10CL080YF484C8G - 81K LE Cyclone 10 LP FPGA 484-BGA | Intel
부품 번호: 10CL080YF484C8G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $19.07 | $19.07 |
| 10 | $17.85 | $178.50 |
| 100 | $15.92 | $1,592.00 |
| 500 | $14.21 | $7,105.00 |
| 1,000 | $12.65 | $12,650.00 |
10CL080YF484C8G 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells interconnected by a programmable routing fabric. Within the broader integrated circuit taxonomy, FPGAs belong to the programmable logic family, sitting between ASICs (high NRE, high performance) and microcontrollers (sequential, software-defined). The Cyclone 10 LP family is Intel's low-power programmable logic line, optimized for cost-per-logic-element, low standby current, and small form factor integration.
Key features include 81,264 logic elements, 2,810,880 bits (3,446 Kb / ~3.36 Mb) of embedded SRAM, 244 (18x18) multipliers for DSP workloads, and integrated PLLs for clock management. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards across multiple banks, and offers hard memory controllers and PCIe Gen2 (x1/x2) hard IP blocks for connectivity. Total internal memory bits are commonly expressed as ~2.8 Mb.
The 10CL080YF484C8G uses a non-volatile SRAM-based configuration cell with on-chip flash for image storage, enabling single-chip instant-on behavior. The 'C8G' suffix denotes the commercial temperature grade (0C to +85C), 484-ball BGA package, and speed grade 8. Configuration is supported via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes.
Typical applications include industrial motor control, video processing and bridging, I/O expansion and protocol bridging (UART/SPI/I2C to Ethernet), test and measurement equipment, low-cost display controllers, and human-machine interface (HMI) designs. The combination of low power, high I/O count, and 484-BGA footprint makes it well suited to space-constrained embedded boards.
When designing with this part, ensure the PCB has at least 6 routing layers with proper BGA breakout, use the Intel Quartus Prime Lite/Standard toolchain for synthesis and place-and-route, and validate signal integrity for LVDS links above 400 Mbps. Decoupling must follow Intel's reference design guidance with multiple bulk and ceramic capacitors around the core and I/O supply rails.
드롭인 대체품: 10CL080YF484C8G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10CL080YF484C8G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Process Technology, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10CL055YF484C8G
✅ 드롭인✓ 재고 있음
$56.85 / 개
데이터시트 보기 →10CL040YF484C8G
✅ 드롭인✓ 재고 있음
$39.8 / 개
데이터시트 보기 →10CL080YF484C6G
✅ 드롭인✓ 재고 있음
$124 / 개
데이터시트 보기 →10CL080YF484I8G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10CL080YF484C8G 최대 정격 & 전기적 특성
| Family | Cyclone 10 LP |
| Logic Elements | 81,264 |
| Embedded Memory Bits | 2,810,880 bits (~3.36 Mb) |
| Embedded Memory (Kb) | 3,446 Kb |
| Number of Logic Elements | 81264 |
| Number of I/O | 289 |
| Number of LABs/CLBs | 5079 |
| DSP Multipliers (18x18) | 244 |
| 패키지 | 484-BGA (FBGA-484) |
| 동작 온도 | 0C to +85C (Commercial) |
| Speed Grade | 8 |
| Supply Voltage - Core | 1.0 V to 1.2 V (typical) |
| Process Technology | 60 nm low-power |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
10CL080YF484C8G 484-bga (fbga-484) 핀 구성 가이드
10CL080YF484C8G(484-bga (fbga-484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10CL080YF484C8G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10CL080YF484C8G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Bridging and Display Controllers, I/O Expansion and Protocol Bridging, Test and Measurement Equipment, Human-Machine Interface (HMI) Controllers, Automotive Infotainment and ADAS.
Industrial Motor Control
The 10CL080YF484C8G's 81,264 logic elements and 244 (18x18) DSP multipliers make it well suited for multi-axis industrial motor control designs. Its 60 nm low-power process minimizes thermal dissipation in enclosed drives, while 289 user I/Os accept multiple encoder, Hall-sensor, and resolver feedback channels. The hard PCIe Gen2 block supports host communication to industrial controllers. Compared with DSP-only solutions, the Cyclone 10 LP allows flexible integration of field-oriented control (FOC), sigma-delta modulation, and protection logic in a single chip. Designers can leverage the Altera/Intel Motor Control development kit reference designs to accelerate bring-up. The 484-BGA package supports rugged PCB construction for factory-floor vibration and extended temperature operation (with the industrial-grade 10CL080YF484I8G variant).
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Video Bridging and Display Controllers
With 2,810,880 bits of embedded SRAM and 289 I/Os supporting LVDS and LVCMOS, the 10CL080YF484C8G efficiently implements video format converters (HDMI/DVI/DisplayPort bridge), frame-rate converters, and multi-screen display controllers. The on-chip M9K memory blocks provide line buffers and frame-store functionality without external SDRAM for mid-resolution designs. Intel's Video and Image Processing (VIP) Suite IP cores - free with Quartus Prime - accelerate time-to-market for pixel pipelines, chroma resamplers, and overlay mixers. Compared to ASIC alternatives, the Cyclone 10 LP allows late-stage firmware updates when video standards evolve. For 4K pipelines requiring higher bandwidth, engineers should evaluate the Cyclone 10 GX family instead.
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I/O Expansion and Protocol Bridging
The 10CL080YF484C8G's 289 user I/Os and abundant logic resources make it an ideal protocol bridge for converting between UART, SPI, I2C, CAN, Ethernet, and PCIe in embedded systems. The hard PCIe Gen2 IP block allows direct connection to processors lacking sufficient PCIe lanes, while the soft Ethernet MAC and triple-speed Ethernet IP from Intel supports 10/100/1000 Mbps bridging. The 484-BGA package provides ample I/O for parallel buses (e.g., 16-bit SDR/DDR interfaces, GPIOs) and serial links in the same design. Compared to fixed-function bridge ICs, the FPGA approach supports late firmware customization for customer-specific protocol variations, a major advantage in industrial and embedded OEM designs.
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Test and Measurement Equipment
Test and measurement instruments leverage the 10CL080YF484C8G's parallel DSP throughput (244 18x18 multipliers) for real-time signal processing, FFT analysis, and digital filtering. The large embedded memory buffer (2.8 Mb) accommodates deep capture windows for oscilloscopes and logic analyzers without external memory. LVDS I/O support at up to 840 Mbps per pair enables high-speed ADC/DAC interfacing. Compared to microcontrollers or DSP processors, the FPGA delivers deterministic latency and parallel processing for time-critical measurements. Designers can implement custom trigger logic, statistical analyzers, and protocol decoders (I2C/SPI/UART/CAN) in a single chip. The Cyclone 10 LP's low static power suits portable, battery-powered test instruments.
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Human-Machine Interface (HMI) Controllers
HMI panels for industrial automation require simultaneous handling of touch input, multi-screen graphics, and communication with PLCs. The 10CL080YF484C8G integrates TFT/LVDS display driving (up to 24-bit color), capacitive touch controller interfacing, and EtherCAT/Modbus TCP communication stacks in a single FPGA. The 289 I/Os accept multiple parallel RGB interfaces, SPI displays, and quadrature encoder inputs. Compared with discrete microcontroller + GPU solutions, the Cyclone 10 LP reduces BOM cost and PCB area while allowing customer-specific UI customization via firmware. The 60 nm low-power process keeps thermals manageable in sealed enclosures. Intel's Nios II soft-core processor option allows embedded control tasks alongside custom display logic.
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Automotive Infotainment and ADAS
The 10CL080YF484C8G (commercial grade) is suitable for non-safety automotive infotainment functions; for safety-critical ADAS applications requiring AEC-Q100 qualification, the equivalent 10CL080YF484I8G industrial variant or dedicated automotive Cyclone family parts must be used. The 81,264 LEs handle LVDS camera aggregation, surround-view processing pre-stages, and CAN/LIN gateway bridging. 244 DSP multipliers enable lane-detection and object-recognition pre-filtering, while the 2.8 Mb embedded memory buffers frame data without external DRAM for entry-level designs. Compared to fixed-function automotive SoCs, the Cyclone 10 LP offers faster design iteration when integrating new sensor modalities. The 484-BGA package supports vibration-resistant PCB designs with proper underfill.
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추천 제품 요약
엔지니어링 참조 데이터: 10CL080YF484C8G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10CL055YF484C8G | 10CL040YF484C8G | 10CL080YF484C6G | 10CL080YF484I8G |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel |
| Package | 484-BGA (FBGA-484) | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same | 484-BGA (FBGA-484) - same |
| Logic Elements | 81,264 | 55,000 | 39,600 | 81,264 | 81,264 |
| Embedded Memory | 2,810,880 bits (~3.36 Mb) | 2,134,528 bits (~2.6 Mb) | 1,161,216 bits (~1.4 Mb) | 2,810,880 bits (~3.36 Mb) | 2,810,880 bits (~3.36 Mb) |
| DSP Multipliers (18x18) | 244 | 156 | 116 | 244 | 244 |
| User I/O | 289 | 289 | 289 | 289 | 289 |
| Speed Grade | 8 | 8 | 8 | 6 (faster) | 8 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Family | Cyclone 10 LP | Cyclone 10 LP | Cyclone 10 LP | Cyclone 10 LP | Cyclone 10 LP |
주요 차별점
- High logic density with low-power 60 nm process (vs 10CL040YF484C8G)
- Commercial temperature grade for cost-sensitive indoor applications (vs 10CL080YF484I8G)
- Cyclone 10 LP hard PCIe Gen2 block for host connectivity (vs 10CL080YF484C6G)
설계 노트
The 484-ball FBGA package has a 1.0 mm ball pitch requiring 6+ PCB layers for proper breakout and controlled-impedance routing. Per Intel's Cyclone 10 LP hardware design guidelines, route signal traces with microstrip or stripline geometry on inner layers; escape the BGA with via-in-pad or dog-bone fanout depending on PCB manufacturing capability. Add a continuous ground plane directly beneath the BGA for return path integrity. Use 0402-size decoupling capacitors (0.1uF, 1nF) placed within 100 mils of every VCCIO/VCC/GND pair, with multiple 10uF and 100uF bulk capacitors near the package perimeter.
Estimated: At maximum toggle rate and 100% I/O utilization, the 10CL080YF484C8G can dissipate 1.5-2.5W. The FBGA-484 package has theta_JA of approximately 12-15 C/W with standard 4-layer JEDEC test boards (per Intel's package thermal characterization). This yields a junction-to-ambient rise of 18-38C above ambient. For commercial-grade operation up to 85C ambient, no heatsink is typically required. However, in enclosed industrial enclosures with reduced airflow, designers should validate thermals at worst-case corner. Consider thermal vias beneath the package center pad and a copper pour on top layer to spread heat. Estimated input values: P_dissipation = 2.0W, theta_JA = 15 C/W, T_ambient_max = 85C.
Do not confuse the Cyclone 10 LP 'F484' 484-BGA package with the larger Cyclone 10 GX 'F484' package - both share the F484 designation but have different ball maps and pin assignments. Verify pinout against the specific device datasheet before PCB layout. Also note that the 'C8G' speed grade 8 is slower than the 'C6' speed grade 6; if design timing closure fails, the C6 variant may be required but at higher cost. Always include JTAG pull-up resistors (10K to VCCIO) on TMS, TCK, TDI, and TDO for reliable boundary-scan operation. Reset and configuration pins (nCONFIG, nSTATUS, CONF_DONE) require 10K pull-up to VCCIO per Intel reference design.
규정 준수 정보
RoHS and REACH compliant per Intel product page. Commercial temperature grade - not AEC-Q100 qualified. For automotive or extreme-temperature applications, use the industrial variant 10CL080YF484I8G.