MC9S12DG128MPVE vs MC9S12DB128MPVE 비교

다음의 상세 나란히 비교: MC9S12DG128MPVE 제조: NXP Semiconductors 및 MC9S12DB128MPVE 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MC9S12DG128MPVE MC9S12DG128MPVE - 16-bit HCS12 MCU, 128KB Flash, 112-LQFP | NXP

MC9S12DG128MPVE - 16-bit HCS12 MCU, 128KB Flash, 112-LQFP | NXP

MC9S12DG128MPVE Nrnd
NXP Semiconductors
MC9S12DB128MPVE MC9S12DB128MPVE - 16-Bit HCS12 MCU, 128KB Flash, 25MHz | NXP

MC9S12DB128MPVE - 16-Bit HCS12 MCU, 128KB Flash, 25MHz | NXP

MC9S12DB128MPVE ✓ 활성

사양 비교

파라미터 MC9S12DG128MPVE MC9S12DB128MPVE
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 NRND 활성
재고 상태 In Stock In Stock
단가 (USD) $11.75 $18.40
Product Family S12DG (HCS12) —
Core Architecture HCS12 (CPU12, 16-bit CISC) HCS12 (CPU12), 16-bit
CPU Clock Frequency 25 MHz (max) —
Bus Clock 50 MHz (max) —
Program Memory (Flash) 128 KB —
RAM 8 KB —
EEPROM 2 KB —
공급 전압 2.35 V to 2.75 V (core) / 5 V I/O —
동작 온도 범위 -40C to +125C (automotive grade) —
Digital I/O Pins 59 —
ADC 2 x 10-bit, 8 channels each (16 total) —
PWM Channels 8 channels —
Enhanced Capture Timer 8-channel IC/OC —
SCI (UART) Channels 2 —
SPI Channels 1 —
CAN Module 1 (msCAN) —
패키지 112-LQFP (20 x 20 mm, 0.5 mm pitch) —
실장 유형 Surface Mount Surface Mount (Gull Wing)
RoHS 상태 Compliant Compliant
수명 주기 상태 NRND (Not Recommended for New Designs) —
Maximum CPU Clock — 25 MHz
Program Memory (FLASH) — 128 KB (128K x 8)
Data Memory (RAM) — 8 KB (8K x 8)
Number of I/O Pins — 91
Oscillator Type — Internal
패키지 / 케이스 — 112-LQFP (20x20 mm)
Terminal Form — GULL WING
Number of Terminals — 112
Package Code — LQFP
Package Shape — SQUARE
Temperature Grade — AUTOMOTIVE
Packaging — Tray

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