10M04SCU169C8G - MAX 10 FPGA 4K LE, 169-LFBGA | Intel / Altera
부품 번호: 10M04SCU169C8G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $11.37 | $11.37 |
| 10 | $10.65 | $106.50 |
| 100 | $9.85 | $985.00 |
| 500 | $8.94 | $4,470.00 |
| 1,000 | $8.05 | $8,050.00 |
10M04SCU169C8G 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs) connected by a programmable interconnect, surrounded by programmable I/O cells. FPGAs sit within the broader taxonomy of programmable logic -> logic ICs -> integrated circuits -> semiconductors. The MAX 10 family targets low-power, non-volatile applications where instant-on behavior and integration of analog/digital functions reduce system BOM.
Key features of the 10M04SCU169C8G include 4,000 logic elements, 193,536 bits of user flash memory, embedded 9-bit 1 Msps ADC blocks, dual-configuration flash, and support for LVCMOS 1.2 V to 3.3 V I/O standards. The device operates from a 1.2 V core rail with PLL-based clock management and supports up to 130 general-purpose I/O pins on the 169-LFBGA footprint.
Architecturally, MAX 10 uses a logic-array block (LAB) fabric of 4-input LUTs, embedded 36-Kbit M9K RAM blocks, and 144-Kbit MLAB memory blocks. The non-volatile flash enables instant-on at power-up, dual-boot images, and user flash storage. The integrated ADC block eliminates an external ADC for sensor and analog monitoring tasks.
Typical applications include industrial motor control, factory automation, low-cost video bridging, I/O expansion and protocol bridging, and portable / battery-powered embedded systems. Designers choose this device when they need the flexibility of an FPGA without the BOM overhead of an external configuration memory.
When designing with the 10M04SCU169C8G, ensure proper decoupling of the 1.2 V core and 3.3 V auxiliary supplies, and follow Intel's PCB layout guidelines for BGA escape routing. Quartus Prime is the supported development environment.
This page synthesizes distributor pricing, drop-in MAX 10 alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers select the right OPN for their MAX 10 design.
드롭인 대체품: 10M04SCU169C8G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M04SCU169C8G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Method, Mounting Type, Integrated ADC, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M04SAU169C8G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M04DCU169C8G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M04SAU169I7G
✅ 드롭인✓ 재고 있음
$15.1 / 개
데이터시트 보기 →10M04SCU169A7G
✅ 드롭인✓ 재고 있음
$10.85 / 개
데이터시트 보기 →10M04DCU169C8G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M04SCU169C8G 최대 정격 & 전기적 특성
| Family | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Embedded Memory (bits) | 193,536 |
| User Flash Memory (bits) | 193,536 |
| User I/O Count | 130 |
| Core Voltage | 1.2 V |
| 동작 온도 범위 | 0C to +85C (commercial, C8 suffix) |
| 패키지 | 169-LFBGA (U169) |
| 실장 유형 | Surface Mount |
| Configuration Memory | On-chip non-volatile flash |
| ADC | Integrated dual 12-bit 1 Msps ADC |
| Speed Grade | 8 |
| RoHS 상태 | Compliant |
| Programming Tool | Quartus Prime |
10M04SCU169C8G 169-lfbga (u169) 핀 구성 가이드
10M04SCU169C8G(169-lfbga (u169) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M04SCU169C8G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M04SCU169C8G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Factory Automation I/O Expansion, Portable / Battery-Powered Embedded Systems, Low-Cost Video Bridging, IoT Edge Sensor Hubs, Communication Protocol Bridging.
Industrial Motor Control
The 10M04SCU169C8G fits industrial motor control because its integrated dual 12-bit 1 Msps ADC samples current and voltage feedback directly, eliminating an external ADC and reducing BOM. Its 4,000 logic elements implement PWM generation, encoder decoding, and field-oriented control state machines while the 130 user I/O drive gate drivers and read Hall sensors. Compared with a microcontroller, the FPGA's parallel fabric executes control loops deterministically at multi-MHz rates. Place decoupling on the 1.2 V core rail near the U169 BGA balls to minimize switching noise that would corrupt ADC readings.
추천
Factory Automation I/O Expansion
In factory automation, the 10M04SCU169C8G bridges between legacy parallel busses (parallel I/O, SPI, I2C) and modern serial interfaces (EtherCAT, PROFINET) while expanding GPIO counts beyond what a microcontroller offers. Its 130 user I/O and 4,000 LEs handle multiple protocol stacks concurrently, and the non-volatile flash enables instant-on behavior required for safety-rated machinery. Compared with discrete logic ICs, the FPGA consolidates protocol conversion, timing, and glue logic into one device. Route the 169-LFBGA BGA escape with microvia-in-pad technology to maintain signal integrity at LVCMOS switching speeds.
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Portable / Battery-Powered Embedded Systems
The 10M04SCU169C8G's non-volatile flash eliminates external boot memory, reducing standby current and PCB area in portable designs. Its 1.2 V core minimizes dynamic power while the integrated ADC monitors battery voltage and current without an external analog IC. The 4,000 LEs implement sensor fusion and display driving functions that would otherwise require a larger MCU plus external logic. Compared with SRAM-based FPGAs, the MAX 10's instant-on behavior lets the system wake from zero-power states in microseconds, extending battery life. Quartus Prime supports low-power compile flows targeting this device.
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Low-Cost Video Bridging
For low-cost video bridging the 10M04SCU169C8G converts between display interfaces (RGB to LVDS, parallel CMOS to MIPI-style signals) at resolutions up to 720p. Its 130 user I/O and embedded memory implement line buffers and pixel-clock conversion logic, while the non-volatile flash stores configuration and color-space conversion tables. Compared with ASSP video crossbars, the FPGA offers reconfigurable bridging as interface standards evolve. Place ground-return vias around the high-speed LVDS pairs of the U169 BGA to control EMI and meet CISPR 22 radiated emissions limits.
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IoT Edge Sensor Hubs
The 10M04SCU169C8G aggregates multiple sensor interfaces (SPI, I2C, UART, GPIO) into a unified uplink, serving as a low-power edge node in IoT deployments. Its integrated ADC reads analog sensors directly, and 4,000 LEs implement local filtering and thresholding before transmitting only meaningful events to the cloud. Compared with a microcontroller, the FPGA handles multiple concurrent sensor streams without CPU contention. Use the embedded user flash to store sensor calibration tables locally, reducing network traffic. The 169-LFBGA package suits compact edge-node enclosures.
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Communication Protocol Bridging
The 10M04SCU169C8G bridges between incompatible communication protocols (UART to SPI, I2C to parallel, CAN to UART) at line speeds up to 50 MHz. Its 4,000 LEs and embedded RAM implement FIFOs and protocol state machines, while 130 user I/O connect to multiple external peripherals. Compared with dedicated bridge ICs, the FPGA consolidates multiple bridges into one programmable device. The non-volatile flash enables field firmware updates over the air without external boot memory. Quartus Prime IP cores accelerate UART, SPI, I2C, and CAN implementation.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M04SCU169C8G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M04SAU169C8G | 10M04DCU169C8G | 10M04SAU169I7G | 10M04SCU169A7G |
|---|---|---|---|---|---|
| Package | 169-LFBGA (U169) | 169-LFBGA (U169) - same | 169-LFBGA (U169) - same | 169-LFBGA (U169) - same | 169-LFBGA (U169) - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| Embedded Memory (bits) | 193,536 | 193,536 | 193,536 | 193,536 | 193,536 |
| User I/O | 130 | 130 | 130 | 130 | 130 |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Speed Grade | C8 | C8 | C8 | I7 (industrial) | A7 |
| Pin-to-Pin Compatible | Yes (reference) | Yes | Yes | Yes | Yes |
주요 차별점
- Non-volatile flash enables instant-on without external boot memory (vs SRAM-based FPGAs (e.g., Cyclone V))
- Integrated dual 12-bit 1 Msps ADC blocks (vs Discrete FPGA + external ADC solution)
- 169-LFBGA package offers 130 user I/O in compact footprint (vs MAX 10 10M04 in larger packages (e.g., 256-BGA))
설계 노트
Decoupling: Place a 0.1uF MLCC plus 10uF bulk capacitor on each VCCINT (1.2 V core) and VCCA (analog supply) ball pair of the 169-LFBGA. Use via-in-pad microvia technology with 0.4 mm pitch escape routing to maintain signal integrity on the high-speed LVDS pairs. Keep all decoupling within 2 mm of the BGA balls to minimize inductance.
Thermal management: The MAX 10 10M04 at full I/O toggling dissipates approximately 0.5-1.0 W typical. The 169-LFBGA package thermal resistance theta_JA is approximately 25-30 C/W on a standard 4-layer PCB. For enclosed industrial designs, ensure adequate airflow or attach a small heatsink via the center thermal pad. Verify junction temperature under worst-case utilization in the Quartus Prime PowerPlay analyzer.
Configuration pitfalls: Always connect nCONFIG, CONF_DONE, and JTAG pins through 4.7k pull-ups to VCCIO. Do not leave JTAG TCK floating - use a 1k pull-down to prevent unintended configuration attempts. For dual-boot images, follow Intel's MAX 10 Dual Configuration IP User Guide to manage image selection safely. Verify the MSEL pins match the intended configuration mode with 4.7k pull resistors.
규정 준수 정보
RoHS and lead-free per Altera/Intel product page. AEC-Q100 not applicable (FPGA, not automotive-qualified discrete).
