MPC562MZP56 vs MPC561CZP40 비교
다음의 상세 나란히 비교: MPC562MZP56 제조: NXP Semiconductors 및 MPC561CZP40 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | MPC562MZP56 | MPC561CZP40 |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 최종 구매 | 최종 구매 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $35.40 | $51.75 |
| Core Architecture | PowerPC MPC5xx | PowerPC (MPC5xx / Qorivva family) |
| 데이터 버스 폭 | 32 bit | 32-bit |
| 최대 클록 주파수 | 56 MHz | 40 MHz |
| Program Memory Type | ROMless (external memory required) | ROMless (no internal Flash) |
| RAM Size | 32 Kbyte (32K x 8) | — |
| Number of I/O Lines | 64 | — |
| ADC Channels | 32 | QADC (Queued ADC) - multi-channel |
| Oscillator Type | External | — |
| 패키지 | 388-PBGA (27 x 27 mm) | — |
| 실장 유형 | Surface Mount | Surface Mount (BGA) |
| 공급 전압 | [DATA_NEEDED: supply voltage] | — |
| 동작 온도 | [DATA_NEEDED: operating temperature] | — |
| Code Compression | Yes (reduces program memory by up to 50%) | — |
| Intermodule Bus (IMB) | Yes (common peripheral backbone) | — |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| MSL 레벨 | [DATA_NEEDED: MSL level] | MSL3 (typical for large PBGA) |
| Communication Peripherals | CAN, serial interfaces [DATA_NEEDED: full list] | — |
| Core Count | — | Single-core |
| Package Type | — | 388-PBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 27 x 27 mm |
| 동작 온도 범위 | — | -40C to +85C |
| Automotive Grade | — | AEC-Q100 Grade compliant (Automotive) |
| Supply Voltage Range | — | [DATA_NEEDED: Vcore/Vio supply range] |
| On-chip SRAM Size | — | [DATA_NEEDED: SRAM bytes] |
| External Bus Interface | — | Yes (32-bit bus, chip-selects via SIU) |
| Timer Processing Unit | — | TPU - integrated motion-control timer |
| Peripheral Pin Multiplexing | — | Yes (SIU-controlled routing) |
| Lead-free / RoHS | — | Lead-free finish; RoHS compliance varies by date code |