10M04SAU169I7G - MAX 10 FPGA 4K LE, 169-UBGA | Intel
MPN: 10M04SAU169I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $24.59 | $24.59 |
| 10 | $22.5 | $225.00 |
| 100 | $19.85 | $1,985.00 |
| 500 | $17.4 | $8,700.00 |
| 1,000 | $15.1 | $15,100.00 |
Drop-in alternatives for 10M04SAU169I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M04SAU169C8G
✅ Drop-In📋 Reference alternative (not in catalog)
10M04SAU169A7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M04SAU169I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Embedded Memory | 193,536 bits (≈189 Kb) |
| Maximum User I/O | 130 |
| Process Technology | TSMC 55 nm embedded flash |
| Core Voltage | 1.2 V |
| Package | 169-ball UFBGA (U169), 11×11 mm, 0.65 mm pitch |
| Operating Temperature | -40 °C to +100 °C (industrial I7 grade) |
| Configuration Method | On-chip non-volatile flash (instant-on) |
| Integrated ADC | 12-bit, 1 Msps (hard IP) |
| PLLs | Hard PLL blocks (number device-specific) |
| DSP Blocks | Yes (18×18 multipliers) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10M04SAU169I7G 169-ball ufbga (u169), 11×11 mm, 0.65 mm pitch Pin Configuration Guide
Complete pinout information for 10M04SAU169I7G (169-ball ufbga (u169), 11×11 mm, 0.65 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M04SAU169I7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M04SAU169I7G is suitable for 6 applications: Industrial Motor Control, IoT Edge Sensor Hub, Industrial Protocol Bridge, Portable Test & Measurement, Factory Automation I/O Expansion, Low-Cost Video Processing.
Industrial Motor Control
The 10M04SAU169I7G fits industrial motor control designs because its 4,000 logic elements and hard DSP blocks provide the capacity for field-oriented control (FOC) state machines, PWM generation, and PI control loops in a single chip. The integrated 12-bit 1 Msps ADC samples current and back-EMF feedback without an external ADC, while the -40 °C to +100 °C I7 industrial temperature grade handles factory-floor thermal stress. The instant-on flash configuration eliminates external boot memory, reducing BOM cost and ensuring deterministic startup for safety-rated motor drives.
Recommended
IoT Edge Sensor Hub
The 10M04SAU169I7G is well matched to IoT edge sensor hubs where low power, compact size, and integrated peripherals matter. Its 4,000 LEs handle protocol stacks such as MQTT-SN, CoAP, or Modbus bridging alongside sensor pre-processing logic. The hard 12-bit ADC reads analog sensors directly, the on-chip flash stores both configuration and user data (firmware, calibration tables), and the 169-ball UFBGA fits in sub-15 mm sensor modules. Quartus Prime Lite development is free, keeping prototyping costs low for edge deployments.
Recommended
Industrial Protocol Bridge
The 10M04SAU169I7G serves as a multi-protocol industrial bridge - converting between RS-485, CAN, I2C, SPI, UART, and Ethernet - because its 130 user I/O pins and hard IP blocks support multiple serial interfaces simultaneously. With 4,000 LEs the device can host a soft Nios II or RISC-V core to run protocol stacks, and the on-chip flash stores configuration plus user firmware for instant-on deterministic boot. The I7 industrial temperature grade and integrated ADC for voltage rail monitoring fit DIN-rail mounted industrial controllers.
Recommended
Portable Test & Measurement
The 10M04SAU169I7G is well suited to portable test and measurement instruments because its low core voltage (1.2 V), integrated 12-bit ADC, and instant-on flash configuration support battery-powered, deterministic-startup handheld designs. The 4,000 LEs handle DSP filtering, FFT computation, and display-driving logic, while the hard PLLs generate precise sample clocks. The 169-ball UFBGA footprint fits in compact enclosures, and the industrial temperature rating supports outdoor or shop-floor use.
Recommended
Factory Automation I/O Expansion
The 10M04SAU169I7G works in factory automation I/O expansion modules because its 130 user I/O pins, hard PLLs, and DSP blocks provide the digital glue between sensors, actuators, and a host controller. The on-chip flash enables field firmware updates without external boot memory, the I7 industrial temperature grade handles cabinet temperatures up to +100 °C, and the integrated ADC monitors power rails and analog sensor inputs in real time. The deterministic instant-on boot eliminates race conditions at module power-up.
Recommended
Low-Cost Video Processing
The 10M04SAU169I7G handles entry-level video processing tasks such as image scaling, color-space conversion, and overlay generation because its DSP blocks accelerate pixel pipelines and its 4,000 LEs manage timing and synchronization. The hard PLLs generate pixel clocks, the LVDS-capable I/O banks interface directly to camera sensors and display panels, and the on-chip flash stores both configuration and lookup tables for gamma correction. The compact 11×11 mm U169 package is small enough for embedded vision modules.
Recommended
Recommended Products Summary
Engineering reference data for 10M04SAU169I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M04SAU169C8G | 10M04SAU169A7G | 10M04SAM153I7G | 10M04DAU324I7G |
|---|---|---|---|---|---|
| Package | 169-ball UFBGA (U169), 11×11 mm, 0.65 mm pitch | 169-ball UFBGA (U169) - same | 169-ball UFBGA (U169) - same | 153-ball MBGA - different | 324-ball UFBGA - different |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4,000 LE | 4,000 LE | 4,000 LE | 4,000 LE | 4,000 LE |
| Embedded Memory | 193,536 bits | 193,536 bits | 193,536 bits | 193,536 bits | 193,536 bits |
| Temperature Grade | Industrial -40 °C to +100 °C (I7) | Commercial 0 °C to +85 °C (C8) | Automotive -40 °C to +125 °C (A7) | Industrial -40 °C to +100 °C (I7) | Industrial -40 °C to +100 °C (I7) |
| Integrated ADC | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps |
| Maximum User I/O | 130 | 130 | 130 | 112 | 246 |
| Configuration | On-chip flash (instant-on) | On-chip flash (instant-on) | On-chip flash (instant-on) | On-chip flash (instant-on) | On-chip flash (instant-on) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Approximate Unit Price (qty 1) | $24.59 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Industrial temperature grade in U169 package (vs 10M04SAU169C8G)
- Automotive-grade sibling in same U169 footprint (vs 10M04SAU169A7G)
- Higher I/O count versus MBGA-package siblings (vs 10M04SAM153I7G)
Design Notes
The 169-ball UFBGA uses 0.65 mm ball pitch on an 11×11 mm body, which mandates a 4-layer or higher PCB stack-up with laser-drilled microvias (typically 0.25 mm pad, 0.4 mm via capture). Use the Intel MAX 10 device package guidelines and follow the breakout pattern from the reference design. Add filled thermal vias under the center balls to sink heat into inner copper planes; insufficient thermal via density will trigger a junction-temperature warning during Quartus Prime power analysis.
MAX 10 devices require multiple supply rails: a 1.2 V core (VCC), 1.8 V or 2.5 V/3.3 V auxiliary (VCCA), and per-bank VCCIO for each I/O bank. Estimated: at 4,000 LE utilization with the ADC and DSP blocks active, expect roughly 200-300 mA on the 1.2 V core. Decouple each rail with 10 µF bulk plus 0.1 µF and 1 nF ceramics placed within 2 mm of the supply pins, per the MAX 10 hardware design guide.
Place the configuration-mode jumper pins (MSEL[3:0]) on accessible header pads so the board can be reconfigured for AS, PS, or JTAG modes after assembly. Route the JTAG TCK/TMS/TDO/TDI to a 0.1 inch header for use with the USB-Blaster II download cable. Differential pairs (LVDS) require 100 Ω differential impedance and matched length within ±150 mils; consult the MAX 10 device handbook pin tables before locking the pin assignment in Quartus Prime.
Do not leave the ADC analog supply (VCCA_ADC) floating - the integrated 12-bit ADC will not function and Quartus Prime compilation will warn. Always verify the I/O bank voltage (VCCIO) matches the connected logic; mixing 1.8 V and 3.3 V signals on the same bank will damage the I/O buffers. When designing for industrial temperature, ensure the bitstream is generated with the industrial timing model - the commercial model will under-report hold violations.
Compliance Information
RoHS and REACH compliance per Intel FPGA product environmental documentation. AEC-Q100 qualification is NOT available on the I7 suffix - use the A7 automotive variant for AEC-Q100 designs.
