MCIMX6S5DVM10AB vs MCIMX6S4AVM08AB 비교

다음의 상세 나란히 비교: MCIMX6S5DVM10AB 제조: NXP Semiconductors 및 MCIMX6S4AVM08AB 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MCIMX6S5DVM10AB MCIMX6S5DVM10AB - i.MX 6Solo ARM Cortex-A9 MPU 1GHz | NXP

MCIMX6S5DVM10AB - i.MX 6Solo ARM Cortex-A9 MPU 1GHz | NXP

MCIMX6S5DVM10AB Nrnd
NXP Semiconductors
MCIMX6S4AVM08AB MCIMX6S4AVM08AB - i.MX6 Solo 800MHz ARM Cortex-A9 MPU | NXP

MCIMX6S4AVM08AB - i.MX6 Solo 800MHz ARM Cortex-A9 MPU | NXP

MCIMX6S4AVM08AB Nrnd

사양 비교

파라미터 MCIMX6S5DVM10AB MCIMX6S4AVM08AB
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 NRND NRND
재고 상태 In Stock In Stock
단가 (USD) $33.85 $22.40
Core Architecture ARM Cortex-A9 (32-bit) —
Number of Cores 1 1
Maximum CPU Frequency 1.0 GHz —
L1 Cache (I + D per core) 32 KB + 32 KB —
L2 Cache 512 KB unified 512 KB unified
NEON SIMD Engine Yes —
Hardware FPU VFPv3 —
GPU Vivante GC880 (3D) + GC320 (2D) GC880 3D + 2D (OpenGL ES 2.0, OpenVG 1.1)
Image Processing Unit (IPU) IPUv3C, two units —
Display Controller Dual-display up to WXGA, EPDC for e-paper —
Memory Interface LPDDR2, DDR3, DDR3L (16/32-bit) 32-bit DDR3 / LPDDR2
패키지 624-MAPBGA 21x21 mm, 0.8 mm pitch 624-MAPBGA (21x21 mm, 0.8 mm pitch)
Operating Temperature (TJ) 0C to +95C (commercial) —
Process Technology 40 nm CMOS —
RoHS 상태 Compliant Compliant
Moisture Sensitivity Level MSL3 —
Part Number — MCIMX6S4AVM08AB
Core Processor — ARM Cortex-A9
Bus Width — 32-bit
Speed — 800 MHz
Series — i.MX 6Solo
공급 전압 — 1.8 V / 2.5 V / 2.8 V / 3.15 V
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
Video Decoder (VPU) — H.264 BP / MPEG-4 / H.263 / MJPEG, up to 1080p30
Display Interface — 24-bit parallel RGB LCD up to WXGA (1366x768)
Camera Interface — 2x MIPI-CSI
USB — 3x USB 2.0 (1x OTG with PHY)
PCIe — 1x PCIe 2.0 (x1 lane)
Ethernet — 10/100/1000 MAC
SD/MMC — 2x SD3.0 / MMC4.4
동작 온도 — -40C to +125C (automotive)
MSL 레벨 — 3 (168 hours)

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