10AX090R1F40E1SG - 900K LE Arria 10 GX FPGA, 1517-FCBGA | Intel
부품 번호: 10AX090R1F40E1SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9038.6 | $9,038.60 |
| 10 | $8590 | $85,900.00 |
| 100 | $7670 | $767,000.00 |
| 250 | $7150 | $1,787,500.00 |
| 500 | $6700 | $3,350,000.00 |
10AX090R1F40E1SG 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture is built from an array of configurable logic blocks (CLBs), programmable interconnect, and hard IP blocks such as transceivers, DSP slices, block RAM, and CPU subsystems. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits (ICs). Arria 10 GX sits within Intel's mid-range FPGA family, positioned between Cyclone/Cyclone V (low-cost) and Stratix 10 (high-end) families, optimized for applications that need transceiver bandwidth plus reasonable power efficiency at 20 nm.
Key features include up to 900 000 logic elements, 59 234 304 bits of on-chip memory, integrated multi-gigabit transceivers (per Arria 10 GX family datasheet), variable-precision DSP blocks for high-throughput signal processing, and hard memory controllers for DDR3/DDR4/LPDDR3 interfaces. The 1517-ball FCBGA supports high pin count and high-speed serial differential routing. Hard PCI Express Gen3 hard IP blocks make this device suitable for PCIe-based host interfacing without consuming programmable fabric.
From an architectural standpoint, the Arria 10 GX family uses a heterogeneous fabric that mixes adaptive logic modules (ALMs), M20K block RAM, MLAB memory, variable-precision DSP, and hardened transceiver/PCIe/HBM controller IP. The 20 nm process enables tighter integration and lower dynamic power per operation compared with the prior 28 nm Arria V generation, and the 'GX' device sub-line specifically adds transceiver capability that the lower-cost 'GT' and non-transceiver variants omit.
Typical applications include high-speed data acquisition, wireless baseband processing, broadcast video processing, military radar prototyping, industrial machine vision, and PCIe-accelerated compute cards. Engineers select Arria 10 GX when Stratix 10 power/cost is excessive but Cyclone V performance is insufficient.
When designing in this FPGA, plan the power tree carefully: the 0.9 V core rail requires multi-phase VRM regulation with current capabilities in the tens of amperes under load. Use the Intel Quartus Prime toolchain for synthesis, place-and-route, and timing closure. Reference the Arria 10 GX family datasheet for transceiver channel count, PLL topology, and recommended PCB stack-up.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical FPGA design notes that are not consolidated in a single vendor document. Use the comparison_table and alternatives sections together to evaluate same-package, same-family variants before committing to a BOM.
드롭인 대체품: 10AX090R1F40E1SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX090R1F40E1SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Operating Temperature Grade, Speed Grade, Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX090R1F40E2SG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AX090R2F40E1SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5750 / 개
데이터시트 보기 →10AX090R3F40E1SG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AX090N3F40I2SG
✅ 드롭인✓ 재고 있음
$2250 / 개
데이터시트 보기 →10AX090N2F40I1SG
✅ 드롭인✓ 재고 있음
$2985 / 개
데이터시트 보기 →10AX090R1F40E1SG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Logic Elements | 900000 |
| Embedded Memory Bits | 59234304 |
| User I/O Count | 342 |
| Process Technology | 20 nm (TSMC) |
| Core Voltage | 0.9 V |
| 패키지 | 1517-BBGA, FCBGA (FineLine BGA) |
| Number of Pins/Terminals | 1517 |
| Terminal Form | Ball |
| Package Code | BGA |
| Package Shape | Square |
| 실장 유형 | Surface Mount |
| 습도 민감도 레벨 (MSL) | 3 (168 Hours) |
| Packaging | Tray |
10AX090R1F40E1SG square 핀 구성 가이드
10AX090R1F40E1SG(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX090R1F40E1SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX090R1F40E1SG 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, Broadcast Video Processing and Routing, PCIe-Accelerated Compute Cards, Industrial Machine Vision, Military Radar and Signal Intelligence, High-Speed Data Acquisition Systems.
Wireless Baseband Processing
The 10AX090R1F40E1SG is well suited to wireless baseband digital signal processing in LTE and 5G fronthaul/backhaul systems. The 900 000 logic elements and variable-precision DSP blocks deliver hundreds of GMACs throughput required for channelization, FFT/iFFT, and modulation/demodulation functions. The integrated multi-gigabit transceivers interface directly to CPRI or OBSAI backhaul links, and the 342 user I/O accept parallel RF ADC/DAC data. Designers benefit from the 20 nm process, which balances DSP density against thermal envelope. Reference Intel's AN745 wireless application note for typical baseband pipelines. Companion power and clock ICs include LTC3612 VRMs and Si5341 jitter cleaners.
추천
Broadcast Video Processing and Routing
The 10AX090R1F40E1SG's 59 Mbit embedded memory and 342 I/O make it a strong fit for broadcast video routers, format converters, and IP-based ST 2110 gateways. Hard memory controllers sustain DDR3/DDR4 frame-buffer bandwidth, while 12G-SDI transceivers (external) feed the high-speed I/O banks. The Arria 10 GX transceiver sub-system also handles SMPTE 2022-5/6 IP encapsulation. Designers should leverage Quartus Prime video IP cores for faster development. The 1517-ball FCBGA exposes enough I/O for multi-channel 3G/HD/SD processing on a single device. Companion interface parts include M23428 HDMI transceivers.
추천
PCIe-Accelerated Compute Cards
The 10AX090R1F40E1SG integrates PCI Express Gen3 hard IP, enabling direct host CPU offload over x8 or x4 lanes without consuming fabric resources. This makes it ideal for prototyping hardware-accelerated compute cards in low-volume AI inference, network packet processing, or database acceleration. The 900K LE fabric plus variable-precision DSP supports INT8/FP16 inference engines, and 342 I/O expose HBM-ready data paths. Designers can use the Intel Acceleration Stack for OpenCL and oneAPI to port host code. Companion power: IR3553 VRM. From the XAIPART Site MPN list, the 10AX090N3F40I2SG is a viable industrial-grade down-migration in the same 1517-FCBGA footprint.
추천
Industrial Machine Vision
The 10AX090R1F40E1SG's combination of 342 user I/O and 900K logic elements supports multi-camera machine vision systems that aggregate 10-30 GigE Vision or CoaXPress streams into a single processor. The high logic capacity parallel-processes pre-processing (white balance, gamma, defect detection) before forwarding frames to a host CPU. The industrial-grade temperature rating (per E1 ordering code) ensures operation in factory environments. Transceivers also handle Camera Link HS or 10GigE uplinks. Designers pair the FPGA with Toshiba TC358743 CSI-2 bridges and Micron DDR4 buffers for full pipeline bandwidth.
추천
Military Radar and Signal Intelligence
Defense-grade radar, electronic warfare (EW), and signal intelligence (SIGINT) systems leverage the 10AX090R1F40E1SG's DSP density for beamforming, pulse compression, and digital down-conversion. The hardened floating-point multipliers in variable-precision DSP blocks accelerate FFT and matched-filter operations, and the multi-gigabit transceivers digitize signals directly from RF ADCs. The 1517-FCBGA is suitable for conduction-cooled VPX cards. Engineers typically pair this FPGA with the AD9680 14-bit 1 GSPS ADC and HMC7044 clock generator. Reference the Arria 10 device handbook for SDR reference designs.
추천
High-Speed Data Acquisition Systems
The 10AX090R1F40E1SG is widely deployed in test & measurement instruments such as oscilloscopes, protocol analyzers, and spectrum analyzers where 900K logic elements provide real-time triggering, on-the-fly compression, and protocol decoding. Hard memory controllers sustain continuous streaming into DDR4 buffers at multi-gigabyte rates, and the 342 I/O accept LVDS or differential parallel ADC data. Designers use Quartus Prime Platform Designer to integrate custom IP and bus functional models. Companion ICs include LTM4628 dual-output VRMs and Si570 programmable oscillators. From the XAIPART Site MPN list, 10AX090N2F40I1SG is a related same-package variant for industrial data-acq designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX090R1F40E1SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX090R1F40E2SG | 10AX090R2F40E1SG | 10AX090R3F40E1SG | 10AX090N3F40I2SG | 10AX090N2F40I1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same |
| Family | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900000 | 900000 | 900000 | 900000 | 900000 | 900000 |
| Embedded Memory Bits | 59234304 | 59234304 | 59234304 | 59234304 | 59234304 | 59234304 |
| User I/O Count | 342 | 342 | 342 | 342 | 342 | 342 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Speed/Temperature Grade | E1 (industrial) | E2 (industrial, faster) | E1 | E1 | I2 (industrial) | I1 (industrial) |
주요 차별점
- Higher speed-grade variant available in same footprint for performance-critical designs (vs 10AX090R1F40E2SG)
- Alternative transceiver sub-line within the same package (vs 10AX090R2F40E1SG / 10AX090R3F40E1SG)
- Industrial-grade same-package down-migration available from XAIPART catalog (vs 10AX090N3F40I2SG / 10AX090N2F40I1SG)
설계 노트
The 10AX090R1F40E1SG at full fabric utilization with active transceivers can dissipate 25-40 W. Estimated: assuming 30 W dissipation and a junction-to-ambient theta_JA of approximately 1.5 C/W with a properly designed heat sink and 1 m/s airflow, the junction temperature rise is around 45 C above ambient. At 25 C ambient this stays within industrial limits, but at 85 C ambient the design must use a cold plate or vapor chamber. Reference Intel's Arria 10 Thermal Management AN745 design guidelines for board-level cooling solutions.
Multi-rail power architecture is mandatory for this 1517-FCBGA Arria 10 device. Core rails at 0.9 V require multi-phase VRMs capable of 30-50 A continuous; transceiver rails at 1.0-1.2 V need 3-5 A each; auxiliary rails at 1.8 V and 3.3 V support configuration and I/O. Estimated: a 20 W total design requires ~22 A at 0.9 V core with typical VRM efficiency of 88%. Decoupling requires 0402/0201 ceramic capacitors distributed under the BGA, following the Intel-supplied reference PCB stack-up with low-Dk dielectric for the 12+ layer board.
The 1517-ball FCBGA demands 12+ layer PCB stack-up with matched impedance routing for transceiver channels (typically 85 ohm differential for serial links, 50 ohm single-ended for general I/O). Use buried vias and laser-drilled microvias for breakout. Reference Intel's Arria 10 board design guidelines and AN795 schematic checklist for the recommended schematic review items. Out-of-order net lengths must be compensated to within the transceiver's lane-to-lane skew budget (typically 100-200 UI).
Do not confuse the '10AX090' (Arria 10 GX with transceivers) family with '10AS090' (Arria 10 SX with hard processor subsystem) or '10AT090' (Arria 10 GT with higher-rate transceivers) - all use different transceiver configurations even within the 1517-FCBGA package. Verify the family suffix in the part number before PCB fabrication. Always re-run Quartus Prime fitter after substituting same-package alternatives listed in the alternatives section.
규정 준수 정보
Compliance data not present in Verified Web Data. RoHS status was marked [DATA_NEEDED] in specs. AEC-Q100 is not applicable for FPGAs.
