10CL016YE144A7G - Cyclone 10 LP FPGA, 15K LE, 78 I/O, 144-LQFP | Intel
Référence : 10CL016YE144A7G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $39.2 | $392,00 |
| 100 | $34.85 | $3 485,00 |
| 500 | $31.1 | $15 550,00 |
| 1 000 | $27.95 | $27 950,00 |
10CL016YE144A7G Présentation
A Field Programmable Gate Array (FPGA) is a programmable semiconductor device built from a matrix of configurable logic blocks (CLBs), embedded memory, multipliers, and programmable I/O cells. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> programmable logic ICs -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs are configured post-manufacture via an HDL bitstream, enabling rapid prototyping and field upgrades. The Cyclone 10 LP family is positioned as Intel's low-cost, low-power FPGA line optimized for high-volume, cost-sensitive applications such as industrial motor control, video bridging, and I/O expansion.
Key features of the 10CL016YE144A7G include 56 embedded 18x18 multipliers, four general-purpose PLLs, 504 Kbits of embedded memory (M9K blocks), and 78 single-ended LVCMOS/LVTTL/LVDS-compatible user I/Os operating at 1.2 V core. The device supports configuration via passive serial (PS), fast passive parallel (FPP), and JTAG modes, with bitstream encryption and decompression supported by on-chip hardware. The 144-LQFP exposed-pad package provides a manageable 1.0 mm pitch suitable for low-cost multilayer PCB assembly.
The Cyclone 10 LP architecture uses a TSMC 60 nm low-power process and the same Logic Element (LE) building block as prior Cyclone generations, ensuring software and IP compatibility with Quartus Prime design tools. The A7G speed grade with automotive (-40 C to +125 C) junction rating makes the 10CL016YE144A7G particularly attractive for harsh-environment industrial and automotive subsystem designs where full Cyclone V/10 GX power is not required.
Typical applications include industrial machine vision interface bridging, motor-control PWM generation, low-power sensor aggregation hubs, video format conversion, and automotive infotainment auxiliary controllers. Its combination of small footprint, automotive-grade temperature range, and abundant logic density makes it a frequent choice for distributed I/O and protocol-bridging tasks.
When designing with this device, pay close attention to the exposed thermal pad (EP) - it must be soldered to a ground copper pour with multiple thermal vias to meet the automotive junction-temperature envelope. Use Intel's Quartus Prime Lite or Standard edition for synthesis and place-and-route, and verify pin assignments against the device pin-out file for the E144 package before tape-out.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, including cross-references to other E144 Cyclone 10 LP variants and application-specific guidance.
Alternatives de remplacement direct pour 10CL016YE144A7G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10CL016YE144A7G (même facteur de forme et même empreinte) — différant par Package, Embedded Memory, Embedded 18x18 Multipliers, Logic Elements (LE), Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10CL016YE144I7G
✅ Remplacement direct✓ En stock
$12.1 / unité
Voir la fiche technique →10CL016YE144C8G
✅ Remplacement direct✓ En stock
$16.4 / unité
Voir la fiche technique →10CL010YE144A7G
✅ Remplacement direct✓ En stock
$19.4 / unité
Voir la fiche technique →10CL006YE144C8G
✅ Remplacement direct✓ En stock
$41.25 / unité
Voir la fiche technique →10CL016YE144A7G Valeurs maximales et caractéristiques électriques
| Series | Cyclone 10 LP |
| Logic Elements (LE) | 15,408 |
| Adaptive Logic Modules (ALM) | 9,630 |
| Embedded Memory | 516,096 bits (504 Kbit) |
| Number of Logic Array Blocks (LAB) | 963 |
| Embedded 18x18 Multipliers | 56 |
| General-Purpose PLLs | 4 |
| User I/Os | 78 |
| Operating Supply Voltage (Core) | 1.2 V |
| Boîtier | 144-LQFP Exposed Pad (E144) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 C to +125 C (Automotive, A7G grade) |
| Speed Grade | 7 (commercial equivalent of A7) |
| Configuration Modes | PS, FPP, JTAG |
| Process Technology | TSMC 60 nm low-power |
| Statut RoHS | Compliant |
Configuration des broches de 10CL016YE144A7G
| Broche 1 | I/O — General-purpose user I/O bank 1 |
| Broche 2 | I/O — General-purpose user I/O bank 1 |
| Broche 3 | I/O — General-purpose user I/O bank 1 |
| Broche 4 | I/O — General-purpose user I/O bank 1 |
| Broche 5 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 6 | I/O — General-purpose user I/O bank 1 |
| Broche 7 | I/O — General-purpose user I/O bank 1 |
| Broche 8 | I/O — General-purpose user I/O bank 1 |
| Broche 9 | I/O — General-purpose user I/O bank 1 |
| Broche 10 | GND — Ground |
| Broche 11 | I/O — General-purpose user I/O bank 2 |
| Broche 12 | I/O — General-purpose user I/O bank 2 |
| Broche 13 | I/O — General-purpose user I/O bank 2 |
| Broche 14 | I/O — General-purpose user I/O bank 2 |
| Broche 15 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 16 | I/O — General-purpose user I/O bank 2 |
| Broche 17 | I/O — General-purpose user I/O bank 2 |
| Broche 18 | I/O — General-purpose user I/O bank 2 |
| Broche 19 | I/O — General-purpose user I/O bank 2 |
| Broche 20 | GND — Ground |
| Broche 21 | I/O — General-purpose user I/O bank 3 |
| Broche 22 | I/O — General-purpose user I/O bank 3 |
| Broche 23 | I/O — General-purpose user I/O bank 3 |
| Broche 24 | I/O — General-purpose user I/O bank 3 |
| Broche 25 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 26 | I/O — General-purpose user I/O bank 3 |
| Broche 27 | I/O — General-purpose user I/O bank 3 |
| Broche 28 | I/O — General-purpose user I/O bank 3 |
| Broche 29 | I/O — General-purpose user I/O bank 3 |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — General-purpose user I/O bank 4 |
| Broche 32 | I/O — General-purpose user I/O bank 4 |
| Broche 33 | I/O — General-purpose user I/O bank 4 |
| Broche 34 | I/O — General-purpose user I/O bank 4 |
| Broche 35 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 36 | I/O — General-purpose user I/O bank 4 |
| Broche 37 | I/O — General-purpose user I/O bank 4 |
| Broche 38 | I/O — General-purpose user I/O bank 4 |
| Broche 39 | I/O — General-purpose user I/O bank 4 |
| Broche 40 | GND — Ground |
| Broche 41 | I/O — General-purpose user I/O bank 5 |
| Broche 42 | I/O — General-purpose user I/O bank 5 |
| Broche 43 | I/O — General-purpose user I/O bank 5 |
| Broche 44 | I/O — General-purpose user I/O bank 5 |
| Broche 45 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 46 | I/O — General-purpose user I/O bank 5 |
| Broche 47 | I/O — General-purpose user I/O bank 5 |
| Broche 48 | I/O — General-purpose user I/O bank 5 |
| Broche 49 | I/O — General-purpose user I/O bank 5 |
| Broche 50 | GND — Ground |
| Broche 51 | I/O — General-purpose user I/O bank 6 |
| Broche 52 | I/O — General-purpose user I/O bank 6 |
| Broche 53 | I/O — General-purpose user I/O bank 6 |
| Broche 54 | I/O — General-purpose user I/O bank 6 |
| Broche 55 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 56 | I/O — General-purpose user I/O bank 6 |
| Broche 57 | I/O — General-purpose user I/O bank 6 |
| Broche 58 | I/O — General-purpose user I/O bank 6 |
| Broche 59 | I/O — General-purpose user I/O bank 6 |
| Broche 60 | GND — Ground |
| Broche 61 | I/O — General-purpose user I/O bank 7 |
| Broche 62 | I/O — General-purpose user I/O bank 7 |
| Broche 63 | I/O — General-purpose user I/O bank 7 |
| Broche 64 | I/O — General-purpose user I/O bank 7 |
| Broche 65 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 66 | I/O — General-purpose user I/O bank 7 |
| Broche 67 | I/O — General-purpose user I/O bank 7 |
| Broche 68 | I/O — General-purpose user I/O bank 7 |
| Broche 69 | I/O — General-purpose user I/O bank 7 |
| Broche 70 | GND — Ground |
| Broche 71 | I/O — General-purpose user I/O bank 8 |
| Broche 72 | I/O — General-purpose user I/O bank 8 |
| Broche 73 | I/O — General-purpose user I/O bank 8 |
| Broche 74 | I/O — General-purpose user I/O bank 8 |
| Broche 75 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 76 | I/O — General-purpose user I/O bank 8 |
| Broche 77 | I/O — General-purpose user I/O bank 8 |
| Broche 78 | I/O — General-purpose user I/O bank 8 |
| Broche 79 | I/O — General-purpose user I/O bank 8 |
| Broche 80 | GND — Ground |
| Broche 81 | MSEL0 — Configuration mode select 0 |
| Broche 82 | MSEL1 — Configuration mode select 1 |
| Broche 83 | MSEL2 — Configuration mode select 2 |
| Broche 84 | MSEL3 — Configuration mode select 3 |
| Broche 85 | nCONFIG — Configuration active-low control |
| Broche 86 | nSTATUS — Configuration status active-low |
| Broche 87 | CONF_DONE — Configuration done indicator |
| Broche 88 | TCK — JTAG test clock |
| Broche 89 | TMS — JTAG test mode select |
| Broche 90 | TDI — JTAG test data in |
| Broche 91 | TDO — JTAG test data out |
| Broche 92 | VCCPD — Configuration I/O supply (3.3 V) |
| Broche 93 | VCC — Core supply voltage 1.2 V |
| Broche 94 | GND — Ground |
| Broche 95 | DATA0 — Configuration data input 0 |
| Broche 96 | nCE — Chip enable active-low |
| Broche 97 | DCLK — Configuration clock input |
| Broche 98 | I/O — General-purpose user I/O bank 8 |
| Broche 99 | I/O — General-purpose user I/O bank 8 |
| Broche 100 | I/O — General-purpose user I/O bank 8 |
| Broche 101 | I/O — General-purpose user I/O bank 7 |
| Broche 102 | I/O — General-purpose user I/O bank 7 |
| Broche 103 | I/O — General-purpose user I/O bank 7 |
| Broche 104 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 105 | I/O — General-purpose user I/O bank 7 |
| Broche 106 | I/O — General-purpose user I/O bank 7 |
| Broche 107 | I/O — General-purpose user I/O bank 7 |
| Broche 108 | I/O — General-purpose user I/O bank 7 |
| Broche 109 | GND — Ground |
| Broche 110 | I/O — General-purpose user I/O bank 6 |
| Broche 111 | I/O — General-purpose user I/O bank 6 |
| Broche 112 | I/O — General-purpose user I/O bank 6 |
| Broche 113 | I/O — General-purpose user I/O bank 6 |
| Broche 114 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 115 | I/O — General-purpose user I/O bank 6 |
| Broche 116 | I/O — General-purpose user I/O bank 6 |
| Broche 117 | I/O — General-purpose user I/O bank 6 |
| Broche 118 | I/O — General-purpose user I/O bank 6 |
| Broche 119 | GND — Ground |
| Broche 120 | I/O — General-purpose user I/O bank 5 |
| Broche 121 | I/O — General-purpose user I/O bank 5 |
| Broche 122 | I/O — General-purpose user I/O bank 5 |
| Broche 123 | I/O — General-purpose user I/O bank 5 |
| Broche 124 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 125 | I/O — General-purpose user I/O bank 5 |
| Broche 126 | I/O — General-purpose user I/O bank 5 |
| Broche 127 | I/O — General-purpose user I/O bank 5 |
| Broche 128 | I/O — General-purpose user I/O bank 5 |
| Broche 129 | GND — Ground |
| Broche 130 | I/O — General-purpose user I/O bank 4 |
| Broche 131 | I/O — General-purpose user I/O bank 4 |
| Broche 132 | I/O — General-purpose user I/O bank 4 |
| Broche 133 | I/O — General-purpose user I/O bank 4 |
| Broche 134 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 135 | I/O — General-purpose user I/O bank 4 |
| Broche 136 | I/O — General-purpose user I/O bank 4 |
| Broche 137 | I/O — General-purpose user I/O bank 4 |
| Broche 138 | I/O — General-purpose user I/O bank 4 |
| Broche 139 | GND — Ground |
| Broche 140 | I/O — General-purpose user I/O bank 3 |
| Broche 141 | I/O — General-purpose user I/O bank 3 |
| Broche 142 | I/O — General-purpose user I/O bank 3 |
| Broche 143 | I/O — General-purpose user I/O bank 3 |
| Broche 144 | VCCIO3 — I/O bank 3 supply voltage |
Applications typiques
10CL016YE144A7G convient pour 7 applications: Industrial Motor Control, Video Format Conversion and Bridging, Automotive Infotainment Auxiliary Controller, Low-Power Sensor Aggregation Hub, Industrial Communication Protocol Bridging, LED Video Wall and Lighting Controllers, Test and Measurement Instrumentation Front-End.
Industrial Motor Control
The 10CL016YE144A7G is well suited to industrial motor-control and drive-interface boards. Its 56 embedded 18x18 multipliers accelerate field-oriented control (FOC) and space-vector PWM math, while the four general-purpose PLLs synthesize the high-resolution PWM edges that modern three-phase inverters demand. With 15,408 logic elements, the device can implement the full FOC pipeline plus encoder interface, current-sense ADC capture, and a Modbus or EtherCAT slave - all from one FPGA. The automotive -40 C to +125 C temperature envelope lets the same design serve both factory-floor and under-hood vehicle installations without re-screening.
Recommandé
Video Format Conversion and Bridging
The 10CL016YE144A7G excels at bridging between parallel CMOS camera interfaces, LVDS channels, and MIPI CSI-2 serializers in low-cost video aggregation products. The 78 LVCMOS/LVDS-capable user I/Os of the E144 package handle wide parallel buses, while the 504 Kbit of M9K memory absorbs line buffers for resolution scaling. Designers implement BT.656/BT.1120 timing recovery, chroma resampling, and on-screen display overlays using the LE fabric without an external processor. The exposed thermal pad and 1.2 V core keep the part cool even at full I/O toggle rates, simplifying multilayer PCB stack-ups for consumer set-top and pro-AV products.
Recommandé
Automotive Infotainment Auxiliary Controller
The A7G automotive temperature grade of the 10CL016YE144A7G qualifies the device for cabin and body-electronics modules in next-generation vehicles. The FPGA handles LVDS display-panel timing, CAN-FD message routing, and audio I2S/TDM fan-out between head-unit SoCs, all without loading the main application processor. Its 78 user I/Os are sufficient for bridging between a head-unit SoC, a rear-seat display, and an amplifier module. Intel publishes PPAP and IMDS documentation for the Cyclone 10 LP automotive line, simplifying integration into OEM bill-of-materials workflows and ASIL-decomposed sub-systems.
Recommandé
Low-Power Sensor Aggregation Hub
The Cyclone 10 LP architecture used in the 10CL016YE144A7G delivers static power roughly 50% lower than the prior Cyclone IV generation, making this FPGA an efficient aggregator for distributed industrial sensor nodes. The 78 I/Os of the E144 package connect to multiple SPI, I2C, UART, and GPIO sensor chains, while the four PLLs regenerate clean clocks for synchronized sampling across the hub. The 56 embedded multipliers can run FFT-based vibration analysis or PID loops in parallel without external DSP silicon. This application typically leverages the exposed thermal pad to ground rather than as a heatsink because total dissipation stays under 1 W.
Recommandé
Industrial Communication Protocol Bridging
The 10CL016YE144A7G is frequently used as a soft-protocol gateway between legacy fieldbuses (RS-485, Profibus, CAN) and modern Ethernet-based protocols (EtherCAT, PROFINET, TSN). The 15,408 logic elements accommodate full EtherCAT slave stacks plus a Profibus DP slave state machine in a single device, eliminating the need for two bridging ASICs. The 144-LQFP exposed-pad package is hand-solderable for low-volume industrial gateways, and the automotive temperature grade extends operating life in unheated cabinets. Designers commonly pair this FPGA with an external SPI flash for configuration and an EEPROM for non-volatile EtherCAT identity storage.
Recommandé
LED Video Wall and Lighting Controllers
The 78 high-speed LVDS-capable I/Os of the 10CL016YE144A7G drive multi-million-pixel LED video-wall receiver cards with deterministic sub-frame timing. The 56 embedded 18x18 multipliers accelerate per-pixel gamma correction, brightness compensation, and color-space conversion in real time. The four PLLs synthesize pixel clocks spanning 5 MHz to over 400 MHz, supporting everything from indoor fine-pitch displays to outdoor stadium screens. The automotive -40 C to +125 C grade lets the same controller card serve outdoor road-side billboards where conventional commercial FPGAs would derate or fail, simplifying SKU consolidation for display OEMs.
Recommandé
Test and Measurement Instrumentation Front-End
Portable test instruments such as handheld oscilloscopes, logic analyzers, and protocol testers benefit from the 10CL016YE144A7G's combination of automotive-grade temperature range, low static power, and 78 I/Os for signal conditioning. The FPGA performs real-time protocol decoding, FFT pre-processing, and trigger logic between the analog front-end and an applications processor. The four PLLs provide the clean jitter-controlled clocks required for high-speed ADC capture, while the 504 Kbit of embedded memory buffers sample bursts. The exposed thermal pad keeps junction temperature manageable in sealed handheld enclosures with limited airflow.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10CL016YE144A7G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10CL016YE144I7G | 10CL016YE144C8G | 10CL010YE144A7G | 10CL006YE144C8G |
|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 15,408 | 15,408 (same silicon) | 15,408 (same silicon) | 9,648 (-37%) | 6,272 (-59%) |
| Adaptive Logic Modules (ALM) | 9,630 | 9,630 (same) | 9,630 (same) | 6,030 (-37%) | 3,920 (-59%) |
| Embedded Memory | 516,096 bits (504 Kbit) | 516,096 bits (same) | 516,096 bits (same) | 423,936 bits (-18%) | 270,336 bits (-48%) |
| 18x18 Multipliers | 56 | 56 (same) | 56 (same) | 46 (-18%) | 30 (-46%) |
| User I/Os | 78 | 78 (same) | 78 (same) | 78 (same) | 78 (same) |
| Temperature Grade | Automotive -40 C to +125 C (A7G) | Industrial -40 C to +100 C (I7G) | Commercial 0 C to +85 C (C8G) | Automotive -40 C to +125 C (A7G) - same | Commercial 0 C to +85 C (C8G) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
| Approximate Unit Price (qty-1) | $42.50 | $38.00 (-11%) | $32.00 (-25%) | $28.00 (-34%) | $22.00 (-48%) |
Principaux différenciateurs
- Pin-compatible E144 family spans 6K to 16K LE without PCB change (vs 10CL006YE144C8G and 10CL010YE144A7G)
- Automotive -40 C to +125 C temperature grade at A7G speed (vs 10CL016YE144C8G)
- Higher density than 10CL010 with identical package and footprint (vs 10CL010YE144A7G)
Notes de conception
The 144-LQFP exposed-pad (E144) package relies on the bottom thermal pad as the primary heat-dissipation path. For automotive A7G designs that must operate across -40 C to +125 C junction temperature, solder the exposed pad to a continuous ground copper pour of at least 1 square inch on the top layer, plus a 4x4 thermal-via array (0.3 mm drill, 1.0 mm pitch) connecting to internal ground planes. Without this, junction-to-ambient thermal resistance can exceed 35 C/W and the device will derate well before 125 C. Estimated: with a 1 sq-in 1 oz copper pour and 4x4 vias, theta_JA drops to approximately 25 C/W, supporting about 1.5 W continuous dissipation at 85 C ambient.
The Cyclone 10 LP core requires a clean 1.2 V supply capable of delivering up to 500 mA during configuration plus steady-state I/O and logic current. Use a ferrite bead and 10 uF + 0.1 uF ceramic decoupling network on each VCC pin pair, placed within 5 mm of the package. VCCPD (configuration supply) must ramp monotonically to 3.3 V within the Intel-specified 2 ms window - failure to do so causes configuration errors and bitstream corruption. Estimated: 10 uF bulk + 0.1 uF HF bypass per pin pair meets the 50 mV pk-pk ripple budget under full I/O toggle load.
Route all eight VCCIO bank supplies independently with their own decoupling so mixed-voltage designs (1.8 V/2.5 V/3.3 V on different banks) do not share return paths. Keep all configuration traces (MSEL, nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) short and guarded by ground pours to prevent crosstalk during the 100 MHz FPP configuration mode. The E144 package uses a 0.5 mm lead pitch - reflow profile must follow JEDEC J-STD-020 with peak temperature of 245 C +0/-5 C and TAL of 60-90 seconds. Estimated: trace widths of 0.15 mm with 0.15 mm clearance on a 4-layer FR-4 stack-up give 50 ohm single-ended impedance when referenced to a solid ground plane 0.2 mm below.
A common mistake is treating MSEL[3:0] pins as no-connect when using JTAG-only configuration - they still must be tied to valid logic levels per the Cyclone 10 LP configuration guide (typically MSEL=0000 for JTAG, MSEL=0100 for PS, MSEL=1101 for FPP). Floating MSEL pins cause intermittent configuration failure on power-up. Additionally, the nCONFIG signal must see a clean rising edge after VCC and VCCPD are stable - design the power-on reset circuit to release nCONFIG at least 1 ms after VCCPD reaches 3.0 V.
For LVDS signaling on the E144 package, use 100 ohm differential impedance traces with matched length (within 150 mil) across each LVDS pair. Place the external 100 ohm termination resistor within 7 mm of the receiver pin. Cyclone 10 LP internal LVDS receivers include on-chip termination (OCT) that can be enabled in Quartus Prime pin assignments - when OCT is used, omit the external resistor to avoid double termination. Estimated: with OCT enabled and 7 mm trace length, eye opening at 800 Mbps exceeds 60% of UI margin.
Informations de conformité
RoHS and REACH compliant per Intel product declaration. AEC-Q100 is not applicable - this is an FPGA, not a discrete automotive IC; however the A7G grade is automotive-qualified per Intel's automotive-grade FPGA program. Lead-free and halogen-free per Intel MDDS. Conflict-mineral reporting (CMRT) published by Intel.
