MRF7S19170HSR3 vs MRF7S19100NBR1 비교
다음의 상세 나란히 비교: MRF7S19170HSR3 제조: NXP Semiconductors 및 MRF7S19100NBR1 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | MRF7S19170HSR3 | MRF7S19100NBR1 |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | MOSFETs | MOSFETs |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $99.40 | $30.10 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Part Status (Rochester) | Active - Rochester Electronics LLC authorized stock | — |
| 트랜지스터 유형 | LDMOS (N-Channel Enhancement-Mode Lateral MOSFET) | — |
| Technology | HV7 LDMOS | — |
| Frequency Band | 1930-1990 MHz (US PCS / UMTS Band 1 / DCS-1900) | 1.93 GHz to 1.99 GHz |
| Test Frequency | 1.99 GHz | — |
| Drain-Source Voltage (Max) | 65 V | — |
| Operating Drain Voltage | 28 V (typical) | — |
| Test Drain Current | 1.4 A | — |
| Output Power (Avg) | 50 W (W-CDMA) | — |
| Power Gain (typ) | 17.2 dB | — |
| 패키지 / 케이스 | NI-880S (ceramic flange, bolt-down) | TO-270 WB-4 (TO-272 WB-4), plastic over-molded, surface mount |
| 실장 유형 | Chassis / Heatsink Mount (flange) | — |
| Operating Mode | Class AB / Class C | — |
| Modulation Supported | CDMA, W-CDMA, multi-carrier GSM, EDGE | — |
| Lead Finish | Ni-Au (lead-free compatible) | — |
| RoHS 상태 | Compliant (per NXP product page) | compliant (per NXP product page) |
| Part Number | — | MRF7S19100NBR1 |
| Device Type | — | RF Power MOSFET (N-Channel Enhancement-Mode Lateral) |
| Test Frequency (typical) | — | 1.96 GHz |
| Drain-Source Breakdown Voltage (V(BR)DSS, min) | — | 65 V |
| Drain Operating Voltage (VDD) | — | 28 V (nominal) |
| Quiescent Drain Current (IDQ) | — | 1000 mA |
| Output Power (Pout, average) | — | 29 W (single-carrier W-CDMA, 3GPP TM1 64 DPCH, 50% clipping) |
| Power Gain (Gp, typical) | — | 17.5 dB |
| Drain Efficiency (typical) | — | [DATA_NEEDED: typical drain efficiency %] |
| Configuration | — | Single, N-Channel |
| 장착 스타일 | — | Surface Mount with copper ground flange (heatsink bolted) |
| JEDEC Terminal Code | — | JESD-30: R-PDFM-F4 |
| Terminal Finish (JESD-609) | — | e3 (tin-lead reflow compatible per manufacturer data) |
| 동작 온도 범위 | — | [DATA_NEEDED: operating temperature range C] |
| Storage Temperature Range | — | [DATA_NEEDED: storage temperature range C] |
| Lead-Free | — | yes |