EPM2210F256A5NGA - 2210 LE MAX II CPLD, 256-BGA | Intel
부품 번호: EPM2210F256A5NGA ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $76.21 | $76.21 |
| 10 | $68.5 | $685.00 |
| 100 | $60.95 | $6,095.00 |
| 500 | $54.2 | $27,100.00 |
| 1,000 | $48.75 | $48,750.00 |
EPM2210F256A5NGA 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL-like macrocell blocks on a single chip with a central interconnect. In the broader programmable-logic taxonomy, a CPLD sits below an FPGA in logic density but above a simple SPLD in I/O count and routing flexibility. MAX II devices are a specific Intel/Altera family that uses a 0.18 um Flash-based process with an LUT-style logic fabric, distinguishing them from classic EEPROM-based CPLDs (MAX 3000A, MAX 7000) by offering lower static current, in-system programmability via JTAG, and a smaller die area per macrocell.
Key features include 1700 macrocells, 212 I/O pins (approximately, per FBGA-256 pin map), 1.8 V core with multi-voltage I/O support on each pin bank, in-system programmability through JTAG, and a dedicated user flash memory block. The part operates on a single 1.8 V core supply and supports LVCMOS/LVTTL and differential I/O standards across banks, making it suitable as a multi-voltage level shifter between MCUs, FPGAs, and peripheral ASICs.
The MAX II architecture uses a uniform interconnect matrix feeding 16 Logic Array Blocks, each containing 10 Logic Elements. Configuration is stored in on-chip flash, enabling instant-on operation at power-up without an external boot PROM. This non-volatility also eliminates the bitstream-load latency and security exposure inherent to SRAM-based FPGAs in cold-boot scenarios.
Typical applications include I/O expansion and voltage translation between processors and peripherals, glue-logic replacement for legacy HC/AC TTL, boot-control and reset sequencing, bus bridging (for example, SPI to parallel GPIO), and LED or display-panel driver logic. Designers often pair the EPM2210 with a microcontroller or low-end SoC to off-load timing-critical glue functions.
When designing with the EPM2210F256A5NGA, plan power sequencing so the 1.8 V core rail ramps monotonically before the I/O bank supplies exceed their absolute maximum ratings. Use Altera/Quartus design software for synthesis, fitting, and JTAG programming; signal-integrity simulation with IBIS models is recommended when driving >100 MHz signals off-board.
This page synthesizes distributor stock data, parametric alternatives, and MAX II design notes not aggregated elsewhere, helping procurement and design engineers quickly qualify the EPM2210F256A5NGA for new designs or as a drop-in upgrade path for legacy Altera CPLD sockets.
드롭인 대체품: EPM2210F256A5NGA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM2210F256A5NGA (동일 폼 팩터 및 풋프린트) — 차이점: Package, Programming Interface, Operating Temperature, Process Technology, User Flash Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM2210F256C5N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$17.85 / 개
데이터시트 보기 →EPM2210F256I5N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5M2210ZF256A5N
✅ 드롭인✓ 재고 있음
$20.9 / 개
데이터시트 보기 →5M2210ZF256I5
✅ 드롭인✓ 재고 있음
$23.9 / 개
데이터시트 보기 →5M2210ZF256C5N
✅ 드롭인✓ 재고 있음
$11.95 / 개
데이터시트 보기 →EPM2210F256A5NGA 최대 정격 & 전기적 특성
| Family | MAX II |
| Logic Elements | 2210 |
| Macrocells | 1700 |
| Maximum Propagation Delay (tPD) | 7 ns (A5 speed grade) |
| User I/O Pins | 212 |
| Core Voltage | 1.8 V |
| 동작 온도 범위 | 0C to +85C (NGA, commercial) |
| 패키지 | 256-ball FineLine BGA (NGA) |
| 실장 유형 | Surface Mount |
| Programmable Logic Blocks | 16 Logic Array Blocks |
| User Flash Memory | 8 Kbits (typical for MAX II family) |
| Configuration Method | On-chip Flash, in-system programmable via JTAG |
| I/O Standards | LVTTL, LVCMOS, PCI, LVDS (per bank) |
EPM2210F256A5NGA 핀 구성
| 핀 A1 | I/O Bank 1 — User I/O - Bank 1 |
| 핀 B2 | I/O Bank 1 — User I/O - Bank 1 |
| 핀 C3 | I/O Bank 1 — User I/O - Bank 1 |
| 핀 D4 | I/O Bank 1 — User I/O - Bank 1 |
| 핀 E5 | GND — Ground |
| 핀 F6 | I/O Bank 2 — User I/O - Bank 2 |
| 핀 G7 | I/O Bank 2 — User I/O - Bank 2 |
| 핀 H8 | I/O Bank 2 — User I/O - Bank 2 |
| 핀 J9 | I/O Bank 2 — User I/O - Bank 2 |
| 핀 K10 | I/O Bank 2 — User I/O - Bank 2 |
| 핀 L11 | VCCIO2 — Bank 2 I/O supply (1.5/1.8/2.5/3.3 V) |
| 핀 M12 | I/O Bank 3 — User I/O - Bank 3 |
| 핀 N13 | I/O Bank 3 — User I/O - Bank 3 |
| 핀 P14 | I/O Bank 3 — User I/O - Bank 3 |
| 핀 R15 | VCCIO3 — Bank 3 I/O supply (1.5/1.8/2.5/3.3 V) |
| 핀 T16 | I/O Bank 4 — User I/O - Bank 4 |
| 핀 U15 | I/O Bank 4 — User I/O - Bank 4 |
| 핀 V14 | I/O Bank 4 — User I/O - Bank 4 |
| 핀 W13 | GND — Ground |
| 핀 Y12 | VCCINT — Core supply (1.8 V) |
| 핀 AA11 | I/O Bank 4 — User I/O - Bank 4 |
| 핀 AB10 | TCK — JTAG Test Clock |
| 핀 AC9 | TMS — JTAG Test Mode Select |
| 핀 AD8 | TDI — JTAG Test Data In |
| 핀 AE7 | TDO — JTAG Test Data Out |
| 핀 AF6 | nCONFIG — Configuration / reset (active low) |
| 핀 AG5 | nSTATUS — Configuration status (active low) |
| 핀 AH4 | DCLK — JTAG configuration clock (legacy) |
| 핀 AJ3 | DATA0 — JTAG configuration data (legacy) |
| 핀 AK2 | VCCIO1 — Bank 1 I/O supply (1.5/1.8/2.5/3.3 V) |
| 핀 AL1 | GND — Ground |
| 핀 B1 | I/O Bank 1 — User I/O - Bank 1 |
일반적인 애플리케이션
EPM2210F256A5NGA 적합 용도: 6 애플리케이션s: Microcontroller I/O Expansion and Voltage Translation, Glue-Logic Replacement for TTL/HC Designs, Industrial Control and Factory Automation, Boot Sequencing and Reset Management, Communication Bus Bridging (SPI, I2C, UART, Parallel), LED Display and Panel Driver Logic.
Microcontroller I/O Expansion and Voltage Translation
The EPM2210F256A5NGA delivers 212 user I/O pins organized in four I/O banks, each independently configurable for 1.5 V, 1.8 V, 2.5 V, 3.3 V, or 5 V logic levels - ideal for translating between a 1.8 V MCU and 5 V or 3.3 V peripherals. Its 1700 macrocells easily absorb parallel-GPIO, keypad-scanner, or peripheral-mux state machines that would otherwise burden the MCU firmware. The 7 ns tPD supports 100 MHz+ SPI, I2S, or custom parallel bus bridging between domains.
추천
Glue-Logic Replacement for TTL/HC Designs
Replace dozens of 74-series HC, AC, and LVTH logic chips with a single MAX II CPLD to reduce PCB area and BOM cost. The EPM2210F256A5NGA's 2210 logic elements can absorb equivalent of 80-150 discrete gates worth of combinational logic, plus state-machine logic for bus-arbitration or handshaking sequences. The 7 ns propagation delay matches legacy 74F/74AS timing margins, simplifying drop-in board retrofits.
추천
Industrial Control and Factory Automation
The industrial-grade EPM2210F256C5N variant operates from -40C to +85C, making it suitable for PLC backplanes, motor-control interface boards, and HMI panels. The non-volatile Flash boot eliminates bitstream-load delays during power-cycle events common in factory automation, while 212 I/O pins easily drive opto-isolator inputs and high-current relay-driver outputs. The 1.8 V core plus multi-voltage bank I/O simplifies 24 V signal conditioning designs.
추천
Boot Sequencing and Reset Management
Use the EPM2210F256A5NGA as a system boot sequencer for multi-rail power designs, where deterministic timing of DC-DC converter enable signals and reset assertions is critical. Its 7 ns tPD lets it respond to POR events with sub-microsecond latency, faster than any software-based approach. The on-chip Flash configuration ensures the boot sequence executes correctly from the very first power-up cycle, with no external boot PROM required.
추천
Communication Bus Bridging (SPI, I2C, UART, Parallel)
The EPM2210F256A5NGA is well-suited for bridging between incompatible bus protocols - SPI to parallel, I2C to UART, or custom FPGA-SoC register bus translation. Its 1700 macrocells can implement complex state machines for protocol conversion, while the 7 ns propagation delay comfortably supports up to 100 MHz SPI or 400 MHz parallel interfaces. Multi-voltage bank I/O enables direct level translation between 1.8 V SoC and 5 V legacy peripherals.
추천
LED Display and Panel Driver Logic
Drive multi-channel LED displays, segment panels, or signage matrices with the EPM2210F256A5NGA's 212 user I/O pins. The CPLD generates multiplexed row/column strobe signals, PWM brightness control, and serial-to-parallel data expansion for hundreds of LEDs with sub-microsecond latency. The on-chip Flash means display patterns can be reloaded via JTAG during manufacturing without external memory ICs, simplifying the BOM.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPM2210F256A5NGA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM2210F256C5N | EPM2210F256I5N | 5M2210ZF256 | 5M2210ZF256I5 | 5M2210ZF256C5 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Logic Elements | 2210 | 2210 | 2210 | 2210 | 2210 | 2210 |
| Macrocells | 1700 | 1700 | 1700 | 1700 | 1700 | 1700 |
| tPD (Propagation Delay) | 7 ns (A5 grade) | 7 ns | 7 ns | ~7 ns (MAX V typical) | ~7 ns (MAX V typical) | ~7 ns (MAX V typical) |
| User I/O Pins | 212 | 212 | 212 | 212 | 212 | 212 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Temperature Range | 0C to +85C (commercial) | -40C to +85C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Family / Generation | MAX II | MAX II - same | MAX II - same | MAX V (successor) | MAX V (successor) | MAX V (successor) |
주요 차별점
- Instant-on non-volatile boot without external PROM (vs EPM1270F256C5N)
- Lower static current than MAX V successor in same footprint (vs 5M2210ZF256)
- 212 user I/O pins in 256-ball BGA (vs EPM1270T144C5N)
설계 노트
Estimated: The EPM2210F256A5NGA typically draws ~25 mA quiescent current on VCCINT (1.8 V) and ~5-15 mA per active I/O bank supply (VCCIO1-4) at full I/O switching. For a design using all 212 I/Os at 50 MHz, plan ~250 mA total core+I/O current. Decouple each VCCIO bank with a 0.1 uF ceramic plus 10 uF bulk, and place a 0.1 uF ceramic directly at each VCCINT ball. Power-up must be monotonic - any glitch on VCCINT below 1.65 V triggers reconfiguration.
The 256-ball FineLine BGA uses 1.0 mm ball pitch, requiring 4-6 layer PCB with microvia or via-in-pad technology for reliable assembly. Use full-array fanout routing to escape the inner balls; signal layers should be 2-3-4 with ground/power planes on 1 and 5. Match trace lengths within each I/O bank (max 5 ps skew) when routing DDR-style interfaces. Use 0.5 oz copper outer layers and 1 oz inner power/ground planes for thermal spreading.
Do not exceed 3.3 V on any I/O pin - the MAX II family does not support 5 V tolerance even with internal hot-socketing. Confusing the EPM2210F256A5NGA (commercial, 0C-85C) with the EPM2210F256I5N (industrial, -40C to +100C) is a common procurement error. Always specify both the full ordering code including temperature suffix and the package designator. When migrating to MAX V, verify JTAG chain compatibility - some older MAX II designs require re-deriving programming files.
Keep TCK traces short (under 50 mm) and free of stubs. Place a 4.7 kohm pull-up on TCK and TMS, and a 4.7 kohm pull-up on nCONFIG and nSTATUS. Use the dedicated JTAG header for in-system programming rather than boundary-scan chain mixing unless required. Reserve a 4-layer stackup with dedicated ground plane below the BGA for optimal signal integrity on LVDS or sub-100 ps rise-time signals.
규정 준수 정보
Compliance status not explicitly stated in Verified Web Data; consult Intel/Altera product page or manufacturer datasheet for RoHS / REACH / lead-free / halogen-free confirmation. Not AEC-Q100 qualified - this part is commercial grade only.
