M7AFS600-1FG256 - Fusion FPGA 600K Gates 256-FBGA | Microchip
부품 번호: M7AFS600-1FG256 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $398.2 | $398.20 |
| 10 | $372.5 | $3,725.00 |
| 30 | $340 | $10,200.00 |
| 60 | $258.87 | $15,532.20 |
| 90 | $258.87 | $23,298.30 |
| 100 | $251 | $25,100.00 |
M7AFS600-1FG256 개요
A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) interconnected by programmable routing, allowing designers to implement custom digital circuits without fabricating an ASIC. Within the programmable logic hierarchy, the Fusion family occupies the mixed-signal FPGA tier, adding analog peripherals such as on-chip flash memory, analog-to-digital conversion, and power-management support to standard digital fabric, positioning it as an alternative to mixed-signal ASIC or discrete analog-plus-FPGA solutions.
Key features of the M7AFS600-1FG256 include 600K system gates of flash-based programmable logic, an integrated ARM CoreMP7 32-bit processor core, 119 user I/O pins available in the 256-ball package, and core supply voltage of 1.5V (valid operating range 1.425V to 1.575V per distributor data). Flash-based configuration means the device is inherently single-chip, non-volatile, and instant-on at power-up, unlike SRAM FPGAs that require external configuration memory.
The Fusion architecture integrates programmable analog blocks supporting power management, smart battery charging, clock generation and management, and motor control functions that previously required discrete analog components. The ARM CoreMP7 core allows embedded software to coexist with hardware logic, reducing bill-of-materials complexity in embedded control designs. The 130nm flash process provides live-at-power-up behavior and non-volatile storage of the design bitstream.
Typical applications include industrial power-supply supervision and sequencing, motor control drives, battery-management systems, embedded controllers combining MCU and FPGA roles, and space-constrained systems where a single-chip non-volatile FPGA eliminates external boot devices.
A key design consideration is supply-chain lead time: Mouser lists this part as non-stocked with a 16-week lead time, so production planning should secure stock early or evaluate the industrial-temperature M7AFS600-1FG256I variant. Power budgeting should account for the 1.5V core rail plus I/O bank rails.
This page synthesizes verified distributor pricing, drop-in alternatives within the same 256-ball footprint, and practical sourcing and design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: M7AFS600-1FG256 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: M7AFS600-1FG256 (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Package, Configuration Memory, System Gates, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M7AFS600-FG256
✅ 드롭인✓ 재고 있음
$198.75 / 개
데이터시트 보기 →M7AFS600-FGG256
✅ 드롭인✓ 재고 있음
$232.4 / 개
데이터시트 보기 →M7AFS600-FG256I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M7AFS600-2FG484
✅ 드롭인✓ 재고 있음
$276.95 / 개
데이터시트 보기 →A3P600-1FG256
✅ 드롭인✓ 재고 있음
$51.28 / 개
데이터시트 보기 →A3P600-2FG256
✅ 드롭인✓ 재고 있음
$57.43 / 개
데이터시트 보기 →M7AFS600-1FG256 최대 정격 & 전기적 특성
| Logic Family | Microsemi Fusion (M7AFS600) |
| System Gates | 600K |
| Embedded Processor Core | ARM CoreMP7 (32-bit) |
| Embedded Flash Configuration Memory | 110592 bits |
| Number of User I/O | 119 |
| Core Supply Voltage | 1.5 V |
| Core Supply Voltage Range | 1.425 V to 1.575 V |
| Process Technology | 130 nm flash-based |
| Configuration Type | Non-volatile Flash, single-chip, instant-on |
| Maximum Frequency | 1282.05 MHz (per distributor listing) |
| 패키지 | 256-ball FBGA/LBGA (FG256) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C |
| Packaging | Tray |
| Speed Grade | -1 (standard) |
| Total Package Balls | 256 |
M7AFS600-1FG256 256 핀 구성 가이드
M7AFS600-1FG256(256 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: M7AFS600-1FG256.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
M7AFS600-1FG256 적합 용도: 6 애플리케이션s: Power Management and Sequencing, Smart Battery Charging Systems, Motor Control Drives, Industrial Embedded Controllers, Clock Generation and Management, Legacy System Maintenance and Obsolescence Bridging.
Power Management and Sequencing
The M7AFS600-1FG256 is purpose-built for intelligent power management. Its Fusion on-chip analog subsystem monitors multiple supply voltages and die temperature while the 600K-gate flash fabric implements sequencing state machines - all controlled from the embedded ARM CoreMP7 processor. Unlike discrete supervisor ICs, the programmable fabric allows sequencing order and threshold changes in firmware rather than hardware. In a typical topology, the FPGA supervises an industrial 24V-derived multi-rail system with 1.5V core logic consuming only 1.425V-1.575V, and its non-volatile flash configuration means supervision logic is active within microseconds of power-up, before an SRAM FPGA would even begin loading its bitstream.
추천
Smart Battery Charging Systems
Battery charger designs benefit directly from the Fusion architecture: the analog front end of the M7AFS600-1FG256 reads charge current, pack voltage, and temperature through its on-chip sensing, while the ARM CoreMP7 runs the charging state algorithm and the flash fabric drives PWM charge-control outputs. Distributor data confirms the family targets 'smart battery charging' explicitly. Because the 256-ball FG256 device is single-chip and instant-on, charge-management logic is live before a host microcontroller boots, protecting the pack from unsafe pre-charge conditions. The 130nm flash process also supports secure storage of charge-profile data on-chip, eliminating an external EEPROM.
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Motor Control Drives
For industrial motor drives, the M7AFS600-1FG256 combines PWM generation, encoder/resolver interface logic, and protection interlocks in the 600K-gate fabric while the ARM CoreMP7 executes field-oriented control firmware - a two-engine architecture that pure MCUs struggle to match for determinism. Fusion's analog monitors provide over-voltage, over-current, and over-temperature trip detection at hardware speed, latching protection states without software latency. The 119 user I/O in the FG256 package accommodate six PWM phases, feedback interfaces, and communication links. The 1.5V core keeps logic power modest, while the -40C to +85C operating range suits factory-floor drive cabinets.
추천
Industrial Embedded Controllers
The embedded ARM CoreMP7 in the M7AFS600-1FG256 lets a single 256-ball chip replace an MCU-plus-FPGA two-chip solution in industrial controllers. Custom peripherals - CAN-like interfaces, stepper sequencers, proprietary protocol engines - are built in the flash fabric and memory-mapped to the processor, achieving deterministic hardware acceleration with C-level software flexibility. Instant-on flash configuration removes the external boot flash and configuration controller required by SRAM FPGAs, improving reliability in electrically noisy factory environments. With 110592 bits of on-chip flash, boot code and golden configuration coexist with the logic design on the same die.
추천
Clock Generation and Management
Clock trees in telecom, test, and industrial backplane systems use the M7AFS600-1FG256 to implement glitchless clock multiplexing, dividers, and frequency monitoring with programmable logic, while the Fusion analog subsystem watches clock-derived supply and temperature conditions. The fabric's deterministic routing supports sub-nanosecond skew tuning across the 119 I/O of the FG256 package. Because the configuration is flash-resident, clock-management logic is active within microseconds of board power-up - critical for systems that must gate clocks before volatile devices exit reset. This eliminates discrete CPLD or clock-mux components and their associated qualification burden.
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Legacy System Maintenance and Obsolescence Bridging
Because the Microsemi Fusion family is mature, the M7AFS600-1FG256 is frequently used to keep legacy industrial and defense platforms alive: it replaces discontinued mixed-signal ASICs and multi-chip supervisory circuits, fitting the original 256-ball FG256 footprint when migrating from related Microsemi parts such as A3P600 devices. The 16-week Mouser lead time as of 2026-09-02 demands proactive lifetime-buy planning, and the pin-related M7AFS600-FG256/FGG256/FG256I variants give procurement multiple orderable codes on the same footprint, spreading allocation risk across distributor inventory while preserving the validated PCB layout.
추천
추천 제품 요약
엔지니어링 참조 데이터: M7AFS600-1FG256 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | M7AFS600-FG256 | M7AFS600-FGG256 | M7AFS600-FG256I | A3P600-1FG256 | A3P600-2FG256 |
|---|---|---|---|---|---|---|
| Package | 256-FBGA (FG256) | 256-FBGA (FG256) - same | 256-FBGA (FG256) - same | 256-FBGA (FG256) - same | 256-FBGA (FG256) - same | 256-FBGA (FG256) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 600K | 600K |
| Embedded ARM CoreMP7 | Yes | Yes | Yes | Yes | No (digital-only fabric) | No (digital-only fabric) |
| Analog Subsystem (mixed-signal) | Yes (Fusion) | Yes | Yes | Yes | No | No |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | -1 | base | base | base, industrial temp | -1 | -2 (faster) |
주요 차별점
- Mixed-signal integration with on-chip analog (vs A3P600-1FG256)
- Embedded ARM processor on-chip (vs A3P600-2FG256)
- Industrial temperature screening available in same footprint (vs M7AFS600-FG256I)
설계 노트
Power the M7AFS600-1FG256 core from a regulated 1.5V rail held within 1.425V to 1.575V (per Mouser series data). Because the Fusion flash fabric is non-volatile, sequencing constraints are relaxed versus SRAM FPGAs, but still verify I/O bank rail sequencing against the Fusion datasheet power-up specification. Estimate core current from your design utilization using Microchip's power calculator in Libero before fixing regulator sizing; 119 simultaneously switching outputs can dominate total power in high-fan-out designs.
The FG256 256-ball FBGA (typically 1.0 mm or finer ball pitch for this family) requires via-in-pad or dog-bone fanout with at least one buried via layer for inner-row escape. Follow the Fusion datasheet PCB layout guidelines: solid ground plane directly under the die, short low-inductance vias for core and I/O bank decoupling, and placed 0.1uF plus bulk capacitors per bank. Copy the exact land pattern from the package drawing to guarantee compatibility with the FGG (Pb-free ball) variant later.
Plan for sourcing risk: Mouser lists this part as non-stocked with a 16-week lead time as of 2026-09-02, so a lifetime buy or dual-sourcing decision is needed for production. Do not confuse the FG256 and FG484 package codes during BOM entry - they are not footprint-compatible. Also confirm the analog pin assignments in your Libero I/O constraint file match the datasheet ball map; analog balls on the Fusion die are not freely interchangeable with user I/O.
규정 준수 정보
The FGG suffix within the Fusion family generally denotes Pb-free/RoHS ball finish, but RoHS status of this specific -1FG256 ordering code was not stated in the provided web data; confirm on the Microchip product page or datasheet.
