NOPB vs STL35N75LF3 비교
다음의 상세 나란히 비교: NOPB 제조: Texas Instruments 및 STL35N75LF3 제조: STMicroelectronics. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | NOPB | STL35N75LF3 |
|---|---|---|
| 브랜드 | Texas Instruments | STMicroelectronics |
| 카테고리 | Logic ICs | MOSFETs |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $0.00 | $0.55 |
| Suffix Type | Part-number ordering suffix (not a standalone IC) | — |
| Meaning | No Lead / No Pb (lead-free packaging) | — |
| Origin | National Semiconductor ordering system (inherited by TI) | — |
| Lead Finish | Matte tin (Sn) or Sn-Ag-Cu (lead-free) | — |
| RoHS Compliance | Yes - compliant with EU Directive 2011/65/EU | — |
| REACH Compliance | Compliant (per TI declaration) | — |
| Peak Reflow Temperature | 260 C (JEDEC J-STD-020 lead-free profile) | — |
| MSL Classification | Per JEDEC J-STD-033 (device-dependent, typically MSL 2 or 3) | — |
| 실장 유형 | Surface Mount (packaging dependent on base MPN) | Surface Mount |
| 동작 온도 | Inherits base MPN specification | — |
| Equivalent Legacy Suffixes | /PBFREE, /LEADFREE, /LF (vendor-specific) | — |
| Functional Equivalence | Identical die and electrical specs to non-NOPB variant | — |
| Backwards Compatibility | Compatible with Sn-Pb and lead-free assembly lines when reflow profiled correctly | — |
| Document Reference | TI Packaging Terminology Guide (ti.com/design-development/packaging) | — |
| Country of Origin | Multiple (per base MPN country of assembly) | — |
| Polarity | — | N-Channel |
| Drain-Source Voltage (VDS) | — | 35 V |
| Continuous Drain Current (ID) | — | 35 A |
| On-Resistance (RDS(on)) | — | [DATA_NEEDED: RDS(on) value] |
| Gate-Source Voltage (VGS) | — | [DATA_NEEDED: VGS max] |
| Gate Charge (Qg) | — | [DATA_NEEDED: Qg value] |
| Power Dissipation (PD) | — | [DATA_NEEDED: PD value] |
| 동작 온도 범위 | — | -55°C to +150°C |
| 패키지 | — | PowerFLAT 5x6 |
| RoHS 상태 | — | Compliant |
| Lead-Free | — | Yes |
| ESD Protection | — | Integrated |
| Technology | — | Strip-layout |
| 열 저항, 접합-주변 | — | [DATA_NEEDED: RthJA value] |