A42MX36-BGG272 - 54K-Gate 5V FPGA, 202 I/O 272-BBGA | Microchip
부품 번호: A42MX36-BGG272 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $410.32 | $410.32 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
A42MX36-BGG272 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device that implements custom digital logic through programmable interconnect and configurable logic modules, sitting within the broader programmable-logic hierarchy: FPGA -> programmable logic device -> digital IC -> semiconductor. The Microchip/Microsemi MX family was designed specifically as a low-cost, high-volume platform for consolidating legacy PLDs, PALs, and glue logic into a single device operating at 5V.
Key features include 3,000 to 54,000 system gates, up to 2.5 kbits of configurable dual-port SRAM with 5 ns access time, fast wide-decode circuitry, 5.6 ns clock-to-output, and 100 MHz FIFO capability. The device operates from dual supply rails of 3V to 3.6V (core/auxiliary) and 4.75V to 5.25V (I/O), allowing direct interface to legacy 5V TTL-level systems.
The MX architecture uses a fine-grained, mux-based logic module that maps legacy schematics and PAL-style designs efficiently, with predictable timing across process corners. The A42MX36 supports both plastic 272-ball BGA packaging and, for the same die, CQ208/CQ256 ceramic packages screened to MIL-STD-883 levels for defense and aerospace programs, with pin-compatible PQ208/CQ208 options for prototype-to-production conversion.
Typical applications include legacy 5V system obsolescence management, industrial control, defense electronics, test equipment, and ASIC prototyping where 5V I/O compatibility and long-term availability matter more than leading-edge density.
When designing with this device, plan the dual-rail power sequencing and account for the BGA fanout; 202 usable I/O in a 272-ball footprint requires disciplined escape routing on at least 4 signal layers.
This page synthesizes distributor pricing, same-family drop-in speed-grade alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: A42MX36-BGG272 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A42MX36-BGG272 (동일 폼 팩터 및 풋프린트) — 차이점: Family, Speed Grade, Package, Supply Voltage, User I/O.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A42MX36-2BGG272
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A42MX36-1BGG272
✅ 드롭인✓ 재고 있음
$573.16 / 개
데이터시트 보기 →A42MX36-2BG272I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A42MX36-BG272
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A42MX36-BGG272 최대 정격 & 전기적 특성
| Family | Microchip/Microsemi MX (42MX) |
| System Gates | 54,000 usable gates |
| User I/O | 202 programmable I/O |
| Dual-Port SRAM | 2560 bits (2.5 kbits) configurable |
| Dual-Port SRAM Access Time | 5 ns |
| Clock-to-Out | 5.6 ns |
| Internal Performance | Up to 250 MHz |
| FIFO Performance | 100 MHz |
| Supply Voltage (I/O rail) | 4.75 V to 5.25 V |
| Supply Voltage (aux rail) | 3 V to 3.6 V |
| 패키지 | 272-BBGA |
| 실장 유형 | Surface Mount |
| Architecture | Single-chip ASIC alternative, mux-based logic module |
| Ceramic/Military Options (same die) | CQ208 / CQ256 screened to MIL-STD-883 levels |
A42MX36-BGG272 272-bbga 핀 구성 가이드
A42MX36-BGG272(272-bbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A42MX36-BGG272.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A42MX36-BGG272 적합 용도: 6 애플리케이션s: Legacy 5V System Obsolescence Management, Defense and Aerospace Electronics, Industrial Control and Factory Automation, Test and Measurement Equipment, ASIC Prototyping and Low-Volume Emulation, Networking and Communication Backplanes.
Legacy 5V System Obsolescence Management
The A42MX36-BGG272's native 5V I/O rail (4.75V-5.25V) makes it the natural replacement vehicle for systems built around 1980s-1990s TTL-logic boards, PAL/GAL arrays, and mask gate arrays that can no longer be re-architected. The MX mux-based logic module maps PAL-style product-term logic and schematic-derived netlists efficiently, so legacy designs migrate with minimal structural change. With 54,000 gates, 202 I/O, and one-time-programmable antifuse configuration that needs no external boot flash, a single BGG272 consolidates dozens of obsolete glue-logic packages. Dual 5V and 3V-3.6V rails preserve the original board's power tree, avoiding connector and level-shifter redesign.
추천
Defense and Aerospace Electronics
Microchip offers the A42MX36 die in ceramic CQ208 and CQ256 packages screened to MIL-STD-883 levels specifically for defense and aerospace programs, and the same architecture underlies the plastic 272-BBGA BGG272 used in prototype and lower-criticality builds. The antifuse configuration technology is inherently single-event-upset tolerant compared with SRAM-based FPGAs - the programmed connections cannot flip in flight - which historically made MX parts a staple in satellites, avionics, and military ground equipment. Wide temperature availability through the -I industrial variants and long product lifecycle support further fit program timelines measured in decades. Verified parameters include 54,000 gates, 250 MHz internal performance, and 2.5 kbits dual-port SRAM.
추천
Industrial Control and Factory Automation
Industrial controllers built on 24V-field-adjacent 5V logic backplanes benefit directly from the A42MX36-BGG272's 5V-compatible I/O structure, eliminating external level translation between the FPGA and legacy sensor/sensor-driver boards. The device's 100 MHz FIFO capability and 5 ns dual-port SRAM support buffering between asynchronous process-control subsystems and supervisory processors, while 202 user I/O is sufficient to consolidate address decoding, interrupt control, and sequencer logic for a complete I/O card. One-time programmability prevents field corruption of control logic - an important safety property in factory equipment. The 272-ball BGA's 1.27 mm-class ball pitch keeps escape routing practical on standard 4-layer industrial PCBs.
추천
Test and Measurement Equipment
Bench and automated test instruments frequently retain 5V TTL trigger and data-acquisition front ends; the A42MX36-BGG272 interfaces to these rails directly while providing 250 MHz internal performance and 5.6 ns clock-to-out for timing measurement, pattern generation, and protocol capture logic. The 2560-bit configurable dual-port SRAM implements small FIFOs and lookup tables at 5 ns access, supporting trigger-qualified capture pipelines. Its 202 I/O enables multi-channel digital I/O modules in a single device, replacing arrays of 74-series logic and reducing instrument PCB area. Because the antifuse configuration is fixed at programming time, test-system behavior is deterministic and audit-friendly for calibration-controlled environments.
추천
ASIC Prototyping and Low-Volume Emulation
The MX family was explicitly positioned by Microsemi as a single-chip ASIC alternative, and the A42MX36-BGG272 remains a practical vehicle for emulating small gate-array designs (up to 54,000 gates) before committing to a mask set. The mux-based logic modules map ASIC-style schematics predictably, and the family's fast wide-decode circuitry handles address decoders common in bus-interface ASICs. For prototype-to-production continuity, the datasheet notes that PQ208 plastic and CQ208 ceramic packages are pin-compatible, and the same die spans plastic BGA and MIL-STD-883-screened ceramic offerings - letting engineers validate on the BGG272 and migrate packaging without logic changes. One-time programming also mimics the fixed behavior of a manufactured ASIC.
추천
Networking and Communication Backplanes
Older telecom and industrial networking backplanes run on 5V TTL signaling, and the A42MX36-BGG272's 5V I/O rail plus 202 configurable pins let it serve as bus arbiter, address decoder, and protocol glue for such systems. The 100 MHz FIFO performance and dual-port SRAM (5 ns access) support data path buffering between line cards and backplane controllers, while the 250 MHz internal capability covers clock-domain logic for 100 MHz-class interfaces. Antifuse one-time configuration ensures the interconnect fabric cannot be reprogrammed in the field, supporting carrier equipment security requirements. The 272-ball BGA offers enough I/O headroom to consolidate multiple discrete PLDs that previously implemented backplane interface slices across a chassis design.
추천
추천 제품 요약
엔지니어링 참조 데이터: A42MX36-BGG272 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A42MX36-2BGG272 | A42MX36-1BGG272 | A42MX36-2BG272I | A42MX36-BG272 |
|---|---|---|---|---|---|
| Package | 272-BBGA | 272-BBGA - same | 272-BBGA - same | 272-BBGA - same | 272-BBGA (BG coding) - same footprint |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 54,000 | 54,000 | 54,000 | 54,000 | 54,000 |
| User I/O | 202 | 202 | 202 | 202 | 202 |
| Dual-Port SRAM | 2560 bits | 2560 bits | 2560 bits | 2560 bits | 2560 bits |
| Speed Grade | Standard | -2 (faster) | -1 (slower) | -2 (faster) | Standard |
주요 차별점
- Fastest guaranteed timing in the 272-BBGA MX lineup at standard cost (vs A42MX36-1BGG272)
- Industrial temperature availability in the same footprint (vs A42MX36-2BG272I)
- Faster speed grade available as a true drop-in upgrade (vs A42MX36-2BGG272)
설계 노트
The A42MX36-BGG272 requires two supply rails: 4.75V-5.25V for I/O and 3V-3.6V for the auxiliary rail per Microchip USA's specification. Estimated: for a design using 100 I/O at 20 mA each, I/O-rail current can reach 2 A, so plan the 5V regulator and decoupling network accordingly - place bulk capacitance near each rail ball cluster and 0.1 uF ceramics at the corner power balls. Verify power-up sequencing guidance in the 40MX/42MX family datasheet before finalizing the power tree; one-time-programmable antifuse devices have specific inrush characteristics during programming operations.
Escape-routing 202 usable signals from a 272-ball BGA requires disciplined fanout: plan via-in-pad or dog-bone escapes on a ≥4-layer stackup with dedicated power and ground planes. Reserve the corner balls for 5V, 3.3V, and ground per the datasheet pin table, and add stitching vias around the package perimeter for return-current integrity. Because this is a legacy part, many existing reference boards are 2-layer - for new layouts, do not copy old 2-layer fanouts; the BGA's ball pitch demands plane-based power distribution for simultaneous-switching noise control.
MX devices are antifuse one-time-programmable: there is no rework path after programming errors, so invest in full post-route simulation and a programmingfixture test before committing devices. Second, speed grade matters - the -1 grade will not meet timing closures designed for the standard or -2 grades; re-run static timing when substituting grades. Third, confirm which variant you actually procure: BGG272 vs BG272 ball/package coding, and commercial vs -I temperature range, are distinct orderable MPNs, and mixing them into a temperature-qualified build invalidates the qualification. Always verify the order code against the current Microchip ordering-information table.
규정 준수 정보
Compliance status for the A42MX36-BGG272 was not stated in the provided web data. Note the family offers MIL-STD-883-screened ceramic package options (CQ208/CQ256) for defense/aerospace per the Microchip datasheet.
