M1AFS250-FGG256I vs M1AFS250-1FG256I 비교
다음의 상세 나란히 비교: M1AFS250-FGG256I 제조: Microchip Technology 및 M1AFS250-1FG256I 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
M1AFS250-FGG256I - 250K Gate Fusion FPGA 114 I/O | Microchip
M1AFS250-FGG256I ✓ 활성Microchip Technology
M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I ✓ 활성사양 비교
| 파라미터 | M1AFS250-FGG256I | M1AFS250-1FG256I |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $49.50 | $96.50 |
| Series | Fusion (M1AFS) | Fusion (M1 - with ARM Cortex-M1) |
| System Gates | 250K | 250000 gates |
| D Flip-Flops / Registers | 36864 | — |
| User I/O | 114 | — |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 soft core |
| Core Supply Voltage | 1.5 V | 1.5 V (1.425 V to 1.575 V) |
| Fabric Speed Metric | 1.0989 GHz (per distributor listing) | — |
| Process Technology | 130 nm flash-based | — |
| Configuration Memory | On-chip flash (non-volatile) | — |
| 패키지 | 256-LBGA (FGG256) | 256-LBGA (FBGA) |
| Ball Pitch | 1.0 mm | — |
| 실장 유형 | Surface Mount | Surface Mount |
| 동작 온도 | -40C to +85C (Industrial) | -40C to +85C (industrial, suffix I) |
| RoHS 상태 | Compliant | — |
| Packaging | Tray | — |
| D Flip-Flops (DFF) | — | 36864 |
| Total I/O | — | 114 |
| Configuration Type | — | Flash-based (live at power-up) |
| Analog Features | — | Configurable analog blocks, clock generation and management |
| On-chip Memory | — | Flash memory blocks |
| Speed Grade | — | -1 |
| Package Dimensions | — | 17 mm x 17 mm x 1.2 mm height |
| Supplier Device Package | — | 256-LBGA |
| Total RAM | — | [DATA_NEEDED: Total RAM bits] |
| Embedded Block RAM (eSRAM) | — | [DATA_NEEDED: eSRAM size] |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |