M7AFS600-1FG256 vs M7AFS600-FGG256 비교
다음의 상세 나란히 비교: M7AFS600-1FG256 제조: Microchip Technology 및 M7AFS600-FGG256 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
M7AFS600-1FG256 - Fusion FPGA 600K Gates 256-FBGA | Microchip
M7AFS600-1FG256 ✓ 활성Microchip Technology
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
M7AFS600-FGG256 ✓ 활성사양 비교
| 파라미터 | M7AFS600-1FG256 | M7AFS600-FGG256 |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $251.00 | $232.40 |
| Logic Family | Microsemi Fusion (M7AFS600) | — |
| System Gates | 600K | 600K |
| Embedded Processor Core | ARM CoreMP7 (32-bit) | — |
| Embedded Flash Configuration Memory | 110592 bits | — |
| Number of User I/O | 119 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Core Supply Voltage Range | 1.425 V to 1.575 V | — |
| Process Technology | 130 nm flash-based | 130 nm flash-based |
| Configuration Type | Non-volatile Flash, single-chip, instant-on | — |
| Maximum Frequency | 1282.05 MHz (per distributor listing) | 1098.9 MHz (distributor listing) |
| 패키지 | 256-ball FBGA/LBGA (FG256) | 256-LBGA / 256-FBGA |
| 실장 유형 | Surface Mount | Surface Mount |
| 동작 온도 | -40C to +85C | [DATA_NEEDED: Operating Temperature Range] |
| Packaging | Tray | Tray |
| Speed Grade | -1 (standard) | — |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| Total Package Balls | 256 | — |
| Family | — | Fusion (M7AFS600) |
| Flip-Flops | — | 110592 |
| User I/O | — | 119 |
| Embedded Processor | — | ARM CoreMP7 |
| Ball Pitch | — | 1 mm |
| Configuration Memory | — | Flash (single-chip, non-volatile) |
| Analog Features | — | Integrated configurable analog blocks, clock generation and management |
| MSL 레벨 | — | [DATA_NEEDED: Moisture Sensitivity Level] |