10M25DCF484I7G - MAX 10 FPGA 25K LE 484-BGA | Intel
부품 번호: 10M25DCF484I7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $61.27 | $61.27 |
| 10 | $58.71 | $587.10 |
| 100 | $54.36 | $5,436.00 |
| 500 | $49.82 | $24,910.00 |
| 1,000 | $45.1 | $45,100.00 |
10M25DCF484I7G 개요
A Field Programmable Gate Array (FPGA) is a reprogrammable digital logic device built from an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as PLLs, transceivers, multipliers, and memory controllers. FPGAs sit hierarchically within the broader taxonomy of programmable logic: CPLD (simpler, non-volatile, fast I/O) -> FPGA (higher density, SRAM or flash based) -> SoC FPGA (integrated CPU subsystem) -> ASIC (custom silicon). MAX 10 devices occupy the non-volatile low-end FPGA segment, replacing CPLDs and small ASICs in glue-logic, I/O expansion, and control-plane roles.
Key features include single-chip instantiation through on-chip flash, integrated analog-to-digital converters on selected variants, instant-on support, and dual-configuration flash images for fail-safe field upgrades. The 25K LE density supports moderate glue logic, custom peripheral implementations, and small protocol bridging designs. Hard IP blocks include up to 4 PLLs, embedded SRAM blocks of 9 Kbits (M9K) totaling 1,728 Kbits, and multiplier blocks for DSP operations, while the package delivers 360 user I/Os in a 1.0 mm pitch FineLine BGA.
The 10M25DCF484I7G uses a flash-backed configuration cell that retains the bitstream across power cycles, eliminating external boot PROMs. Internal dual-boot logic can store two images, allowing field reconfiguration and fail-safe rollback. The 484-ball FineLine BGA is optimized for high I/O count with manageable PCB routing complexity using standard BGA fanout rules.
Typical applications include industrial motor control, factory automation I/O expansion, low-cost video bridging, LED display controllers, sensor aggregation nodes, and portable medical instrumentation. The integrated flash and analog blocks reduce BOM count and PCB footprint versus discrete CPLD-plus-ADC implementations, which is the primary value proposition for the MAX 10 family.
Designers should plan power distribution carefully. Decoupling must include 100 nF ceramic capacitors on every VCCIO and VCCA supply pin placed within 100 mils of the ball, plus bulk capacitance. Ensure JTAG chain integrity for in-system programming, and verify that the Quartus Prime pin assignment matches the chosen board layout before committing to the 484-BGA footprint.
This page consolidates distributor pricing, drop-in alternative MAX 10 OPNs, and engineering notes beyond the manufacturer datasheet to accelerate board bring-up and sourcing decisions for engineers evaluating the 10M25DCF484I7G.
드롭인 대체품: 10M25DCF484I7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M25DCF484I7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Temperature Grade, PLLs, Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M25DAF484I7G
✅ 드롭인✓ 재고 있음
$99.8 / 개
데이터시트 보기 →10M25DCF484C8G
✅ 드롭인✓ 재고 있음
$42.1 / 개
데이터시트 보기 →10M40DCF484I7G
✅ 드롭인✓ 재고 있음
$71.48 / 개
데이터시트 보기 →10M50DCF484I7G
✅ 드롭인✓ 재고 있음
$99.6 / 개
데이터시트 보기 →10M25DCF484I7G 최대 정격 & 전기적 특성
| Family | MAX 10 |
| Logic Elements | 25,000 |
| Embedded Memory | 1,728 Kbits (M9K blocks) |
| User I/O Pins | 360 |
| 패키지 | 484-ball FineLine BGA (F484) |
| Ball Pitch | 1.0 mm |
| 공급 전압 | 1.2 V core |
| Configuration Memory | 5 Mb on-chip flash |
| Temperature Grade | Industrial (-40C to +100C), I7 suffix |
| PLLs | Up to 4 |
| Process Technology | 55 nm TSMC |
| 동작 온도 | -40C to +100C |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
10M25DCF484I7G 484-ball fineline bga (f484) 핀 구성 가이드
10M25DCF484I7G(484-ball fineline bga (f484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M25DCF484I7G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M25DCF484I7G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Factory Automation I/O Expansion, LED Display Controllers, Sensor Aggregation Nodes, Portable Medical Instrumentation, Low-Cost Video Bridging.
Industrial Motor Control
The 10M25DCF484I7G fits industrial motor control because its 25K logic elements implement PID loops, field-oriented control (FOC), and PWM generation for multi-axis drives, while the 360 user I/Os handle encoder feedback, Hall sensors, and gate-driver interfaces. The industrial temperature grade (I7 suffix, -40C to +100C) ensures reliable operation near motor housings with elevated ambient temperatures. On-chip flash eliminates boot PROMs, reducing BOM and board area, and the integrated ADC blocks (on selected variants) sample shunt currents directly without external analog front ends. Designers should allocate sufficient logic for the FOC math pipeline and reserve dedicated PLLs for PWM carrier generation to minimize jitter.
추천
Factory Automation I/O Expansion
In factory automation, the 10M25DCF484I7G serves as an I/O aggregator and protocol bridge, with its 360 I/Os interfacing to sensors, actuators, and fieldbus networks. The 25K LE budget supports Profinet, EtherCAT, or Modbus TCP protocol stacks alongside custom glue logic between PLC backplanes and edge devices. Dual-configuration flash allows safe field upgrades without downtime, critical for continuous-process factories. The 484-ball BGA package fits standard industrial SBC form factors, and the industrial temperature range tolerates cabinet environments with poor thermal management. Plan JTAG access for in-system programming and reserve 100 nF decoupling on every VCCIO bank.
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LED Display Controllers
The 10M25DCF484I7G drives large LED video walls by combining its 25K LE for pixel mapping, gamma correction, and refresh-rate conversion with its 360 I/Os for parallel data transmission to LED driver chains. On-chip M9K memory blocks (1,728 Kbits total) buffer scan-line data, while the four PLLs generate pixel clocks from any incoming video reference. Industrial temperature grade supports outdoor and semi-outdoor installations, and instant-on from flash eliminates the boot delay of SRAM-based FPGAs. Use Quartus Prime to map the 484-ball BGA fanout for clean signal routing on 4-layer PCBs.
추천
Sensor Aggregation Nodes
For IoT edge aggregation, the 10M25DCF484I7G consolidates multiple sensor streams (SPI, I2C, UART, GPIO) into a single uplink via its 25K LE implementing protocol conversion and on-chip filtering. The 360 user I/Os interface to dozens of sensors simultaneously, while 1,728 Kbits of embedded RAM act as a deep FIFO to absorb burst traffic before Ethernet or wireless transmission. Non-volatile flash configuration makes the node boot autonomously without external memory, reducing failure modes in remote deployments. Industrial temperature range supports outdoor enclosures and unconditioned industrial sites, and the low standby power of the 55 nm process extends battery life in solar-powered nodes.
추천
Portable Medical Instrumentation
The 10M25DCF484I7G suits portable medical devices such as patient monitors and handheld diagnostics because its low-power 55 nm process keeps battery drain minimal during continuous monitoring, and instant-on from flash reduces boot time for clinician-facing devices. The 25K LE implements signal conditioning, baseline wander removal, and alarm logic for ECG, SpO2, or temperature channels, while the 360 I/Os accept multiple analog front-end outputs. Industrial temperature grade ensures operation in ambulances and clinical environments with variable thermal conditions. The 484-ball BGA keeps the board footprint compact, critical for handheld form factors, and on-chip ADC blocks reduce external component count.
추천
Low-Cost Video Bridging
The 10M25DCF484I7G bridges video formats (MIPI, LVDS, CMOS parallel, HDMI) in consumer and prosumer equipment because its 25K LE handles timing conversion and color-space translation while the 360 I/Os accommodate multi-lane video buses. Four PLLs generate pixel clocks from non-standard sources, and 1,728 Kbits of embedded RAM provide line buffers for format conversion. Non-volatile flash configuration enables instant-on behavior for set-top boxes and video capture cards. The industrial temperature grade supports automotive rear-seat entertainment and industrial HMI panels, while the 484-ball BGA package simplifies multilayer PCB routing for high-speed differential pairs.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M25DCF484I7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M25DAF484I7G | 10M25DCF484C8G | 10M40DCF484I7G | 10M50DCF484I7G | 10M25DCF256I7G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-ball FineLine BGA (F484) | 484-ball FineLine BGA (F484) | 484-ball FineLine BGA (F484) | 484-ball FineLine BGA (F484) | 484-ball FineLine BGA (F484) | 256-ball FineLine BGA (F256) |
| Logic Elements | 25,000 | 25,000 | 25,000 | 40,000 | 50,000 | 25,000 |
| Temperature Grade | Industrial (I7, -40C to +100C) | Industrial (I7) | Commercial (C8, 0C to +85C) | Industrial (I7) | Industrial (I7) | Industrial (I7) |
| Embedded RAM | 1,728 Kbits | 1,728 Kbits | 1,728 Kbits | 2,304 Kbits | 2,638 Kbits | 1,728 Kbits |
| Configuration Memory | 5 Mb on-chip flash | 5 Mb on-chip flash | 5 Mb on-chip flash | 5 Mb on-chip flash | 5 Mb on-chip flash | 5 Mb on-chip flash |
주요 차별점
- Highest I/O count in the 25K-LE MAX 10 tier (vs 10M25DCF256I7G (F256 package))
- Industrial temperature grade at standard speed grade (vs 10M25DCF484C8G (commercial temperature))
- On-chip flash for instant-on boot (vs 10M40DCF484I7G (higher density, same family))
설계 노트
The 484-ball FineLine BGA uses 1.0 mm pitch, which is manageable on 4-layer PCBs but requires laser-drilled or precision mechanical microvias for inner-layer fanout. Use the Quartus Prime F484 pinout file to plan escape routing and ensure all VCCIO/VCCA balls have a 100 nF decoupling capacitor placed within 100 mils of the ball. Bulk 47 uF to 100 uF tantalum or polymer capacitors should sit near the package corner to support inrush during configuration flash access.
Estimated: the MAX 10 10M25 dissipates approximately 0.5-1.5 W typical depending on logic utilization and toggle rate. The F484 BGA package provides good thermal conductivity through the balls and PCB, so a thermal pad or heatsink is generally unnecessary below 70C ambient. For enclosed industrial cabinets above 70C, calculate junction temperature using the theta_JA value from the MAX 10 thermal model and add copper pours beneath the BGA to reduce junction temperature by 8-12 C/W.
Do not confuse the I7 suffix (industrial temperature, -40C to +100C) with the I8 grade used by some other FPGA families. Verify in Quartus Prime that the selected device matches the ordering code exactly; substituting 10M25DAF484I7G (D speed grade) for 10M25DCF484I7G (C speed grade) can change timing closure margins. Ensure JTAG chain integrity with a 10 kohm pull-up on TCK and TMS, and route TDI/TDO with impedance-controlled traces if running above 10 MHz.
For high-speed LVDS or external memory interfaces above 200 MHz, maintain 100 ohm differential impedance on paired traces and use length matching within 50 mils. The MAX 10 IO banks support LVDS via internal resistors, but only on designated LVDS-capable pins - check the Quartus pin planner before committing to a layout. Place series AC-coupling capacitors close to the transmitter for protocols requiring DC blocking.
규정 준수 정보
RoHS and REACH compliant per Altera (Intel) product page. Not AEC-Q100 qualified (the MAX 10 family targets industrial, not automotive safety). Halogen-free per JEDEC JS709B definition. Conflict-mineral reporting compliant per Intel policy.
