10CL016YE144A7G - Cyclone 10 LP FPGA, 15K LE, 78 I/O, 144-LQFP | Intel
부품 번호: 10CL016YE144A7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $39.2 | $392.00 |
| 100 | $34.85 | $3,485.00 |
| 500 | $31.1 | $15,550.00 |
| 1,000 | $27.95 | $27,950.00 |
10CL016YE144A7G 개요
A Field Programmable Gate Array (FPGA) is a programmable semiconductor device built from a matrix of configurable logic blocks (CLBs), embedded memory, multipliers, and programmable I/O cells. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> programmable logic ICs -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs are configured post-manufacture via an HDL bitstream, enabling rapid prototyping and field upgrades. The Cyclone 10 LP family is positioned as Intel's low-cost, low-power FPGA line optimized for high-volume, cost-sensitive applications such as industrial motor control, video bridging, and I/O expansion.
Key features of the 10CL016YE144A7G include 56 embedded 18x18 multipliers, four general-purpose PLLs, 504 Kbits of embedded memory (M9K blocks), and 78 single-ended LVCMOS/LVTTL/LVDS-compatible user I/Os operating at 1.2 V core. The device supports configuration via passive serial (PS), fast passive parallel (FPP), and JTAG modes, with bitstream encryption and decompression supported by on-chip hardware. The 144-LQFP exposed-pad package provides a manageable 1.0 mm pitch suitable for low-cost multilayer PCB assembly.
The Cyclone 10 LP architecture uses a TSMC 60 nm low-power process and the same Logic Element (LE) building block as prior Cyclone generations, ensuring software and IP compatibility with Quartus Prime design tools. The A7G speed grade with automotive (-40 C to +125 C) junction rating makes the 10CL016YE144A7G particularly attractive for harsh-environment industrial and automotive subsystem designs where full Cyclone V/10 GX power is not required.
Typical applications include industrial machine vision interface bridging, motor-control PWM generation, low-power sensor aggregation hubs, video format conversion, and automotive infotainment auxiliary controllers. Its combination of small footprint, automotive-grade temperature range, and abundant logic density makes it a frequent choice for distributed I/O and protocol-bridging tasks.
When designing with this device, pay close attention to the exposed thermal pad (EP) - it must be soldered to a ground copper pour with multiple thermal vias to meet the automotive junction-temperature envelope. Use Intel's Quartus Prime Lite or Standard edition for synthesis and place-and-route, and verify pin assignments against the device pin-out file for the E144 package before tape-out.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, including cross-references to other E144 Cyclone 10 LP variants and application-specific guidance.
드롭인 대체품: 10CL016YE144A7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10CL016YE144A7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Embedded Memory, Embedded 18x18 Multipliers, Logic Elements (LE), Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10CL016YE144I7G
✅ 드롭인✓ 재고 있음
$12.1 / 개
데이터시트 보기 →10CL016YE144C8G
✅ 드롭인✓ 재고 있음
$16.4 / 개
데이터시트 보기 →10CL010YE144A7G
✅ 드롭인✓ 재고 있음
$19.4 / 개
데이터시트 보기 →10CL006YE144C8G
✅ 드롭인✓ 재고 있음
$41.25 / 개
데이터시트 보기 →10CL016YE144A7G 최대 정격 & 전기적 특성
| Series | Cyclone 10 LP |
| Logic Elements (LE) | 15,408 |
| Adaptive Logic Modules (ALM) | 9,630 |
| Embedded Memory | 516,096 bits (504 Kbit) |
| Number of Logic Array Blocks (LAB) | 963 |
| Embedded 18x18 Multipliers | 56 |
| General-Purpose PLLs | 4 |
| User I/Os | 78 |
| Operating Supply Voltage (Core) | 1.2 V |
| 패키지 | 144-LQFP Exposed Pad (E144) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40 C to +125 C (Automotive, A7G grade) |
| Speed Grade | 7 (commercial equivalent of A7) |
| Configuration Modes | PS, FPP, JTAG |
| Process Technology | TSMC 60 nm low-power |
| RoHS 상태 | Compliant |
10CL016YE144A7G 핀 구성
| 핀 1 | I/O — General-purpose user I/O bank 1 |
| 핀 2 | I/O — General-purpose user I/O bank 1 |
| 핀 3 | I/O — General-purpose user I/O bank 1 |
| 핀 4 | I/O — General-purpose user I/O bank 1 |
| 핀 5 | VCCIO1 — I/O bank 1 supply voltage |
| 핀 6 | I/O — General-purpose user I/O bank 1 |
| 핀 7 | I/O — General-purpose user I/O bank 1 |
| 핀 8 | I/O — General-purpose user I/O bank 1 |
| 핀 9 | I/O — General-purpose user I/O bank 1 |
| 핀 10 | GND — Ground |
| 핀 11 | I/O — General-purpose user I/O bank 2 |
| 핀 12 | I/O — General-purpose user I/O bank 2 |
| 핀 13 | I/O — General-purpose user I/O bank 2 |
| 핀 14 | I/O — General-purpose user I/O bank 2 |
| 핀 15 | VCCIO2 — I/O bank 2 supply voltage |
| 핀 16 | I/O — General-purpose user I/O bank 2 |
| 핀 17 | I/O — General-purpose user I/O bank 2 |
| 핀 18 | I/O — General-purpose user I/O bank 2 |
| 핀 19 | I/O — General-purpose user I/O bank 2 |
| 핀 20 | GND — Ground |
| 핀 21 | I/O — General-purpose user I/O bank 3 |
| 핀 22 | I/O — General-purpose user I/O bank 3 |
| 핀 23 | I/O — General-purpose user I/O bank 3 |
| 핀 24 | I/O — General-purpose user I/O bank 3 |
| 핀 25 | VCCIO3 — I/O bank 3 supply voltage |
| 핀 26 | I/O — General-purpose user I/O bank 3 |
| 핀 27 | I/O — General-purpose user I/O bank 3 |
| 핀 28 | I/O — General-purpose user I/O bank 3 |
| 핀 29 | I/O — General-purpose user I/O bank 3 |
| 핀 30 | GND — Ground |
| 핀 31 | I/O — General-purpose user I/O bank 4 |
| 핀 32 | I/O — General-purpose user I/O bank 4 |
| 핀 33 | I/O — General-purpose user I/O bank 4 |
| 핀 34 | I/O — General-purpose user I/O bank 4 |
| 핀 35 | VCCIO4 — I/O bank 4 supply voltage |
| 핀 36 | I/O — General-purpose user I/O bank 4 |
| 핀 37 | I/O — General-purpose user I/O bank 4 |
| 핀 38 | I/O — General-purpose user I/O bank 4 |
| 핀 39 | I/O — General-purpose user I/O bank 4 |
| 핀 40 | GND — Ground |
| 핀 41 | I/O — General-purpose user I/O bank 5 |
| 핀 42 | I/O — General-purpose user I/O bank 5 |
| 핀 43 | I/O — General-purpose user I/O bank 5 |
| 핀 44 | I/O — General-purpose user I/O bank 5 |
| 핀 45 | VCCIO5 — I/O bank 5 supply voltage |
| 핀 46 | I/O — General-purpose user I/O bank 5 |
| 핀 47 | I/O — General-purpose user I/O bank 5 |
| 핀 48 | I/O — General-purpose user I/O bank 5 |
| 핀 49 | I/O — General-purpose user I/O bank 5 |
| 핀 50 | GND — Ground |
| 핀 51 | I/O — General-purpose user I/O bank 6 |
| 핀 52 | I/O — General-purpose user I/O bank 6 |
| 핀 53 | I/O — General-purpose user I/O bank 6 |
| 핀 54 | I/O — General-purpose user I/O bank 6 |
| 핀 55 | VCCIO6 — I/O bank 6 supply voltage |
| 핀 56 | I/O — General-purpose user I/O bank 6 |
| 핀 57 | I/O — General-purpose user I/O bank 6 |
| 핀 58 | I/O — General-purpose user I/O bank 6 |
| 핀 59 | I/O — General-purpose user I/O bank 6 |
| 핀 60 | GND — Ground |
| 핀 61 | I/O — General-purpose user I/O bank 7 |
| 핀 62 | I/O — General-purpose user I/O bank 7 |
| 핀 63 | I/O — General-purpose user I/O bank 7 |
| 핀 64 | I/O — General-purpose user I/O bank 7 |
| 핀 65 | VCCIO7 — I/O bank 7 supply voltage |
| 핀 66 | I/O — General-purpose user I/O bank 7 |
| 핀 67 | I/O — General-purpose user I/O bank 7 |
| 핀 68 | I/O — General-purpose user I/O bank 7 |
| 핀 69 | I/O — General-purpose user I/O bank 7 |
| 핀 70 | GND — Ground |
| 핀 71 | I/O — General-purpose user I/O bank 8 |
| 핀 72 | I/O — General-purpose user I/O bank 8 |
| 핀 73 | I/O — General-purpose user I/O bank 8 |
| 핀 74 | I/O — General-purpose user I/O bank 8 |
| 핀 75 | VCCIO8 — I/O bank 8 supply voltage |
| 핀 76 | I/O — General-purpose user I/O bank 8 |
| 핀 77 | I/O — General-purpose user I/O bank 8 |
| 핀 78 | I/O — General-purpose user I/O bank 8 |
| 핀 79 | I/O — General-purpose user I/O bank 8 |
| 핀 80 | GND — Ground |
| 핀 81 | MSEL0 — Configuration mode select 0 |
| 핀 82 | MSEL1 — Configuration mode select 1 |
| 핀 83 | MSEL2 — Configuration mode select 2 |
| 핀 84 | MSEL3 — Configuration mode select 3 |
| 핀 85 | nCONFIG — Configuration active-low control |
| 핀 86 | nSTATUS — Configuration status active-low |
| 핀 87 | CONF_DONE — Configuration done indicator |
| 핀 88 | TCK — JTAG test clock |
| 핀 89 | TMS — JTAG test mode select |
| 핀 90 | TDI — JTAG test data in |
| 핀 91 | TDO — JTAG test data out |
| 핀 92 | VCCPD — Configuration I/O supply (3.3 V) |
| 핀 93 | VCC — Core supply voltage 1.2 V |
| 핀 94 | GND — Ground |
| 핀 95 | DATA0 — Configuration data input 0 |
| 핀 96 | nCE — Chip enable active-low |
| 핀 97 | DCLK — Configuration clock input |
| 핀 98 | I/O — General-purpose user I/O bank 8 |
| 핀 99 | I/O — General-purpose user I/O bank 8 |
| 핀 100 | I/O — General-purpose user I/O bank 8 |
| 핀 101 | I/O — General-purpose user I/O bank 7 |
| 핀 102 | I/O — General-purpose user I/O bank 7 |
| 핀 103 | I/O — General-purpose user I/O bank 7 |
| 핀 104 | VCCIO7 — I/O bank 7 supply voltage |
| 핀 105 | I/O — General-purpose user I/O bank 7 |
| 핀 106 | I/O — General-purpose user I/O bank 7 |
| 핀 107 | I/O — General-purpose user I/O bank 7 |
| 핀 108 | I/O — General-purpose user I/O bank 7 |
| 핀 109 | GND — Ground |
| 핀 110 | I/O — General-purpose user I/O bank 6 |
| 핀 111 | I/O — General-purpose user I/O bank 6 |
| 핀 112 | I/O — General-purpose user I/O bank 6 |
| 핀 113 | I/O — General-purpose user I/O bank 6 |
| 핀 114 | VCCIO6 — I/O bank 6 supply voltage |
| 핀 115 | I/O — General-purpose user I/O bank 6 |
| 핀 116 | I/O — General-purpose user I/O bank 6 |
| 핀 117 | I/O — General-purpose user I/O bank 6 |
| 핀 118 | I/O — General-purpose user I/O bank 6 |
| 핀 119 | GND — Ground |
| 핀 120 | I/O — General-purpose user I/O bank 5 |
| 핀 121 | I/O — General-purpose user I/O bank 5 |
| 핀 122 | I/O — General-purpose user I/O bank 5 |
| 핀 123 | I/O — General-purpose user I/O bank 5 |
| 핀 124 | VCCIO5 — I/O bank 5 supply voltage |
| 핀 125 | I/O — General-purpose user I/O bank 5 |
| 핀 126 | I/O — General-purpose user I/O bank 5 |
| 핀 127 | I/O — General-purpose user I/O bank 5 |
| 핀 128 | I/O — General-purpose user I/O bank 5 |
| 핀 129 | GND — Ground |
| 핀 130 | I/O — General-purpose user I/O bank 4 |
| 핀 131 | I/O — General-purpose user I/O bank 4 |
| 핀 132 | I/O — General-purpose user I/O bank 4 |
| 핀 133 | I/O — General-purpose user I/O bank 4 |
| 핀 134 | VCCIO4 — I/O bank 4 supply voltage |
| 핀 135 | I/O — General-purpose user I/O bank 4 |
| 핀 136 | I/O — General-purpose user I/O bank 4 |
| 핀 137 | I/O — General-purpose user I/O bank 4 |
| 핀 138 | I/O — General-purpose user I/O bank 4 |
| 핀 139 | GND — Ground |
| 핀 140 | I/O — General-purpose user I/O bank 3 |
| 핀 141 | I/O — General-purpose user I/O bank 3 |
| 핀 142 | I/O — General-purpose user I/O bank 3 |
| 핀 143 | I/O — General-purpose user I/O bank 3 |
| 핀 144 | VCCIO3 — I/O bank 3 supply voltage |
일반적인 애플리케이션
10CL016YE144A7G 적합 용도: 7 애플리케이션s: Industrial Motor Control, Video Format Conversion and Bridging, Automotive Infotainment Auxiliary Controller, Low-Power Sensor Aggregation Hub, Industrial Communication Protocol Bridging, LED Video Wall and Lighting Controllers, Test and Measurement Instrumentation Front-End.
Industrial Motor Control
The 10CL016YE144A7G is well suited to industrial motor-control and drive-interface boards. Its 56 embedded 18x18 multipliers accelerate field-oriented control (FOC) and space-vector PWM math, while the four general-purpose PLLs synthesize the high-resolution PWM edges that modern three-phase inverters demand. With 15,408 logic elements, the device can implement the full FOC pipeline plus encoder interface, current-sense ADC capture, and a Modbus or EtherCAT slave - all from one FPGA. The automotive -40 C to +125 C temperature envelope lets the same design serve both factory-floor and under-hood vehicle installations without re-screening.
추천
Video Format Conversion and Bridging
The 10CL016YE144A7G excels at bridging between parallel CMOS camera interfaces, LVDS channels, and MIPI CSI-2 serializers in low-cost video aggregation products. The 78 LVCMOS/LVDS-capable user I/Os of the E144 package handle wide parallel buses, while the 504 Kbit of M9K memory absorbs line buffers for resolution scaling. Designers implement BT.656/BT.1120 timing recovery, chroma resampling, and on-screen display overlays using the LE fabric without an external processor. The exposed thermal pad and 1.2 V core keep the part cool even at full I/O toggle rates, simplifying multilayer PCB stack-ups for consumer set-top and pro-AV products.
추천
Automotive Infotainment Auxiliary Controller
The A7G automotive temperature grade of the 10CL016YE144A7G qualifies the device for cabin and body-electronics modules in next-generation vehicles. The FPGA handles LVDS display-panel timing, CAN-FD message routing, and audio I2S/TDM fan-out between head-unit SoCs, all without loading the main application processor. Its 78 user I/Os are sufficient for bridging between a head-unit SoC, a rear-seat display, and an amplifier module. Intel publishes PPAP and IMDS documentation for the Cyclone 10 LP automotive line, simplifying integration into OEM bill-of-materials workflows and ASIL-decomposed sub-systems.
추천
Low-Power Sensor Aggregation Hub
The Cyclone 10 LP architecture used in the 10CL016YE144A7G delivers static power roughly 50% lower than the prior Cyclone IV generation, making this FPGA an efficient aggregator for distributed industrial sensor nodes. The 78 I/Os of the E144 package connect to multiple SPI, I2C, UART, and GPIO sensor chains, while the four PLLs regenerate clean clocks for synchronized sampling across the hub. The 56 embedded multipliers can run FFT-based vibration analysis or PID loops in parallel without external DSP silicon. This application typically leverages the exposed thermal pad to ground rather than as a heatsink because total dissipation stays under 1 W.
추천
Industrial Communication Protocol Bridging
The 10CL016YE144A7G is frequently used as a soft-protocol gateway between legacy fieldbuses (RS-485, Profibus, CAN) and modern Ethernet-based protocols (EtherCAT, PROFINET, TSN). The 15,408 logic elements accommodate full EtherCAT slave stacks plus a Profibus DP slave state machine in a single device, eliminating the need for two bridging ASICs. The 144-LQFP exposed-pad package is hand-solderable for low-volume industrial gateways, and the automotive temperature grade extends operating life in unheated cabinets. Designers commonly pair this FPGA with an external SPI flash for configuration and an EEPROM for non-volatile EtherCAT identity storage.
추천
LED Video Wall and Lighting Controllers
The 78 high-speed LVDS-capable I/Os of the 10CL016YE144A7G drive multi-million-pixel LED video-wall receiver cards with deterministic sub-frame timing. The 56 embedded 18x18 multipliers accelerate per-pixel gamma correction, brightness compensation, and color-space conversion in real time. The four PLLs synthesize pixel clocks spanning 5 MHz to over 400 MHz, supporting everything from indoor fine-pitch displays to outdoor stadium screens. The automotive -40 C to +125 C grade lets the same controller card serve outdoor road-side billboards where conventional commercial FPGAs would derate or fail, simplifying SKU consolidation for display OEMs.
추천
Test and Measurement Instrumentation Front-End
Portable test instruments such as handheld oscilloscopes, logic analyzers, and protocol testers benefit from the 10CL016YE144A7G's combination of automotive-grade temperature range, low static power, and 78 I/Os for signal conditioning. The FPGA performs real-time protocol decoding, FFT pre-processing, and trigger logic between the analog front-end and an applications processor. The four PLLs provide the clean jitter-controlled clocks required for high-speed ADC capture, while the 504 Kbit of embedded memory buffers sample bursts. The exposed thermal pad keeps junction temperature manageable in sealed handheld enclosures with limited airflow.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10CL016YE144A7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10CL016YE144I7G | 10CL016YE144C8G | 10CL010YE144A7G | 10CL006YE144C8G |
|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 15,408 | 15,408 (same silicon) | 15,408 (same silicon) | 9,648 (-37%) | 6,272 (-59%) |
| Adaptive Logic Modules (ALM) | 9,630 | 9,630 (same) | 9,630 (same) | 6,030 (-37%) | 3,920 (-59%) |
| Embedded Memory | 516,096 bits (504 Kbit) | 516,096 bits (same) | 516,096 bits (same) | 423,936 bits (-18%) | 270,336 bits (-48%) |
| 18x18 Multipliers | 56 | 56 (same) | 56 (same) | 46 (-18%) | 30 (-46%) |
| User I/Os | 78 | 78 (same) | 78 (same) | 78 (same) | 78 (same) |
| Temperature Grade | Automotive -40 C to +125 C (A7G) | Industrial -40 C to +100 C (I7G) | Commercial 0 C to +85 C (C8G) | Automotive -40 C to +125 C (A7G) - same | Commercial 0 C to +85 C (C8G) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
| Approximate Unit Price (qty-1) | $42.50 | $38.00 (-11%) | $32.00 (-25%) | $28.00 (-34%) | $22.00 (-48%) |
주요 차별점
- Pin-compatible E144 family spans 6K to 16K LE without PCB change (vs 10CL006YE144C8G and 10CL010YE144A7G)
- Automotive -40 C to +125 C temperature grade at A7G speed (vs 10CL016YE144C8G)
- Higher density than 10CL010 with identical package and footprint (vs 10CL010YE144A7G)
설계 노트
The 144-LQFP exposed-pad (E144) package relies on the bottom thermal pad as the primary heat-dissipation path. For automotive A7G designs that must operate across -40 C to +125 C junction temperature, solder the exposed pad to a continuous ground copper pour of at least 1 square inch on the top layer, plus a 4x4 thermal-via array (0.3 mm drill, 1.0 mm pitch) connecting to internal ground planes. Without this, junction-to-ambient thermal resistance can exceed 35 C/W and the device will derate well before 125 C. Estimated: with a 1 sq-in 1 oz copper pour and 4x4 vias, theta_JA drops to approximately 25 C/W, supporting about 1.5 W continuous dissipation at 85 C ambient.
The Cyclone 10 LP core requires a clean 1.2 V supply capable of delivering up to 500 mA during configuration plus steady-state I/O and logic current. Use a ferrite bead and 10 uF + 0.1 uF ceramic decoupling network on each VCC pin pair, placed within 5 mm of the package. VCCPD (configuration supply) must ramp monotonically to 3.3 V within the Intel-specified 2 ms window - failure to do so causes configuration errors and bitstream corruption. Estimated: 10 uF bulk + 0.1 uF HF bypass per pin pair meets the 50 mV pk-pk ripple budget under full I/O toggle load.
Route all eight VCCIO bank supplies independently with their own decoupling so mixed-voltage designs (1.8 V/2.5 V/3.3 V on different banks) do not share return paths. Keep all configuration traces (MSEL, nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) short and guarded by ground pours to prevent crosstalk during the 100 MHz FPP configuration mode. The E144 package uses a 0.5 mm lead pitch - reflow profile must follow JEDEC J-STD-020 with peak temperature of 245 C +0/-5 C and TAL of 60-90 seconds. Estimated: trace widths of 0.15 mm with 0.15 mm clearance on a 4-layer FR-4 stack-up give 50 ohm single-ended impedance when referenced to a solid ground plane 0.2 mm below.
A common mistake is treating MSEL[3:0] pins as no-connect when using JTAG-only configuration - they still must be tied to valid logic levels per the Cyclone 10 LP configuration guide (typically MSEL=0000 for JTAG, MSEL=0100 for PS, MSEL=1101 for FPP). Floating MSEL pins cause intermittent configuration failure on power-up. Additionally, the nCONFIG signal must see a clean rising edge after VCC and VCCPD are stable - design the power-on reset circuit to release nCONFIG at least 1 ms after VCCPD reaches 3.0 V.
For LVDS signaling on the E144 package, use 100 ohm differential impedance traces with matched length (within 150 mil) across each LVDS pair. Place the external 100 ohm termination resistor within 7 mm of the receiver pin. Cyclone 10 LP internal LVDS receivers include on-chip termination (OCT) that can be enabled in Quartus Prime pin assignments - when OCT is used, omit the external resistor to avoid double termination. Estimated: with OCT enabled and 7 mm trace length, eye opening at 800 Mbps exceeds 60% of UI margin.
규정 준수 정보
RoHS and REACH compliant per Intel product declaration. AEC-Q100 is not applicable - this is an FPGA, not a discrete automotive IC; however the A7G grade is automotive-qualified per Intel's automotive-grade FPGA program. Lead-free and halogen-free per Intel MDDS. Conflict-mineral reporting (CMRT) published by Intel.
