XC6SLX75-3FG676C vs XC6SLX75-3FGG676C 비교

다음의 상세 나란히 비교: XC6SLX75-3FG676C 제조: AMD 및 XC6SLX75-3FGG676C 제조: Xilinx. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

AMD
XC6SLX75-3FG676C XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA

XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA

XC6SLX75-3FG676C ✓ 활성

사양 비교

파라미터 XC6SLX75-3FG676C XC6SLX75-3FGG676C
브랜드 AMD Xilinx
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 활성 활성
Device Type FPGA FPGA (Field Programmable Gate Array)
Device Family Spartan-6 LX —
Logic Cells 74,637 cells 74,637
Configurable Logic Blocks 5,831 CLBs —
Internal Frequency 667 MHz 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table)
Process Technology 45 nm CMOS 45 nm CMOS
Speed Grade -3 -3 (highest performance grade)
공급 전압 [DATA_NEEDED: supply voltage] 1.14 V to 1.26 V
동작 온도 0°C to 85°C (32°F to 185°F) 0 C to 85 C (commercial)
Package Type 676-BGA FBGA-676 (PBGA676)
Package Description FBGA-676 —
Package Dimensions 27 mm × 27 mm 27 mm x 27 mm, 1.0 mm ball pitch
Ball Pitch 1.0 mm —
Terminal Count 676 terminals —
Package Family FBGA —
실장 유형 Surface mount Surface Mount
I/O Standard [DATA_NEEDED: supported I/O standards] —
Block RAM [DATA_NEEDED: block RAM resources] 3,096 Kbit
DSP Resources [DATA_NEEDED: DSP resources] —
Configuration Method [DATA_NEEDED: configuration method] —
RoHS 상태 [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
FPGA Family — Spartan-6 LX
Configurable Logic Blocks (CLBs) — 5,831
User I/O — 408
DSP48A1 Slices — 132
Clock Management — DCM and PLL present
Lead-Free — Yes
RoHS — [DATA_NEEDED: RoHS compliance statement for this exact orderable]
REACH — [DATA_NEEDED: REACH declaration for this exact orderable]
Automotive Grade (AEC-Q100) — Not qualified - commercial temperature grade
Maximum Package Pin Count — 676 balls

데이터시트 & 자료

모든 제품 보기 BOM 생성 견적 요청