosk Embedded Controllers, Embedded Serial Interface Aggregation, Test and Measurement Instrumentation.
Industrial Machine Vision and PCIe Camera Bridging
The EP4CGX50CF23C6N is well suited to industrial machine-vision camera pipelines where a PCIe Gen1 x1 or x4 link aggregates high-speed serial data from a CMOS image sensor. The eight integrated 3.125 Gbps transceivers implement the PCIe endpoint natively without external PHYs, while the 49,888 LEs and 132 18x18 multipliers handle Bayer-to-YUV conversion, gamma correction, and JPEG/MJPEG compression in parallel. Designers typically allocate four transceivers to the PCIe Gen1 link and the remaining four to Gbps Ethernet or Camera Link channels. The 56 M9K memory blocks buffer intermediate image rows, supporting 2-5 MP sensors at 30-60 fps without external SRAM. PowerPlay early-power estimates put typical vision designs at 1.2-1.8 W, well within the FBGA-484 thermal envelope.
추천
Motor Control and Factory Automation Controllers
In factory automation, the EP4CGX50CF23C6N integrates fieldbus interfaces (EtherCAT, PROFINET, EtherNet/IP) on a single chip while running closed-loop servo control in parallel hardware. The four PLLs synthesize the reference clock for each fieldbus independently, and the 290 user I/Os accommodate up to 16 encoder channels, 32 PWM outputs, and 48 digital I/O lines. Logic density of 50K LEs reserves headroom for IEC 61131-3 logic and safety state machines. The C6 speed grade delivers deterministic 20-25 ns logic propagation for 50 kHz current-loop rates. Industrial designers often pair it with a Cyclone IV GX I-grade variant (EP4CGX50CF23I7N) for -40C to +100C deployments on the same FBGA-484 footprint.
추천
Video Bridging and Display Wall Controllers
Video-wall and digital signage controllers use the EP4CGX50CF23C6N to bridge DisplayPort, HDMI (via external HDMI PHY), and SDI inputs to a tiled LVDS or V-by-One output bus. The 56 M9K blocks (504 Kbits) buffer line buffers and frame stores for up to 1080p60 streams, and the 132 18x18 multipliers perform color-space conversion (RGB-to-YCbCr) and edge sharpening in real time. The C6 speed grade supports LVDS at 840 Mbps per pair, sufficient for 1080p across eight lanes. Designers typically combine this part with an external HDMI 1.4 receiver and an FPGA Mezzanine Card (FMC) interface for modular I/O. PowerPlay estimates place typical 1080p display-wall designs at 1.5-2.2 W.
추천
Point-of-Sale and Kiosk Embedded Controllers
POS terminals and self-service kiosks benefit from the EP4CGX50CF23C6N's ability to merge legacy interfaces (RS-232, RS-485, parallel LCD) with modern USB 2.0, Gbps Ethernet, and contactless smart-card peripherals. The 50K LEs host TCP/IP stacks, encryption accelerators (AES-128), and the human-machine interface (HMI) state machine. The eight transceivers provide headroom for two Gbps Ethernet ports (redundant LAN) and PCIe x1 to a host processor. The C6 speed grade keeps the part responsive to interrupt latency under 100 ns, critical for contactless card readers. Commercial 0-85C operation matches indoor kiosk enclosures.
추천
Embedded Serial Interface Aggregation
Telecom and industrial gateways use the EP4CGX50CF23C6N to aggregate multiple serial protocols (PCIe, SRIO, Gbps Ethernet) into a unified backplane interface. The eight 3.125 Gbps transceivers support four full-duplex lanes, while the 50K LEs implement protocol conversion and traffic shaping. The C6 speed grade handles 250 MHz logic for buffering and queue management. Designers typically combine this part with an external SERDES for higher-rate channels and use the FPGA's I/O for lower-speed management interfaces. PowerPlay early-power reports 1.3-1.9 W for aggregation gateway designs.
추천
Test and Measurement Instrumentation
Test-and-measurement instruments (oscilloscopes, logic analyzers, protocol analyzers) use the EP4CGX50CF23C6N to merge sampling front-ends, trigger engines, and a high-speed display interface on a single chip. The 50K LEs accommodate multi-channel trigger state machines, while the embedded transceivers stream digitized samples to a host PC over PCIe Gen1 x4. The 56 M9K blocks form 504 Kbits of acquisition memory, sufficient for 16-channel 200 Msps captures. The C6 speed grade supports pipelined DSP at 250 MHz for on-chip FFT and decimation. Commercial 0-85C operation covers bench instruments; the FBGA-484 package allows compact 4-layer PCB designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CGX50CF23C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CGX50CF23C8N | EP4CGX50CF23I7N | EP4CGX30CF23C6N | EP4CGX30CF23C7N | EP4CGX30CF23C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F23) | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same | 484-ball FBGA (F23) - same |
| Logic Elements | 49,888 | 49,888 | 49,888 | 29,440 (-41%) | 29,440 (-41%) | 29,440 (-41%) |
| Speed Grade | C6 | C8 (slower) | I7 (industrial, slower) | C6 | C7 | C8 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Embedded Memory (bits) | 2,562,048 | 2,562,048 | 2,562,048 | 1,161,216 (-55%) | 1,161,216 (-55%) | 1,161,216 (-55%) |
| Transceivers | Up to 8 channels @ 3.125 Gbps | Up to 8 channels @ 3.125 Gbps | Up to 8 channels @ 3.125 Gbps | Up to 8 channels @ 3.125 Gbps | Up to 8 channels @ 3.125 Gbps | Up to 8 channels @ 3.125 Gbps |
| Maximum User I/O | 290 | 290 | 290 | 290 | 290 | 290 |
주요 차별점
- Highest speed grade in the Cyclone IV GX 50K F23 family (vs EP4CGX50CF23C8N)
- 50K logic elements vs 30K in the lower-density F23 family (vs EP4CGX30CF23C6N)
- Integrated 3.125 Gbps multi-gigabit transceivers (vs Cyclone IV E family (no transceivers))
설계 노트
Estimated: at typical operating conditions (1.2 V core, 25% toggle rate, 50% resource utilization), the EP4CGX50CF23C6N dissipates approximately 1.2-1.8 W. The FBGA-484 package requires a 4-layer PCB with at least 4 thermal vias in the center ball-grid array. Designers should run the Quartus PowerPlay Early Power Estimator before tape-out, and apply additional copper pours or thermal vias when junction-to-ambient exceeds 35 C/W.
Route all eight 3.125 Gbps transceiver lanes with 100 ohm differential impedance and equal-length matching within 150 mil. Place 0.1 uF decoupling capacitors within 100 mil of every VCCINT, VCCAUX, and VCCIO pin. Use a 4-layer stackup with continuous VCC/GND planes to control power integrity. Follow the Cyclone IV GX PCB Design Guidelines for via-in-pad and microvia escape rules on the 1.0 mm-pitch BGA.
Do not mix 1.5 V (DDR3) and 2.5 V (LVDS) I/O standards on the same I/O bank - each bank runs at a single VCCIO voltage. The JTAG chain must include pull-up resistors on TCK, TMS, and TDI per IEEE 1149.1. Use Quartus II Device Programming tools (USB-Blaster or Ethernet-Blaster) to configure the device via JTAG or Active Serial (AS) mode, ensuring MSEL pin straps match the desired configuration scheme.
Plan for power sequencing: VCCINT must reach 1.2 V within 25 ms of VCCAUX 2.5 V ramp-up, and VCCIO banks should ramp after VCCINT to avoid device latch-up. According to the Cyclone IV Device Handbook, the POR (power-on-reset) circuit monitors these rails and holds the device in reset until all supplies are stable. Use a multi-rail PMIC with controlled rise times to avoid inrush current spikes.
규정 준수 정보
RoHS compliant and lead-free per the Altera/Intel product page. AEC-Q100 not applicable for FPGA logic devices; choose industrial-temp variants (I7) for harsh environments.