10M25DCF484A7G - MAX 10 FPGA, 25K LE, 484-BGA | Intel
부품 번호: 10M25DCF484A7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.1 | $821.00 |
| 100 | $74.3 | $7,430.00 |
| 500 | $67.8 | $33,900.00 |
| 1,000 | $62.5 | $62,500.00 |
10M25DCF484A7G 개요
A Field Programmable Gate Array (FPGA) is a programmable logic device that allows hardware designers to implement custom digital circuits after manufacturing, using configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as multipliers, block RAM, and PLLs. FPGAs occupy a tier in the digital logic hierarchy above simple microcontrollers and below custom ASICs, offering parallel processing capability, deterministic latency, and reconfigurability that makes them ideal for glue logic, I/O expansion, motor control, industrial communication protocols, and pre-ASIC prototyping. The MAX 10 family specifically targets low-power, non-volatile, cost-sensitive applications by integrating a configuration flash and an internal LDO voltage regulator on-chip, eliminating the need for external boot PROMs and regulators used in classic SRAM FPGAs.
Key features of the 10M25DCF484A7G include dual-configuration flash with self-refresh, 12 Kbit user flash for system-level parameter storage, a built-in ADC block (up to 12-bit, 1 MSPS, 17 channels) for analog sensor monitoring, instant-on support from <10 ms, and -40C to +125C (automotive AEC-Q100 grade) operating range. The device integrates an analog-to-digital converter and temperature-sensing diode, supporting industrial and automotive mixed-signal designs without external ADC ICs. The 484-ball FBGA package exposes up to 360 user I/O pins, accommodating LVDS, LVCMOS, SSTL, and other interface standards via Intel Quartus Prime pin assignment.
The MAX 10 architecture uses a 55 nm non-volatile process with embedded flash, supporting up to 300 MHz internal operation. Embedded memory is partitioned into 9 Kbit M9K blocks for distributed workloads, while 144 18x18 multipliers accelerate DSP algorithms such as FIR filters and motor-control transforms. The device supports external memory interfaces including DDR3, LPDDR2, and SRAM, controlled by four PLL-driven clock trees.
Typical applications include industrial motor control drives, programmable logic controllers (PLCs), automotive driver-assistance systems, sensor fusion hubs, factory automation gateways, and low-cost video processing pipelines. The integrated ADC simplifies analog front-end design for battery management and process control, while non-volatile instant-on behavior suits safety-critical and power-sequenced designs.
When designing with this device, verify that the FBGA-484 land pattern matches PCB manufacturing tolerances (typically 1.0 mm pitch), and confirm that the Quartus Prime device selection corresponds to speed grade -7 and the A7 commercial temperature option. Always check the latest Intel MAX 10 device handbook for I/O bank voltage constraints and configuration scheme selection.
This page synthesizes distributor inventory, drop-in alternatives from the same MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: 10M25DCF484A7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M25DCF484A7G (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Mounting Type, Package, PLLs, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M25DAF484A7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$52.75 / 개
데이터시트 보기 →10M25DCF484C8G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$42.1 / 개
데이터시트 보기 →10M25DCF484I7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$45.1 / 개
데이터시트 보기 →10M16DCF484A7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$51 / 개
데이터시트 보기 →10M50DAF484I7G
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$58.2 / 개
데이터시트 보기 →10M25DCF484A7G 최대 정격 & 전기적 특성
| Family | MAX 10 |
| Logic Elements (LE) | 25,000 |
| Embedded Block RAM | 1,728 Kbit |
| Multipliers (18x18) | 81 |
| Maximum User I/O | 360 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| 패키지 | 484-ball FBGA (F484) |
| Core Voltage | 1.2 V (internal LDO) |
| 동작 온도 | -40C to +125C (automotive AEC-Q100) |
| Speed Grade | -7 |
| Configuration Type | Dual flash, internal |
| User Flash | 12 Kbit (32 Kbyte user flash; total device flash larger) |
| ADC Block | 12-bit, 1 MSPS, 17 channels |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
10M25DCF484A7G 484-ball fbga (f484) 핀 구성 가이드
10M25DCF484A7G(484-ball fbga (f484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M25DCF484A7G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M25DCF484A7G 적합 용도: 6 애플리케이션s: Industrial Motor Control Drives, Programmable Logic Controller (PLC) CPU and I/O Expansion, Automotive Sensor Fusion and ADAS Pre-Processing, Industrial IoT Gateway and Edge Protocol Converter, Low-Cost Video Processing and Display Controllers, Pre-ASIC Prototyping and ASIC Emulation.
Industrial Motor Control Drives
The 10M25DCF484A7G's 25,000 logic elements and 81 dedicated 18x18 multipliers provide the DSP throughput needed for field-oriented control (FOC) of three-phase AC induction and permanent-magnet motors. The four integrated PLLs generate the high-resolution PWM carrier and quadrature encoder sampling clocks, while the integrated 12-bit 1 MSPS ADC samples motor phase currents and DC-bus voltage directly, eliminating an external ADC. The 360 user I/Os in the 484-FBGA package handle multiple encoder interfaces (EnDat, BiSS, Tamagawa), resolver excitation, and gate-driver PWM outputs simultaneously, with the AEC-Q100 -40C to +125C rating suiting drive cabinet environments.
추천
Programmable Logic Controller (PLC) CPU and I/O Expansion
PLC manufacturers use the 10M25DCF484A7G as an industrial bus controller and high-speed I/O expander, where 25K LE accommodates multiple IEC 61131-3 logic engines plus PROFIBUS, PROFINET, and EtherCAT slave interfaces. The 1,728 Kbit embedded block RAM buffers telegrams and process-image memory without external SRAM. Instant-on dual flash configuration is critical for deterministic PLC startup, and the integrated ADC monitors backplane voltages and temperature sensors. The 484-FBGA package's 360 I/Os interface directly to digital input modules, opto-isolated outputs, and serial high-speed links without external muxing.
추천
Automotive Sensor Fusion and ADAS Pre-Processing
The 10M25DCF484A7G's AEC-Q100 qualification and -40C to +125C automotive temperature grade make it suitable for in-cabin and chassis-mounted sensor-fusion ECUs that aggregate radar, ultrasonic, and camera data before forwarding to the central ADAS processor. 81 18x18 multipliers run Kalman and lane-detection pre-filters in parallel; 360 I/Os interface directly to multiple LVDS camera links and CAN-FD transceivers. The integrated ADC samples up to 17 analog sensors (steering angle, brake pressure, IMU outputs), and non-volatile instant-on ensures the ECU is operational within the engine-start latency budget.
추천
Industrial IoT Gateway and Edge Protocol Converter
Industrial edge gateways based on the 10M25DCF484A7G translate between legacy fieldbus protocols (Modbus RTU, CAN, RS-485) and modern Ethernet-based protocols (OPC-UA, MQTT, TSN) without an external processor. The 25K LE accommodates multiple soft-core CPUs (Nios II) plus protocol stacks; 1,728 Kbit embedded RAM buffers message queues. The integrated ADC monitors power-rail voltage and temperature, supporting predictive maintenance telemetry. The 484-FBGA package's 360 I/Os enable connection to multiple isolated serial ports, Ethernet PHYs, and 4G/5G modem modules simultaneously in a fanless industrial housing.
추천
Low-Cost Video Processing and Display Controllers
The 10M25DCF484A7G with 25K LE and 81 multipliers handles 720p/1080p video pipelines including color-space conversion, scaling, and on-screen display overlay in medical imaging, industrial HMIs, and digital signage. The 1,728 Kbit embedded block RAM stores frame buffers for partial image processing. Four PLLs generate pixel clocks for HDMI, LVDS, and RGB panel interfaces. The 360 I/Os interface directly to camera sensor MIPI bridges and parallel LCD panels, with the integrated ADC providing touch-screen and backlight voltage monitoring.
추천
Pre-ASIC Prototyping and ASIC Emulation
The 10M25DCF484A7G serves as a pre-silicon validation platform for ASIC designs, where 25K LE accommodates RTL modules for functional verification and firmware-hardware co-debug before tape-out. Quartus Prime supports incremental compilation and SignalTap logic analyzer, enabling real-time RTL-level debug. The 484-FBGA package exposes enough I/Os to map the full ASIC pad ring. The integrated ADC supports analog mixed-signal ASIC verification, and non-volatile instant-on behavior allows fast design-iteration cycles without reconfiguring external boot memories.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M25DCF484A7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M25DAF484A7G | 10M25DCF484C8G | 10M25DCF484I7G | 10M16DCF484A7G |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (F484) | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 16,000 |
| Embedded Block RAM | 1,728 Kbit | 1,728 Kbit | 1,728 Kbit | 1,728 Kbit | 1,152 Kbit |
| Multipliers (18x18) | 81 | 81 | 81 | 81 | 45 |
| Maximum User I/O | 360 | 360 | 360 | 360 | 320 |
| Operating Temperature | -40C to +125C (AEC-Q100) | -40C to +125C (AEC-Q100) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +125C (AEC-Q100) |
| Speed Grade | -7 | -7 | -8 | -7 | -7 |
주요 차별점
- Highest logic-element density in same 484-FBGA footprint with AEC-Q100 grade (vs 10M16DCF484A7G)
- Automotive temperature grade -40C to +125C (vs 10M25DCF484C8G)
- Lower-cost same-package downgrade path (vs 10M25DCF484A7G (this part))
설계 노트
Estimated: at 25C ambient and full logic utilization with 50% toggle rate, the 10M25DCF484A7G typically dissipates 1.2-1.8 W. The 484-FBGA package uses a 1.0 mm ball pitch; a minimum 4-layer PCB with dedicated inner GND plane is required for heat spreading. Place thermal vias in a grid pattern directly under the BGA to reduce junction-to-ambient thermal resistance. For designs approaching +85C ambient or with sustained high toggle rates, attach a small heatsink or use forced airflow.
The 484-FBGA with 1.0 mm pitch requires 0.5 mm pad diameter and 0.4 mm solder-mask openings per IPC-7351. Use ENIG surface finish for fine-pitch BGA and reflow in nitrogen atmosphere to prevent solder-ball oxidation. Implement at least 6 ground vias in the central ball-grid region to stitch the top GND pour to internal planes. Series-dampening resistors on clock outputs should be placed within 5 mm of the BGA balls to control signal-integrity reflections.
MAX 10 FPGAs operate from a single 3.3 V supply; the internal LDO generates 1.2 V for the core, eliminating the need for an external core regulator. Decouple the VCCIO bank supplies (1.2 V to 3.3 V depending on I/O standard) with one 100 nF X7R ceramic capacitor per bank plus one 10 uF bulk capacitor near the FPGA. Place the bulk capacitor within 10 mm of the supply balls. Program the MAX 10 device features in Quartus Prime to enable the internal temperature-sensing diode for thermal monitoring.
Do not confuse the 10M25DCF484A7G (automotive temp) with the 10M25DCF484C8G (commercial temp) - the C8 variant operates only 0C to +85C and will fail in chassis-mounted industrial installations. When migrating between MAX 10 density points, verify that the I/O bank voltage assignments match the new device's pinout - bank 1A, 1B, 2, 3, 4, 5, 6, 7, 8 placements differ slightly across 10M08/10M16/10M25/10M50 in the same F484 package. Always re-run pin assignment in Quartus Prime after density migration.
규정 준수 정보
RoHS and REACH compliance per Intel product declaration. AEC-Q100 qualified for automotive applications per ordering code 'A' suffix. Lead-free and halogen-free per Intel MAX 10 family datasheet environmental specifications.