MPC8250ACZQIHBC vs MPC8250AVRIHBC 비교
다음의 상세 나란히 비교: MPC8250ACZQIHBC 제조: NXP Semiconductors 및 MPC8250AVRIHBC 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC ObsoleteNXP Semiconductors
MPC8250AVRIHBC - PowerQUICC II MPC82xx 200MHz MPU BGA-516 | NXP
MPC8250AVRIHBC ⚠ 최종 구매사양 비교
| 파라미터 | MPC8250ACZQIHBC | MPC8250AVRIHBC |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | Obsolete | 최종 구매 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $99.50 | $21.40 |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC II | — |
| Core Processor | PowerPC G2 | — |
| Core Architecture | PowerPC 603e, 32-Bit RISC | — |
| Clock Speed | 200 MHz | — |
| Number of Cores | 1 (CPU) + 1 CPM | — |
| 데이터 버스 폭 | 64-Bit | 64-bit |
| Supply Voltage (Core) | 1.8 V | 1.8 V |
| Supply Voltage (I/O) | 3.3 V | 3.3 V |
| 동작 온도 | -40C to +105C (industrial) | — |
| Package Type | TEPBGA / Plastic BGA | BGA (Plastic, Lead-Free) |
| 핀 수 | 516 | 516 |
| Package Dimensions | 27 x 27 mm | 27 x 27 mm, 2.25 mm height |
| Ball Pitch | 1.0 mm | 1.0 mm |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| Process Technology | 0.25 um CMOS | — |
| Instruction Cache | 32 KB | — |
| Data Cache | 32 KB | — |
| Integrated Peripheral | PCI bridge, CPM (communications processor module) | — |
| MSL 레벨 | 3 (168 hours) | — |
| Lead Free | Yes (per datasheet package code) | — |
| Architecture | — | PowerPC G2 (PowerQUICC II) |
| Core | — | PowerPC 32-bit, 1 core |
| Instruction Set | — | RISC |
| Core Clock Speed | — | 200 MHz |
| Package Code | — | 516-PBGA |
| 동작 온도 범위 | — | -40C to +105C (Industrial) |
| Family | — | MPC82xx (PowerQUICC II) |
| Communications Peripherals | — | FCC, MCC, SCC, SMC controllers (CPM) |
| RoHS 상태 | — | Compliant (Lead-Free PBGA) |