M1AFS250-FGG256I - 250K Gate Fusion FPGA 114 I/O | Microchip
부품 번호: M1AFS250-FGG256I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $58.5 | $58.50 |
| 10 | $56.2 | $562.00 |
| 100 | $54.29 | $5,429.00 |
| 500 | $51.8 | $25,900.00 |
| 1,000 | $49.5 | $49,500.00 |
M1AFS250-FGG256I 개요
A field programmable gate array is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that engineers configure in the field after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices - above CPLDs in capacity and below ASICs in density - and the Fusion family uniquely integrates analog mixed-signal functionality, flash-based configuration, and an embedded ARM Cortex-M1 processor on a single die, eliminating the need for external configuration memory in many designs.
Key features of the M1AFS250-FGG256I include flash-based 130 nm fabrication operating from a 1.5 V core supply, embedded ARM Cortex-M1 soft/hard processor support for single-chip embedded control, and non-volatile Flash*Freeze technology for near-zero-power static retention. The Fusion fabric combines look-up-table logic with dedicated analog conditioning blocks, ADC inputs, and RTC support, making it distinctive among 250K-gate-class FPGAs.
Technically, the device is specified at a fabric frequency of approximately 1.0989 GHz per third-party listings (a characterized fabric speed metric) with 36,864 registers and 114 flexible I/O supporting multiple single-ended and differential standards. The 256-ball LBGA package measures with a 1.0 mm ball pitch for board assembly with standard SMT processes.
Typical applications include industrial automation control, embedded motor and power supervision, portable instrumentation, and mixed-signal system controllers where analog monitoring, soft-core processing, and configurable logic must coexist on one chip.
Design consideration: flash-based Fusion devices retain configuration in non-volatile memory, so bitstream security and Flash*Freeze entry/exit timing should be planned early in the design cycle.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design guidance not found in the manufacturer datasheet, with pricing as of 2026-09-02.
드롭인 대체품: M1AFS250-FGG256I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M1AFS250-FGG256I (동일 폼 팩터 및 풋프린트) — 차이점: System Gates, RoHS Status, Configuration Memory, Family, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M1AFS250-FGG256
✅ 드롭인✓ 재고 있음
$88 / 개
데이터시트 보기 →M1AFS250-2FGG256I
✅ 드롭인✓ 재고 있음
$83.12 / 개
데이터시트 보기 →M1AFS250-2FGG256
✅ 드롭인✓ 재고 있음
$83.12 / 개
데이터시트 보기 →M1AFS250-FG256
✅ 드롭인✓ 재고 있음
$112 / 개
데이터시트 보기 →AFS250-FGG256I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
M1AFS250-FGG256I 최대 정격 & 전기적 특성
| Series | Fusion (M1AFS) |
| System Gates | 250K |
| D Flip-Flops / Registers | 36864 |
| User I/O | 114 |
| Embedded Processor | ARM Cortex-M1 |
| Core Supply Voltage | 1.5 V |
| Fabric Speed Metric | 1.0989 GHz (per distributor listing) |
| Process Technology | 130 nm flash-based |
| Configuration Memory | On-chip flash (non-volatile) |
| 패키지 | 256-LBGA (FGG256) |
| Ball Pitch | 1.0 mm |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (Industrial) |
| RoHS 상태 | Compliant |
| Packaging | Tray |
M1AFS250-FGG256I 256-lbga (fgg256) 핀 구성 가이드
M1AFS250-FGG256I(256-lbga (fgg256) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M1AFS250-FGG256I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M1AFS250-FGG256I 적합 용도: 6 애플리케이션s: Industrial Automation Control, Embedded System Controllers, Portable and Battery-Powered Instrumentation, Motor and Power Supervision, Mixed-Signal Data Acquisition, Medical and Diagnostic Equipment.
Industrial Automation Control
The M1AFS250-FGG256I fits industrial automation controllers that must combine digital sequencing, sensor monitoring, and communication in one device. Its 250K system gates and 36,864 registers implement state machines, PWM generators, and interface bridges, while 114 user I/Os connect sensors, actuators, and field buses at -40C to +85C industrial temperatures. The embedded ARM Cortex-M1 processor runs control loops or protocol stacks directly in the fabric, and the Fusion analog subsystem conditions voltage, current, and temperature monitoring channels on-chip via built-in ADC inputs. Because configuration is flash-based and non-volatile, the controller boots instantly with no external configuration device, improving system reliability in electrically noisy factory environments where power glitches and reconfiguration latency are unacceptable.
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Embedded System Controllers
Single-chip embedded controllers benefit directly from the M1AFS250-FGG256I's integration of the ARM Cortex-M1 processor with 250K gates of configurable logic. Applications such as equipment supervisors, protocol translators, and test-fixture controllers can replace a discrete MCU plus FPGA pair with one 256-ball BGA device, cutting BOM count and board area. The 1.5 V core keeps dynamic power low, and Flash*Freeze mode statically retains state at near-zero power - valuable in battery-backed or thermally constrained enclosures. The 114 I/Os support multiple single-ended and differential standards for connecting peripherals, while the on-chip flash configuration eliminates boot PROMs. Microchip's Libero SoC toolchain supports soft-core development, making firmware and HDL co-design on the same die straightforward for embedded teams.
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Portable and Battery-Powered Instrumentation
Handheld and portable instrumentation gains from the M1AFS250-FGG256I's near-zero static power in Flash*Freeze mode and its flash-based instant-on operation. Handheld meters, environmental monitors, and field-test instruments need logic that wakes instantly, retains configuration without a boot sequence, and sips power between measurements - the Fusion architecture addresses all three with non-volatile flash fabric and Flash*Freeze state retention. The 256-ball BGA with 1.0 mm pitch allows compact two-sided board layouts in handheld enclosures, and the industrial temperature rating covers outdoor field use. On-chip analog conditioning channels digitize battery voltage and sensor signals directly, removing an external ADC in cost-sensitive portable designs, while the ARM Cortex-M1 handles user interface and communication firmware in the same device.
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Motor and Power Supervision
Motor drive and power-supervision subsystems exploit the Fusion family's defining differentiator: integrated analog conditioning blocks that monitor voltage, current, and temperature alongside reconfigurable control logic. The M1AFS250-FGG256I's on-chip ADC inputs and analog multiplexers digitize phase currents and bus voltages, while the 250K-gate fabric implements PWM generation, dead-time insertion, fault latching, and safety interlocks with deterministic timing that pure MCU software cannot match. The ARM Cortex-M1 supervises higher-level speed/torque loops and communications. Flash configuration means safety logic is active from power-up without configuration delay - a meaningful advantage in motor systems where uncontrolled I/O during boot can damage drivers. Industrial -40C to +85C rating suits factory floor and traction-adjacent environments.
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Mixed-Signal Data Acquisition
Compact data-acquisition front ends use the M1AFS250-FGG256I to merge analog capture and digital processing in one package. The Fusion analog subsystem provides programmable-gain conditioning and ADC channels for slow-to-moderate-speed signals such as temperature, strain, and process variables, while the 36,864-register fabric performs filtering, threshold detection, and trigger generation in hardware with microsecond latency. Acquired data streams over 114 I/Os to memory or hosts, with the ARM Cortex-M1 formatting results and managing interfaces. Non-volatile flash configuration ensures the acquisition logic is functional the moment power appears - important for event recorders and black-box loggers that must capture power-up transients. The 256-ball BGA's 1.0 mm pitch supports dense multichannel layouts on standard SMT assembly lines.
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Medical and Diagnostic Equipment
Benchtop medical and diagnostic devices - analyzers, infusion controllers, and monitoring instruments - value the M1AFS250-FGG256I's combination of deterministic logic, analog monitoring, and processor integration. Safety-critical interlocks and actuator control belong in the 250K-gate fabric where timing is guaranteed, while the on-chip analog subsystem continuously supervises supply rails and patient-adjacent sensor channels for fault conditions. The ARM Cortex-M1 runs application firmware, UI, and communication protocols, consolidating the control architecture. Flash-based configuration protects against bitstream tampering better than SRAM FPGAs whose bitstreams load from external memory, supporting design security requirements. Industrial temperature margin and RoHS compliance ease compliance workflows for globally deployed clinical equipment built around the 256-ball FGG256 footprint.
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추천 제품 요약
엔지니어링 참조 데이터: M1AFS250-FGG256I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M1AFS250-FGG256 | M1AFS250-2FGG256I | M1AFS250-2FGG256 | AFS250-FGG256I |
|---|---|---|---|---|---|
| Package | 256-LBGA (FGG256) | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology (Microsemi legacy) |
| System Gates | 250K | 250K | 250K | 250K | 250K |
| User I/O | 114 | 114 | 114 | 114 | 114 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) |
| Speed Grade | Base | Base | 2 (faster) | 2 (faster) | Base |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- Integrated mixed-signal analog subsystem (vs A3P600-FG256 (ProASIC3))
- Embedded ARM Cortex-M1 support (vs Lattice MachXO2 (redesign alternative))
- Non-volatile flash configuration (vs SRAM-based Xilinx/Altera FPGAs)
설계 노트
The M1AFS250-FGG256I uses a 1.5 V core supply with separate I/O bank rails (2.5 V/3.3 V per bank configuration per the Fusion datasheet). Estimated: Fusion 250K-gate flash FPGAs draw low static power because configuration is non-volatile; dynamic power scales with fabric clock frequency and toggling rate. Budget rails with 20-30% margin and use Flash*Freeze mode to cut static consumption during idle periods in battery-sensitive designs. Verify power with Microchip's Libero power calculator using your actual design utilization.
The 256-ball FGG256 package uses a 1.0 mm ball pitch and requires an accurate BGA land pattern per Microchip's package drawing. Route power and ground balls to solid planes with an array of decoupling capacitors (0.1 uF plus bulk 10 uF) placed near the ball field. Escape routing at 1.0 mm pitch is achievable on 4+ layer boards with 0.4-0.45 mm pads; plan via-in-pad or dog-bone escapes for inner rows before finalizing layer count.
Configuration is stored in on-chip flash, so programming requires Microchip's FlashPro programmer via the JTAG port - reserve JTAG access on the PCB even in production. Do not substitute SRAM-FPGA design flows: Fusion analog blocks, Flash*Freeze timing, and I/O standards must be constrained in Libero SoC, and static timing re-verified when migrating between speed grades (base to '2'). Confirm the temperature grade matches your environment - the commercial FGG256 variants must not be used at industrial extremes.
규정 준수 정보
RoHS compliant per distributor listings (DigiKey/Mouser). AEC-Q100 qualification not stated in provided data for this part number.