MPC860DEZQ50D4 vs MPC860DECZQ50D4 비교
다음의 상세 나란히 비교: MPC860DEZQ50D4 제조: NXP Semiconductors 및 MPC860DECZQ50D4 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | MPC860DEZQ50D4 | MPC860DECZQ50D4 |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | NRND | 최종 구매 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $24.95 | $15.20 |
| Processor Type | MPC8xx PowerQUICC, 32-bit | — |
| Core Architecture | Power Architecture (embedded) | — |
| Core Frequency | 50 MHz | — |
| Communications Processor Module | CPM with HDLC, Ethernet, PCMCIA, SCC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| HDLC/SDLC Channels | Yes (multi-channel) | — |
| PCMCIA Interface | Yes | — |
| Supply Voltage (I/O) | 3.3 V | — |
| 패키지 | 357-Ball PBGA (25x25 mm) | 357-PBGA, 25x25 mm |
| 실장 유형 | Surface Mount (BGA) | Surface Mount (BGA) |
| 동작 온도 | 0 C to +95 C | -40 C to +95 C |
| RoHS 상태 | Contains Lead (legacy BGA) | Non-Compliant (legacy BGA with lead-bearing solder balls) |
| Lead-Free Status | Contains Lead | — |
| Packaging | Tray | Tray (D4 suffix) |
| Sub-Brand Heritage | Freescale / NXP PowerQUICC | — |
| Core Processor | — | MPC8xx PowerQUICC, 32-bit Power Architecture |
| Number of Cores | — | 1 |
| Bus Width | — | 32-bit |
| Core Speed | — | 50 MHz |
| Co-Processors / DSP | — | Communications; CPM (Communications Processor Module) |
| RAM Controllers | — | DRAM |
| On-Chip Cache | — | 4 KB instruction + 4 KB data |
| MMU | — | Yes (integrated, with translation tables) |
| Ethernet | — | 2x 10 Mbps MAC (MII) |
| Serial Communications Controllers (SCC) | — | 4 |
| Serial Management Controllers (SMC) | — | 2 |
| DMA Channels | — | 4 |
| 공급 전압 | — | 3.3 V (core 2.2 V, I/O 3.3 V) |
| Lead Status | — | Contains Lead |