5M2210ZF256I5 - MAX V CPLD, 1700 LE, FBGA-256 | Intel
부품 번호: 5M2210ZF256I5 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.8 | $2,980.00 |
| 500 | $26.45 | $13,225.00 |
| 1,000 | $23.9 | $23,900.00 |
5M2210ZF256I5 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL-like macro-cell arrays with a central interconnect matrix. In the system hierarchy, a CPLD sits between simple logic gates / PALs (lowest density) and FPGAs (highest density, highest power, volatile SRAM-based configuration). MAX V CPLDs use a flash-backed configuration cell so the device wakes up with its logic already loaded in under 1 ms, which is a critical advantage over SRAM-based FPGAs that need external boot memory.
Key features include 1700 macro cells (logical elements), up to 212 user I/O pins (package-dependent), 1.8 V core with multi-voltage I/O support (1.2 V to 3.3 V on banked pins), a built-in flash configuration block, and JTAG (IEEE 1149.1) + in-system programmability via Intel Quartus II / Quartus Prime. The 201.1 MHz fMAX applies to the internal logic-array interconnect and is not the same as I/O toggle rate. The FBGA-256 package provides a 1.0 mm ball pitch and a thermal resistance (θJA) suitable for forced-air industrial environments when the top-of-package airflow is moderate.
Typical applications include bus-interface bridging (e.g., parallel-to-LVDS, I2C/SPI glue logic, address decoding and chip-select generation), industrial control (PLC I/O expansion, motor-control signal conditioning), communications infrastructure (line-card glue logic in routers and switches), and consumer/automotive infotainment (display timing, key-scanning, and LED-matrix multiplexing).
When designing with the 5M2210ZF256I5, pay attention to I/O bank voltage grouping. Each I/O bank can be powered independently, but mixing 1.5 V and 3.3 V in the same bank is not allowed. Use Intel's online MAX V device handbook and Quartus Prime power estimator early in the design to verify that worst-case I/O current and toggle rates stay within thermal limits of the FBGA-256 substrate.
드롭인 대체품: 5M2210ZF256I5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5M2210ZF256I5 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Programming Interface, Configuration Memory, Operating Temperature, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5M2210ZF256C5N
✅ 드롭인✓ 재고 있음
$11.95 / 개
데이터시트 보기 →5M2210ZF256A5N
✅ 드롭인✓ 재고 있음
$20.9 / 개
데이터시트 보기 →5M2210ZF256I5N
✅ 드롭인✓ 재고 있음
$17.5 / 개
데이터시트 보기 →5M1270ZF256I5N
✅ 드롭인✓ 재고 있음
$7.55 / 개
데이터시트 보기 →5M1270ZF256C5N
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →5M2210ZF256I5 최대 정격 & 전기적 특성
| Family | MAX V |
| Device | 5M2210Z |
| Logic Elements (Macro Cells) | 1700 |
| Maximum Internal Frequency (fMAX) | 201.1 MHz |
| Core Supply Voltage | 1.8 V |
| User I/O (max, package-dependent) | 212 |
| 패키지 | FBGA-256 (256-ball FineLine BGA) |
| Ball Pitch | 1.0 mm |
| Configuration Memory | Non-volatile flash |
| Operating Temperature (Industrial) | -40C to +100C |
| Programming Interface | JTAG (IEEE 1149.1) / in-system |
| I/O Bank Voltages Supported | 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Tray Standard Quantity | 119 |
5M2210ZF256I5 핀 구성
| 핀 A1 | I/O — General-purpose user I/O (bank 1) |
| 핀 B1 | I/O — General-purpose user I/O (bank 1) |
| 핀 C1 | VCCIO1 — I/O bank 1 supply voltage |
| 핀 D1 | I/O — General-purpose user I/O (bank 1) |
| 핀 E1 | I/O — General-purpose user I/O (bank 1) |
| 핀 F1 | GND — Ground |
| 핀 G1 | I/O — General-purpose user I/O (bank 1) |
| 핀 H1 | I/O — General-purpose user I/O (bank 1) |
일반적인 애플리케이션
5M2210ZF256I5 적합 용도: 7 애플리케이션s: Industrial Bus-Interface Bridging, Telecom Line-Card Glue Logic, Automotive Infotainment Display Timing, Motor-Control Signal Conditioning, Consumer LED-Matrix Multiplexing, Medical Device I/O Expansion, Server / Datacenter Board Management.
Industrial Bus-Interface Bridging
The 5M2210ZF256I5 is a strong fit for industrial bus-bridging tasks because its 1700 macro cells and 212 user I/O can host multiple parallel-to-serial bridges (e.g., parallel bus to SPI, I2C, or UART) on one non-volatile device. With a 1.8 V core and four independent I/O banks (1.2-3.3 V), the part can connect a 3.3 V MCU, a 1.8 V image sensor, and a 1.5 V DDR memory controller without external level shifters. Its instant-on flash configuration wakes the system in under 1 ms - critical for industrial PLCs that must respond to safety inputs immediately on power-up.
추천
Telecom Line-Card Glue Logic
In telecom line cards, the 5M2210ZF256I5 handles chip-select decoding, interrupt aggregation, and clock-domain crossing between line-card ASICs, FPGAs, and backplane SERDES links. The 201.1 MHz fMAX and 1.8 V core allow synchronous operation up to 100 MHz on the I/O, while per-bank voltage translation (1.5 V HSTL, 2.5 V LVCMOS, 3.3 V LVTTL) interfaces legacy ASICs. Non-volatile configuration means line cards boot to a known-good state after a power-cycle without external boot memory.
추천
Automotive Infotainment Display Timing
Inside an automotive infotainment head unit, the 5M2210ZF256I5 generates display-timing signals (HSYNC, VSYNC, DE, pixel clock) for LVDS or TTL LCD panels and routes touch-controller interrupts to the host SoC. Its wide industrial-grade temperature range (-40C to +100C) and multi-voltage I/O bank support tolerate the under-hood and dashboard thermal environment. Compared with an FPGA, the MAX V's near-zero standby current and instant-on behaviour suit CAN/LIN wake-up scenarios when the infotainment system is parked but monitoring for driver input.
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Motor-Control Signal Conditioning
The 5M2210ZF256I5 conditions encoder-quadrature (QEP) inputs, generates PWM blanking windows, and implements fault-input prioritisation for a 3-phase motor drive. With up to 212 user I/O, multiple encoder and Hall-sensor channels can be processed in parallel, and the 1.8 V core plus 3.3 V-tolerant I/O handles both low-voltage MCUs and 5 V gate-driver interfaces. Non-volatile configuration means the motor controller resumes safe braking immediately after a brown-out without a slow FPGA boot.
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Consumer LED-Matrix Multiplexing
For large LED-matrix signage and architectural lighting, the 5M2210ZF256I5 multiplexes rows and columns at high refresh rates while the host MCU streams pixel data over SPI. The 201.1 MHz fMAX supports thousands of LED updates per refresh, and the FBGA-256 footprint exposes enough I/O for 16+ row lines plus several colour-channel PWMs. Multi-voltage bank support lets the CPLD directly drive 3.3 V LED-driver shift registers without external buffers.
추천
Medical Device I/O Expansion
Patient-monitoring and diagnostic instruments use the 5M2210ZF256I5 to expand the I/O count of a system-on-module by adding isolated UART, SPI, and GPIO channels for sensors, keypads, and alarms. The non-volatile instant-on configuration and industrial temperature range satisfy medical-device reliability expectations, while 1.8-3.3 V I/O bank support connects legacy 3.3 V sensor ASICs and modern 1.8 V SoCs without external level translation. CPLD density (1700 LE) is enough to host multiple soft UARTs and debounce logic simultaneously.
추천
Server / Datacenter Board Management
Inside a 1U server, the 5M2210ZF256I5 handles board-management glue: I2C muxing between the BMC and dozens of downstream sensors, hot-swap LED control, and POST-code latching for the BIOS. Multi-voltage I/O banks (1.0/1.2/1.5/1.8/2.5/3.3 V) let the CPLD bridge between modern low-voltage BMC SoCs and legacy 3.3 V peripherals. Non-volatile flash configuration boots in under 1 ms - essential for fault logging that must survive a hang or brown-out.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5M2210ZF256I5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5M2210ZF256C5N | 5M2210ZF256A5N | 5M2210ZF256I5N | 5M1270ZF256I5N | 5M1270ZF256C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-256 | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Family | MAX V | MAX V | MAX V | MAX V | MAX V | MAX V |
| Macro Cells (LE) | 1700 | 1700 | 1700 | 1700 | 980 (-42%) | 980 (-42%) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| User I/O (max) | 212 | 212 | 212 | 212 | 212 | 212 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Automotive (-40C to +125C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Configuration Memory | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash | Non-volatile flash |
주요 차별점
- Higher density in the same FBGA-256 footprint vs 5M1270ZF256I5N (vs 5M1270ZF256I5N)
- Industrial temperature range vs commercial-only alternative (vs 5M2210ZF256C5N)
- Non-volatile instant-on configuration vs SRAM-based FPGAs (vs 10M08SAE144C8G (MAX 10 FPGA))
설계 노트
The 5M2210ZF256I5 requires a clean 1.8 V (±5%) VCCINT rail and per-bank VCCIO supplies at 1.2 / 1.5 / 1.8 / 2.5 / 3.3 V. Place a 0.1 µF X7R decoupling capacitor within 5 mm of every VCCINT ball and a 10 µF bulk capacitor per power plane. Estimated: at 50% I/O toggle and 50 MHz, IICCINT is roughly 30-50 mA plus I/O bank current - design the 1.8 V regulator for at least 200 mA headroom. Power-on sequence: VCCINT must come up before or simultaneously with any VCCIO bank that drives into a powered rail.
The FBGA-256 uses a 1.0 mm ball pitch. Use a 4-layer or 6-layer PCB stack-up with a continuous ground plane directly under the BGA to provide both thermal spreading and a low-impedance return path. Fan-out via dog-bone or micro-via (laser-drilled 0.1 mm vias on 0.4 mm pad) is recommended; via-in-pad is acceptable but increases assembly cost. Match JTAG trace lengths (TCK/TMS/TDO/TDI) within 25 mm to keep the BSDL-defined TCK rise/fall requirements within spec.
Although MAX V CPLDs are not as speed-critical as FPGAs, controlled-impedance routing (50 Ω single-ended, 100 Ω differential) is still required for clock inputs and JTAG. Series-termination resistors (22-33 Ω) on heavily-loaded clocks reduce overshoot. For LVDS pairs (supported on certain MAX V I/O banks), keep length matching within 0.13 mm to maintain the ±150 ps intra-pair skew requirement. Estimated: at 100 MHz toggle, an unterminated net longer than 50 mm may ring and cause metastability on input pins.
Do NOT mix 1.5 V and 3.3 V rails within the same I/O bank - all pins in one bank must share VCCIO. Mixing I/O standards across banks is allowed. When migrating from the 5M2210ZF256I5 to the 5M2210ZF324I5N, plan for a footprint change (324-ball BGA vs 256-ball BGA) - they are NOT pin-compatible. Always regenerate the Quartus Prime pin-out file (.pin) and re-validate the BSDL chain before taping out a new PCB revision.
규정 준수 정보
RoHS and REACH compliance per Intel MAX V product page. Industrial temperature grade -40C to +100C. AEC-Q100 grade: not applicable; the A-suffix (5M2210ZF256A5N) is the automotive-grade variant.
