MSC8256SVT1000B vs MSC8251SVT1000B 비교

다음의 상세 나란히 비교: MSC8256SVT1000B 제조: NXP Semiconductors 및 MSC8251SVT1000B 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MSC8256SVT1000B MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP

MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP

MSC8256SVT1000B Obsolete
NXP Semiconductors
MSC8251SVT1000B MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B Obsolete

사양 비교

파라미터 MSC8256SVT1000B MSC8251SVT1000B
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 DSP DSP
수명 주기 상태 Obsolete Obsolete
재고 상태 In Stock In Stock
단가 (USD) $189.00 $65.00
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors (formerly Freescale Semiconductor)
Series StarCore MSC8256 —
Type SC3850 Six-Core Digital Signal Processor —
Core Architecture StarCore SC3850 (VLE, 4-issue) SC3850 StarCore, single core
Number of Cores 6 —
Core Clock Speed 1 GHz —
Aggregate Throughput 1000 MIPS per core (6000 MIPS total) —
Data Width 32-bit / 64-bit —
L1 Instruction Cache (per core) 32 KB —
L1 Data Cache (per core) 32 KB —
Unified L2 Cache (per core) 512 KB (configurable to M2 memory in 64 KB increments) —
On-Chip RAM (total) 576 KB —
Non-Volatile Memory (ROM) 96 KB —
MMU Yes (hardware memory management unit) —
EPIC (Interrupt Controller) Yes (Extended Programmable Interrupt Controller) —
Timers (per core) 2 x 32-bit general-purpose —
DDR Memory Controller DDR2/DDR3 with ECC —
High-Speed Interfaces Serial RapidIO, PCI Express, SGMII, RGMII —
Peripheral Interfaces I2C, SPI, UART, GPIO —
Security Engine SEC (cryptographic acceleration) —
패키지 783-FCBGA (29x29 mm) —
동작 온도 -40C to +105C (industrial) [DATA_NEEDED: operating temperature grade]
실장 유형 Surface Mount (BGA) Surface Mount
MSL 레벨 [DATA_NEEDED: MSL rating] —
RoHS 상태 [DATA_NEEDED: RoHS status] Compliant
Core Revision — StarCore R2.1
Maximum Core Clock — 1 GHz
MIPS — [DATA_NEEDED: MIPS rating for 1 GHz SC3850]
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
L2 Unified Cache — 512 KB (configurable, SRAM or MAP)
On-Chip RAM — 576 KB
Internal ROM — 96 KB
TDM Interfaces — 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support
Ethernet MAC — Yes (integrated)
PCI Express — Yes (integrated controller)
Serial RapidIO — Yes (SERDES-based)
DMA Controller — Multi-channel DMA
Package Type — FCBGA (Flip-Chip Ball Grid Array)
Package Pin Count — 783 balls
Package Dimensions — 29 mm x 29 mm
Lead-Free / Halogen-Free — Yes (lead-free, halogen-free package)

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