5M2210ZF324I5 - 1700-Macrocell MAX V CPLD, 1.8V, 324-BGA | Intel
부품 번호: 5M2210ZF324I5 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.95 | $2,895.00 |
| 250 | $26.4 | $6,600.00 |
| 500 | $23.85 | $11,925.00 |
5M2210ZF324I5 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL-like macrocell blocks with a programmable interconnect matrix. In the modern component hierarchy it sits alongside FPGAs in the programmable-logic category, but it is distinct from FPGAs in three practical ways: (1) non-volatile configuration that powers up instantly, (2) deterministic propagation delay typically measured in nanoseconds rather than tens of nanoseconds, and (3) lower logic density at lower cost and power. MAX V CPLDs are commonly used as glue logic, bus bridges, and interface controllers in industrial, automotive, telecom, and consumer systems.
Key features of the 5M2210ZF324I5 include 1700 macrocells, 2210 logic elements-equivalent, 324 user I/O balls organized as a fine-pitch BGA, and 7 ns pin-to-pin logic delay. The device integrates 8 Kbits of user flash memory and supports in-system programmability through JTAG. Designers can place the device between a processor and peripheral bus, where its deterministic timing simplifies protocol decoding and its non-volatile boot avoids FPGA-style configuration memory on the board.
Architecturally, the MAX V family uses a multi-volt I/O architecture that allows each bank to operate independently at 1.2V, 1.5V, 1.8V, 2.5V, or 3.3V, which simplifies bridging between modern low-voltage processors and legacy 3.3V peripherals. The Flash-based configuration cell eliminates the external configuration PROM that older CPLDs required, reducing board area and BOM cost.
Typical applications include I/O expansion and voltage translation for industrial controllers, glue logic for ASIC/FPGA designs, bus decoding in telecom backplane equipment, and power-up sequencing in multi-rail systems. Designers also use the 5M2210ZF324I5 as a low-cost state-machine engine in motor-control and HMI modules where instant-on behavior is required.
When designing with the 5M2210ZF324I5, verify that the PCB footprint accommodates the 1.0 mm pitch 324-ball LBGA layout and that the JTAG chain is accessible for in-system programming. Because the part shares its family with several pin-compatible speed-grade and temperature variants, designers can scale logic capacity without redesigning the PCB.
This page synthesizes distributor pricing, drop-in alternatives from the same MAX V family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: 5M2210ZF324I5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5M2210ZF324I5 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Programming Interface, Configuration Memory, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5M2210ZF324C5N
✅ 드롭인✓ 재고 있음
$8.4 / 개
데이터시트 보기 →5M2210ZF324C4N
✅ 드롭인✓ 재고 있음
$22.45 / 개
데이터시트 보기 →5M2210ZF324A5N
✅ 드롭인✓ 재고 있음
$44.25 / 개
데이터시트 보기 →5M1270ZF324C5N
✅ 드롭인✓ 재고 있음
$7.5 / 개
데이터시트 보기 →5M1270ZF324C4N
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →5M1270ZF324A5N
✅ 드롭인✓ 재고 있음
$17.85 / 개
데이터시트 보기 →5M2210ZF324I5 최대 정격 & 전기적 특성
| Product Family | MAX V CPLDs |
| Device Model | 5M2210Z |
| Macrocells | 1700 |
| Logic Elements | 2210 |
| User I/O Pins | 324 |
| 패키지 | 324-ball LBGA (1.0 mm pitch) |
| Core Voltage | 1.8 V |
| Pin-to-Pin Delay (tPD) | 7 ns |
| User Flash Memory | 8 Kbits |
| Configuration Memory | On-chip Flash (non-volatile) |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| 동작 온도 | -40C to +100C (Industrial) |
| I/O Bank Voltage Support | 1.2V / 1.5V / 1.8V / 2.5V / 3.3V |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
5M2210ZF324I5 324-ball lbga (1.0 mm pitch) 핀 구성 가이드
5M2210ZF324I5(324-ball lbga (1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5M2210ZF324I5.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5M2210ZF324I5 적합 용도: 6 애플리케이션s: Industrial PLC I/O Expansion and Voltage Translation, Telecom Backplane Bus Decoder, Power-Up Sequencing Controller for Multi-Rail Systems, ASIC/FPGA Glue Logic and Register File Replacement, Automotive and Transportation Subsystem Controllers, LED Display and Signage Refresh Controller.
Industrial PLC I/O Expansion and Voltage Translation
The 5M2210ZF324I5 is well suited as the central glue-logic engine in industrial PLC backplanes where a controller CPU must interface to legacy 5V or 3.3V peripherals and modern 1.8V processors across a shared bus. With 324 user I/O balls organized into independent voltage banks supporting 1.2V to 3.3V, the device performs level translation on-chip, eliminating external translator ICs and reducing BOM cost. Its 7 ns pin-to-pin delay delivers deterministic response on real-time I/O scan cycles, while the non-volatile Flash configuration ensures the PLC boots into a known safe state within microseconds of power-up. The industrial -40C to +100C temperature rating supports deployment in factory automation cells, motor-control cabinets, and outdoor control enclosures.
추천
Telecom Backplane Bus Decoder
In telecom equipment such as line cards and base-station backplanes, the 5M2210ZF324I5 acts as a fast address and protocol decoder between the switch-fabric ASIC and multiple tributary FPGAs. Its 1700 macrocells accommodate complex decoding trees with deep fan-in without timing closure issues, and the 7 ns tPD provides ample margin for synchronous bus cycles at 100 MHz and above. The 324-ball BGA footprint exposes enough pins to drive multiple parallel buses simultaneously while remaining routable on standard 6-layer backplane stack-ups. The instant-on Flash configuration eliminates the boot-time vulnerability of SRAM-based FPGAs, which is critical for always-on telecom infrastructure.
추천
Power-Up Sequencing Controller for Multi-Rail Systems
The 5M2210ZF324I5 is commonly programmed as a multi-rail power sequencer in servers, storage systems, and FPGA-based add-in cards where multiple voltage rails must come up and shut down in a defined order. Its non-volatile Flash configuration boots in microseconds, allowing the sequencer to drive enable lines to DC-DC converters before the host CPU has finished its own reset, satisfying the strictest timing specifications of modern ASICs. With 324 available I/O and abundant macrocells, a single 5M2210ZF324I5 can sequence 8 to 16 rails and monitor PG (power-good) feedback lines, replacing discrete sequencer ICs with a flexible, in-system-reprogrammable solution.
추천
ASIC/FPGA Glue Logic and Register File Replacement
When a discrete logic implementation would consume excessive board area, the 5M2210ZF324I5 serves as a flexible glue-logic and register-file replacement in ASIC and FPGA reference designs. Each macrocell implements a D flip-flop plus configurable combinational logic, effectively replacing dozens of 74-series packages. Designers use the device for state-machine controllers, FIFOs, interrupt arbiters, and timing-sensitive handshake interfaces. Compared with implementing equivalent logic in the host FPGA, offloading to the 5M2210ZF324I5 frees FPGA fabric for value-added DSP and protocol work and provides a fixed-cost, no-routing-congestion alternative to soft-implementation in the FPGA.
추천
Automotive and Transportation Subsystem Controllers
Although not AEC-Q100 qualified, the 5M2210ZF324I5 in its industrial -40C to +100C temperature rating is widely used in non-safety automotive subsystems including infotainment back-end controllers, body-electronics modules, and commercial-vehicle telematics platforms. The 324-ball LBGA package supports dense PCB layouts typical of space-constrained automotive ECUs, while the 1.8V core minimizes power consumption on battery-fed lines. Designers appreciate the deterministic 7 ns propagation delay for CAN, LIN, and FlexRay bus bridging, and the instant-on Flash boot avoids the cold-start latency that RAM-based FPGAs exhibit. For AEC-Q100 automotive programs, the 5M2210ZF324A5N variant is the certified drop-in alternative.
추천
LED Display and Signage Refresh Controller
The 5M2210ZF324I5 is deployed as a refresh and pixel-clocking controller in professional LED video walls and large-format digital signage, where it drives GCLK and LE lines to chains of LED driver ICs across hundreds of outputs. Its 324 I/O balls can address wide parallel pixel buses without external muxes, and its deterministic 7 ns timing aligns perfectly with LED driver shift-register clocks in the 50 to 100 MHz range. The non-volatile instant-on configuration eliminates visible boot glitches on display power-up, and the 1.8V core supply minimizes thermal dissipation in sealed display enclosures. Compared with microcontrollers, the CPLD's parallel I/O and guaranteed tPD simplify timing closure for high-refresh-rate panels.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5M2210ZF324I5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5M2210ZF324C5N | 5M2210ZF324C4N | 5M2210ZF324A5N | 5M1270ZF324C5N | 5M1270ZF324C4N | 5M1270ZF324A5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-ball LBGA | 324-ball LBGA - same | 324-ball LBGA - same | 324-ball LBGA - same | 324-ball LBGA - same | 324-ball LBGA - same | 324-ball LBGA - same |
| Macrocells | 1700 | 1700 | 1700 | 1700 | 1270 | 1270 | 1270 |
| Logic Elements | 2210 | 2210 | 2210 | 2210 | 1270 | 1270 | 1270 |
| User I/O | 324 | 324 | 324 | 324 | 324 | 324 | 324 |
| Pin-to-Pin Delay (ns) | 7 | 7 | 8.5 (speed grade 4) | 7 | 7 | 8.5 (speed grade 4) | 7 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +125C (Automotive) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +125C (Automotive) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| User Flash (Kbits) | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
주요 차별점
- Highest macrocell density in the MAX V family at 324-ball LBGA (vs 5M1270ZF324C5N)
- Industrial temperature range suitable for harsh environments (vs 5M2210ZF324C5N)
- Non-volatile Flash configuration boots in microseconds (vs Xilinx XC2C256 SRAM-based CPLD)
설계 노트
The 324-ball LBGA package uses a 1.0 mm ball pitch and requires a 6-layer PCB with microvia technology for reliable fan-out. Estimated: for a standard 1.0 mm pitch BGA, escape routing on the top layer with 0.1 mm (4 mil) line and space is typical; via-in-pad with filled and plated-over copper is recommended for the inner-row balls to maximize routable channels. Failure to use microvias can lead to signal-integrity issues on high-speed DDR interfaces. Reference Intel MAX V Hardware Implementation Guide for the recommended footprint, paste stencil, and reflow profile.
When driving high-speed buses (DDR, LVDS, or 100 MHz parallel interfaces) through the 5M2210ZF324I5 I/O, series-termination resistors should be placed within 5 mm of the BGA ball. Estimated: a 33 ohm series resistor on each output typically damps reflections on 50 ohm impedance-controlled traces. Configure drive-strength settings in the Quartus II / Intel Quartus Prime assignment editor to match the trace impedance. For multi-bank designs, decouple each VCCIO bank independently with a 0.1 uF ceramic capacitor per bank plus a bulk 10 uF tantalum capacitor to suppress switching noise.
Do not assume the MAX V JTAG chain is automatically routed to all I/O balls - it is only available on dedicated TCK, TMS, TDI, TDO, and TRST pins. Connecting JTAG signals to other balls will not function. Always reserve these pins for JTAG access during PCB layout, even if in-system programming is not planned at first prototype - this preserves the option for field updates. Also note that the 5M2210ZF324I5 requires a 1.8V core supply; do not substitute 3.3V supply or the device will latch-up permanently.
규정 준수 정보
RoHS compliant per Intel MAX V family documentation. Industrial temperature grade only; for AEC-Q100 automotive qualification, use 5M2210ZF324A5N variant.
