A3P030-2QNG48I - ProASIC3 Flash FPGA 30K Gates | Microchip
부품 번호: A3P030-2QNG48I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.75 | $4.75 |
| 10 | $4.42 | $44.20 |
| 100 | $4.18 | $418.00 |
| 500 | $4.05 | $2,025.00 |
| 1,000 | $3.96 | $3,960.00 |
A3P030-2QNG48I 개요
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, the A3P030 sits at the low end of the FPGA family tree, below mid-density and high-density FPGAs and far above simple CPLDs, making it a single-chip, low-cost programmable solution for glue logic, control, and interface bridging tasks.
Key features include instant-on, live-at-power-up operation because the flash fabric is inherently non-volatile, eliminating the external boot device required by SRAM FPGAs. The 1.5V core with 130nm flash process delivers up to 310 MHz internal system performance, while the small 7x7 mm QFN footprint suits space-constrained boards. Security features protect the design from readback, and full reprogrammability supports in-field updates.
The ProASIC3 architecture uses a Sea-of-Tiles fabric of VersaTiles, each configurable as logic, arithmetic, or memory elements, connected through a hierarchical routing structure. Embedded flash and optional soft ARM support extend capability beyond pure glue logic. I/O banks support popular single-ended standards, and the fabric is qualified across industrial temperature ranges.
Typical applications include portable and handheld instrument control logic, industrial automation interface bridging, power-on sequencing and system supervision, and replacement of multiple discrete ASSP or CPLD devices in cost-sensitive designs where a single-chip flash FPGA reduces total cost of ownership.
Design consideration: plan 1.5V core supply sequencing and adequate QFN thermal/electrical grounding through the exposed pad, and verify I/O bank voltage assignment in Libero SoC before board layout.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing referenced as of 2026-08-31.
드롭인 대체품: A3P030-2QNG48I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P030-2QNG48I (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Family, Core Voltage, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P030-QNG48I
✅ 드롭인✓ 재고 있음
$5.5 / 개
데이터시트 보기 →A3P030-1QNG48I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
A3P030L-2QNG48I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
A3P030-2VQG48I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
A3P030-2QNG48I 최대 정격 & 전기적 특성
| Family | ProASIC3 Flash FPGA |
| Logic Elements | 330 |
| System Gates | 30000 |
| User I/O | 34 |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm flash |
| Maximum System Performance | 310 MHz |
| Speed Grade | 2 |
| Configuration Memory | On-chip flash (non-volatile) |
| 동작 온도 | -40C to +85C (Industrial) |
| 패키지 | 48-VFQFN Exposed Pad (QNG48) |
| 실장 유형 | Surface Mount |
| Terminal Form | No Lead |
| Package Shape | Square |
| Soft ARM Support | Optional (ProASIC3 with soft ARM support) |
| RoHS 상태 | RoHS Compliant (RoHS Code: Yes) |
A3P030-2QNG48I square 핀 구성 가이드
A3P030-2QNG48I(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P030-2QNG48I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P030-2QNG48I 적합 용도: 6 애플리케이션s: Industrial Automation Control Logic, Portable and Battery-Powered Instruments, System Power Sequencing and Supervision, Communications Interface Bridging, Medical Diagnostic Device Control, ASSP and CPLD Consolidation.
Industrial Automation Control Logic
The A3P030-2QNG48I fits industrial automation boards that need deterministic, instantly-available control logic without a boot sequence. Its -40C to +85C industrial rating and flash-based non-volatile configuration make it live at power-up, essential for PLC I/O cards, motor control supervision, and sensor interface bridging where the FPGA must gate signals the moment power arrives. With 330 logic elements and 34 user I/Os at speed grade 2 (310 MHz class fabric), it absorbs glue logic, bus translation, and state machines previously spread across several ASSPs, cutting total cost of ownership. The 48-QFN exposed-pad package maintains a compact 7x7 mm footprint for dense control boards, and the on-chip flash configuration adds readback protection for proprietary control IP.
추천
Portable and Battery-Powered Instruments
Flash FPGAs such as the A3P030-2QNG48I are favored in portable instruments because the ProASIC3 fabric draws very low static power compared with equivalent-density SRAM FPGAs, extending battery runtime in always-on designs. The 1.5V core on a 130nm flash process, combined with a compact 48-VFQFN exposed-pad package, suits handheld measurement devices, data loggers, and field testers where board area and power budget are both tight. Because configuration is stored on-chip, the instrument wakes instantly with no external boot ROM or configuration controller. The 34 user I/Os handle display interfaces, sensor buses, and keypads, while the 330-VersaTile fabric implements acquisition sequencing, timing generation, and protocol glue around a low-power host MCU.
추천
System Power Sequencing and Supervision
Multi-rail systems need sequencing and reset logic that is active before the main processor exits reset. The A3P030-2QNG48I is inherently live at power-up due to its flash fabric, making it an ideal sequencing supervisor: 330 logic elements implement power-good monitoring, rail sequencing state machines, watchdog timers, and brown-out handling, while 34 I/Os connect enable pins, PG monitoring lines, and status LEDs. The industrial -40C to +85C range covers servers, base stations, and factory power shelves. Because configuration is on-chip, sequencing behavior cannot be corrupted by a failed external boot device. The 48-QFN footprint fits inside dense power distribution regions of the PCB, and the exposed pad provides solid ground reference for monitoring accuracy.
추천
Communications Interface Bridging
Line cards and industrial network nodes frequently need translation between legacy parallel buses and serial interfaces. The A3P030-2QNG48I provides up to 310 MHz class fabric performance at speed grade 2, sufficient for SPI, UART, parallel-to-serial bridging, and simple protocol engines within 330 logic elements. The 34 user I/Os support common single-ended signaling standards across I/O banks, letting one QFN-48 device replace discrete level shifters, buffers, and small CPLDs. Its flash-based configuration means a bridge is functional during system boot - important when the bridge must forward early-boot diagnostics. The exposed-pad 7x7 mm QFN suits dense communication backplanes, and design security in flash protects proprietary protocol implementations from readback.
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Medical Diagnostic Device Control
Benchtop and point-of-care medical instruments use the A3P030-2QNG48I for deterministic sensor timing, actuator sequencing, and front-end glue logic. The instant-on flash fabric guarantees the device supervises safety-critical interlocks from the first millisecond of power - a property SRAM FPGAs cannot match without external configuration. Low static power benefits battery-powered diagnostics, and the -40C to +85C range covers cold-chain and sterilization-adjacent environments. The 330-VersaTile fabric implements ADC timing controllers, motor step sequences for sample handling, and indicator logic, while 34 I/Os interface buttons, displays, and analog front ends. The compact 48-QFN package integrates cleanly into handheld diagnostic form factors, and flash design security protects embedded algorithms.
추천
ASSP and CPLD Consolidation
Boards burdened with several discrete logic devices - address decoders, small CPLDs, flip-flop clusters, and glue ASSPs - can consolidate them into a single A3P030-2QNG48I. Its 330 logic elements and 34 I/Os at speed grade 2 absorb mixed random and sequential logic, reducing BOM line items, assembly cost, and board area. Because the fabric is flash-based, the consolidated logic is live at power-up like the discrete devices it replaces, avoiding boot-dependency problems. The 48-VFQFN exposed-pad package occupies roughly 7x7 mm, freeing layout area for other functions. Reprogrammability also means logic fixes ship as firmware updates rather than PCB respins, lowering total cost of ownership - the headline ProASIC3 benefit cited by Microchip.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P030-2QNG48I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P030-QNG48I | A3P030-1QNG48I | A3P030L-2QNG48I | A3P030-2VQG48I |
|---|---|---|---|---|---|
| Package | 48-VFQFN Exposed Pad (QNG48) | 48-VFQFN Exposed Pad (QNG48) - same | 48-VFQFN Exposed Pad (QNG48) - same | 48-VFQFN Exposed Pad (QNG48) - same | 48-QFN (VQG48) - same footprint family |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 330 | 330 | 330 | 330 | 330 |
| User I/O | 34 | 34 | 34 | 34 | 34 |
| Speed Grade | 2 | Standard | 1 (slower) | 2 | 2 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V (low-power core) | 1.5 V |
| Configuration Memory | On-chip flash (non-volatile) | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
| Power Profile | Low static power (flash fabric) | Low static power | Low static power | Reduced (ProASIC3L low power) | Low static power |
주요 차별점
- Fastest guaranteed timing in the 48-pin A3P030 family (vs A3P030-QNG48I)
- Lower power option exists in same footprint (vs A3P030L-2QNG48I)
- Instant-on single-chip solution (vs SRAM FPGAs of similar density)
설계 노트
Estimated: the 1.5V core supply should be decoupled with an array of 0.1uF ceramic capacitors placed at every VCC core pin pair, plus at least one 4.7uF bulk capacitor near the QFN. Flash FPGAs like the A3P030 have very low static current but dynamic core current scales with clock activity, so budget per the datasheet DC characteristics for your design frequency. I/O bank supplies (VCCI) must be sized per the selected I/O standards and their simultaneous switching output count.
The QNG48 VFQFN has an exposed pad that must be soldered to a grounded thermal landing pattern with an array of thermal vias - this is the primary ground return and heat dissipation path for the 7x7 mm package. Follow Microchip/Microsemi package application notes for stencil aperture design (typically ~50-70% coverage) to avoid voiding under the pad. Keep JTAG programming access (TDI, TDO, TMS, TCK) on a header for FlashPro in-system programming.
Compile and verify timing in Libero SoC against the exact speed grade before substituting a lower speed grade device: a design closed on speed grade 2 may fail timing on grade 1 or standard grade A3P030 parts. Also confirm the low-power A3P030L variants order-code compatibility if migrating for power savings, and verify unused I/O termination settings (Microchip default weak pull-up vs grounded) to avoid floating-node issues in noisy industrial environments.
규정 준수 정보
RoHS Code: Yes per distributor lifecycle records (Worldway). Active life cycle code. QNG48 is a no-lead terminal QFN package. REACH and halogen-free status not stated in provided data.
