10AX115N4F40I3LG - Arria 10 GX FPGA 1.15M LE 1517-FCBGA | Intel
부품 번호: 10AX115N4F40I3LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3250 | $3,250.00 |
| 10 | $2995 | $29,950.00 |
| 100 | $2750 | $275,000.00 |
| 500 | $2520 | $1,260,000.00 |
| 1,000 | $2350 | $2,350,000.00 |
10AX115N4F40I3LG 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and hardened IP blocks such as transceivers, DSP slices, and embedded memory. FPGAs belong to the broader category of programmable logic devices (PLDs) within the semiconductor hierarchy: FPGA -> PLD -> logic IC -> integrated circuit. Unlike ASICs, FPGAs can be reconfigured after manufacture, making them ideal for prototyping, low-volume production, and applications requiring post-deployment updates.
Key features of the 10AX115N4F40I3LG include 1,150,000 logic elements (LEs), 68,857,856 bits (approximately 8 MB) of embedded M20K memory blocks, variable-precision DSP blocks supporting up to 1,500 GMACS of fixed-point throughput, and up to 96 full-duplex transceiver channels supporting data rates up to 28.05 Gbps. The 1517-ball FCBGA package provides high-density interconnect for designs requiring 600 user I/O pins, with the 'F40' suffix indicating an F1517 package, 40 mm body size, and 1.0 mm ball pitch.
The Arria 10 GX architecture combines a mid-range FPGA fabric with hardened floating-point DSP, variable-precision multipliers, and a coherent memory subsystem for high-performance signal processing. The 20 nm process enables a balanced trade-off between performance and power, with device variants optimized for transceiver-rich, DSP-heavy, or general-purpose logic designs.
Typical applications include high-speed data acquisition systems, 4K/8K video broadcast equipment, wireless baseband processing, military radar, medical imaging, and high-performance computing accelerators. The combination of high logic density, ample DSP resources, and multi-gigabit transceivers makes the 10AX115N4F40I3LG particularly suitable for applications that demand both parallel processing and high-bandwidth serial connectivity.
When designing with this device, engineers must allocate sufficient PCB layers (typically 12+ layers with HDI microvia technology) and high-performance transceiver channel routing to support the 28 Gbps SerDes interfaces. Thermal management with heatsinks and airflow is also critical given the high integration density and 0.9 V core supply current requirements.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the 10AX115N4F40I3LG, complementing the information available in the manufacturer datasheet with engineering-oriented guidance for component selection and PCB integration.
드롭인 대체품: 10AX115N4F40I3LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX115N4F40I3LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Transceivers, Process Technology, DSP Blocks, Embedded Memory Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX115N4F40E3LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6200 / 개
데이터시트 보기 →10AX115N3F40I3LG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AX115N4F40I2LG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AX115N2F40I2LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$7965.99 / 개
데이터시트 보기 →10AX115H4F34I3LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5550 / 개
데이터시트 보기 →10AX090N4F40I3LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3290 / 개
데이터시트 보기 →10AX115N4F40I3LG 최대 정격 & 전기적 특성
| Series | Arria 10 GX |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory (bits) | 68,857,856 (approx. 8 MB) |
| Maximum User I/O | 600 |
| Transceiver Count | Up to 96 full-duplex channels |
| Maximum Transceiver Data Rate | 28.05 Gbps |
| Hard PCIe Blocks | PCIe Gen3 x8 hard IP |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| 패키지 | 1517-BBGA / FCBGA (F1517, 40 mm, 1.0 mm pitch) |
| Temperature Grade | Industrial (-40C to +100C) |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount (BGA) |
10AX115N4F40I3LG 1517-bbga / fcbga (f1517, 40 mm, 1.0 mm pitch) 핀 구성 가이드
10AX115N4F40I3LG(1517-bbga / fcbga (f1517, 40 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX115N4F40I3LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX115N4F40I3LG 적합 용도: 6 애플리케이션s: High-Speed Data Acquisition, 4K/8K Video Broadcast Equipment, Wireless Baseband Processing, Military Radar and Electronic Warfare, Medical Imaging Systems, High-Performance Computing Accelerators.
High-Speed Data Acquisition
The 10AX115N4F40I3LG fits high-speed data acquisition applications due to its 1,150,000 logic elements and up to 96 transceivers at 28.05 Gbps. Combined with 68,857,856 bits of embedded M20K memory, the device can buffer multi-channel ADC samples at gigasample-per-second rates. Placed between the front-end ADCs and a host CPU or DSP array, it performs real-time channel calibration, decimation, and triggering without external memory round-trips.
추천
4K/8K Video Broadcast Equipment
The 10AX115N4F40I3LG is ideal for 4K/8K video broadcast infrastructure thanks to its 600 user I/Os, 1.15M LEs, and embedded HDMI 2.0 / DisplayPort / 12G-SDI PHY support via transceivers. The 68 Mb embedded memory enables multi-frame buffering for color-space conversion and HDR tone mapping. Used in video routers, contribution encoders, and studio-grade frame synchronizers, it outperforms ASIC alternatives by allowing late-stage codec updates.
추천
Wireless Baseband Processing
The 10AX115N4F40I3LG suits wireless baseband processing because of its variable-precision DSP blocks supporting up to 1,500 GMACS fixed-point and integrated CPRI / OBSAI protocol interfaces via 28 Gbps transceivers. In LTE and 5G small-cell base stations, it implements PHY-layer functions including FFT/IFFT, channel coding, and MIMO detection. The industrial temperature grade allows deployment in outdoor radio units without derating.
추천
Military Radar and Electronic Warfare
The 10AX115N4F40I3LG supports military radar and electronic warfare (EW) systems through its combination of 1.15M LEs, embedded memory bandwidth, and 28 Gbps transceivers. Pulse compression, MTI filtering, and beamforming algorithms benefit from the variable-precision DSP blocks and M20K memory blocks. The industrial temperature grade and high-density FCBGA package meet the SWaP-C requirements of airborne radar and maritime EW pods.
추천
Medical Imaging Systems
The 10AX115N4F40I3LG is well suited to medical imaging modalities such as CT, MRI, and ultrasound because of its parallel DSP throughput and 600 high-speed user I/Os for parallel sensor interfaces. Beamforming in ultrasound front-ends benefits from the variable-precision DSP blocks, while CT reconstruction algorithms map efficiently onto the 1.15M LE fabric. Industrial temperature rating and high reliability support FDA-compliant medical device designs.
추천
High-Performance Computing Accelerators
The 10AX115N4F40I3LG accelerates HPC workloads through PCIe Gen3 hard IP blocks and 28 Gbps transceivers supporting coherent interconnects such as CCIX and OpenCAPI. With 1.15M LEs and 68 Mb embedded memory, it implements custom compute kernels for financial analytics, genomics, and machine learning inference alongside x86 host CPUs. The hard PCIe Gen3 x8 IP eliminates soft-logic overhead, delivering higher effective bandwidth than PCIe Gen3 soft cores.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX115N4F40I3LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX115N4F40E3LG | 10AX115N3F40I3LG | 10AX115N4F40I2LG | 10AX115N2F40I2LG | 10AX115H4F34I3LG | 10AX090N4F40I3LG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA (F1517, 40 mm) | 1517-BBGA, FCBGA (F1517, 40 mm) - same | 1517-BBGA, FCBGA (F1517, 40 mm) - same | 1517-BBGA, FCBGA (F1517, 40 mm) - same | 1517-BBGA, FCBGA (F1517, 40 mm) - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| Embedded Memory (bits) | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 53,560,320 |
| Speed Grade | -3 (N4) | -3 (N4) | -3 (N3) | -2 (N4) | -2 (N2) | -3 (H4) | -3 (N4) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Maximum Transceiver Rate | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 17.4 Gbps | 28.05 Gbps |
| Process / Core Voltage | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V |
주요 차별점
- Highest logic density in the F1517 FCBGA package family (vs 10AX090N4F40I3LG)
- Full 28.05 Gbps transceiver support (vs 10AX115H4F34I3LG)
- Industrial temperature grade availability (vs 10AX115N4F40E3LG)
설계 노트
The 1517-ball FCBGA package requires HDI PCB technology with at least 12 layers, laser-drilled microvias for inner-ball breakout, and 1.0 mm ball pitch routing rules. Estimated: at 1.0 mm pitch with 0.4 mm via pad and 0.125 mm trace/space (typical Arria 10 reference design), designers should plan for at least 2-3 microvia layers to escape all signal balls. Reference the Intel Arria 10 GX Board Design Guidelines for stackup recommendations.
Estimated: at typical Arria 10 utilization (70 percent logic, 60 percent transceiver, full DSP), total power dissipation can reach 25-40 W. The FCBGA package exposes a thermal die-attach pad that must be soldered to a copper heat spreader or thermal via array connecting to internal copper planes. Forced-air cooling with at least 200 LFM airflow is required for industrial-temperature operation; heatsinks should be designed for 0.5 C/W or lower thermal resistance.
The 0.9 V core supply must be generated by a high-current, low-noise DC-DC regulator capable of 20-30 A peak load with sub-1 percent transient response. According to the Intel Arria 10 GX Power Distribution Network Design Guidelines, use a multi-phase buck controller such as the LTC3887 or ISL8277 with input decoupling of at least 8x 22 uF ceramic capacitors per phase. Decoupling requires 0402-size 0.1 uF and 1 uF capacitors placed within 5 mm of each power pin cluster.
Transceiver channels at 28.05 Gbps require strict impedance control (100 ohm differential) and length matching within 0.127 mm (5 mil) for the entire channel. Use a high-frequency PCB laminate such as Megtron 6 or RO4350B for transceiver routing layers with controlled dielectric thickness. Reference the Intel Arria 10 Transceiver Signal Integrity Guide for via optimization and AC-coupling capacitor placement requirements.
Do not confuse the F1517 package suffix with similar F1517 packages from other Arria 10 family members: verify the exact ball map against the device-specific pinout file before PCB layout. Mis-mapping the F1517 ball assignments between Arria 10 GX and Arria 10 GT or SX variants causes non-functional boards that are extremely difficult to rework at BGA level. Always generate the device-specific pinout from Intel Quartus Prime pin planner rather than reusing a previous project.
규정 준수 정보
RoHS and REACH compliance per Intel FPGA product declaration. AEC-Q100 not applicable as this is a high-density FPGA, not an automotive-grade IC. Industrial temperature grade (-40C to +100C) certified per Intel datasheet.
