A42MX36-2BGG272 - 54K Gate 5V FPGA, 202 I/O | Microchip
MPN: A42MX36-2BGG272 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $722.01 | $722.01 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for A42MX36-2BGG272 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A42MX36-1BG272MX39
β Drop-Inπ Reference alternative (not in catalog)
A42MX36-2BGG272I
β Drop-Inπ Reference alternative (not in catalog)
A42MX36-2BGG272M
β Drop-Inπ Reference alternative (not in catalog)
A42MX36-2BGG272X39
β Drop-Inπ Reference alternative (not in catalog)
A42MX36-2BGG272 Maximum Ratings & Electrical Characteristics
| Family | 42MX (MX FPGA) |
| Equivalent Gates | 54,000 |
| Configurable Logic Blocks (CLBs) | 1184 |
| Logic Cells | 2438 |
| User I/O | 202 |
| Speed Grade | -2 |
| Maximum Clock Frequency | 91 MHz |
| Supply Voltage | 5.0 V |
| Programmability | One-Time Programmable (antifuse) |
| Embedded Memory | Dual-port SRAM blocks (FIFO/LIFO) |
| Package | 272-BBGA |
| Ball Pitch | 1.27 mm |
| Mounting Type | Surface Mount |
| JESD-30 Package Code | S-PBGA-B272 |
| Operating Temperature | [DATA_NEEDED: operating temperature range] |
| Design Software | Microsemi Designer / ACTgen |
A42MX36-2BGG272 Pin Configuration
| Pin A1 | [DATA_NEEDED: pin name] β See DS2316 datasheet pin tables for 272-BGA ball map |
| Pin - | VCCI β 5.0V I/O supply balls (multiple locations across BGA) |
| Pin - | GND β Ground balls (multiple locations across BGA) |
| Pin - | IO β 202 user input/output balls distributed across periphery clusters |
| Pin - | CLK β Dedicated global clock input balls |
| Pin - | PROGRAM β Programming/antifuse configuration control |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A42MX36-2BGG272 is suitable for 6 applications: Legacy 5V Industrial Control, Military and Aerospace Systems, ASIC Prototyping and Bridge Logic, FIFO and Buffered Data Path Design, PLD Consolidation in Telecom Backplanes, 5V Sensor and Instrumentation Interfaces.
Legacy 5V Industrial Control
The A42MX36-2BGG272's native 5.0V architecture makes it a natural fit for industrial control systems still standardized on 5V logic families. With 54,000 gates, 1184 CLBs, and 202 user I/Os, it can absorb multiple legacy PLDs, PALs, and glue-logic chips into a single device, cutting board area and BOM count without adding level-shifting circuitry. Placed directly on 5V backplanes and PLC I/O racks, its one-time-programmable antifuse fabric also provides configuration immutability that flash-based FPGAs cannot match, which is valued in hostile or safety-relevant factory environments.
Recommended
Military and Aerospace Systems
The 42MX family is fully tested over automotive and military temperature ranges, and the largest member (A42MX36) is available in CQ208 and CQ256 ceramic packages screened to MIL-STD-883 levels, making it a proven choice for defense upgrades and obsolescence-driven redesigns. The -2BGG272M screened variant shares the identical 272-ball footprint, allowing a single PCB design to serve both commercial and screened programs. Antifuse one-time programming resists configuration upset from radiation-induced bit flips in the configuration store, an advantage over SRAM FPGAs in flight and space-adjacent platforms.
Recommended
ASIC Prototyping and Bridge Logic
MX FPGAs are explicitly positioned by Microchip as a reliable, single-chip ASIC alternative for high-volume platforms. The A42MX36-2BGG272, with 54,000 equivalent gates and 2438 logic cells, is large enough to prototype mid-size ASIC control blocks, bus interfaces, and state machines before committing to mask costs. The ACTgen Macro Builder accelerates memory and datapath macro generation, while the one-time-programmable fabric delivers ASIC-like security and unit-cost characteristics when the validated design moves directly into volume production on the same silicon.
Recommended
FIFO and Buffered Data Path Design
The A42MX36 dual-port SRAM blocks provide an optimal solution for high-speed buffered applications requiring FIFO and LIFO queues, per the Microsemi DS2316 datasheet. Designers use the ACTgen Macro Builder to instantiate FIFOs connecting asynchronous clock domains in data-acquisition, test-instrument, and communication backplane designs. With a 91 MHz maximum clock in the -2 grade, the device sustains meaningful throughput for 5V-era interfaces, and its 202 I/Os support wide (16/32-bit) parallel buses that modern low-voltage FPGAs would need banked I/O and level translation to serve.
Recommended
PLD Consolidation in Telecom Backplanes
Telecom and network line cards built around 5V TTL signaling historically used dozens of PAL/GAL devices for address decode, interrupt control, and bus arbitration. The A42MX36-2BGG272 consolidates these into one 272-BGA device with 202 user I/Os and deterministic pin-to-pin timing. Because the MX fabric is one-time-programmable, network operators gain tamper-resistant configuration storage. The 1.27 mm ball pitch simplifies routing on legacy multi-layer backplanes where trace geometry cannot be revised, protecting existing PCB investments during technology refresh programs.
Recommended
5V Sensor and Instrumentation Interfaces
Test and measurement instruments, power controllers, and 5V sensor front ends benefit from the A42MX36's 91 MHz -2 grade timing for timing-critical trigger and pulse-width measurement logic. The device interfaces directly with 5V ADCs, comparators, and reference circuitry without translation devices, reducing analog error budget. Its dual-port SRAM blocks buffer ADC sample streams between acquisition and processing domains, and the antifuse fabric gives deterministic, jitter-free routing for precision timing chains, an attribute valued over SRAM FPGAs in instrumentation applications.
Recommended
Recommended Products Summary
Engineering reference data for A42MX36-2BGG272 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A42MX36-1BG272MX39 | A42MX36-2BGG272I | A42MX36-2BGG272M |
|---|---|---|---|---|
| Package | 272-BBGA | 272-BBGA - same | 272-BBGA - same | 272-BBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 54,000 | 54,000 | 54,000 | 54,000 |
| CLBs | 1184 | 1184 | 1184 | 1184 |
| User I/O | 202 | 202 | 202 | 202 |
| Speed Grade / Max Clock | -2 / 91 MHz | -1 / 83 MHz | -2 / 91 MHz | -2 / 91 MHz |
| Supply Voltage | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
| Temperature / Screening | [DATA_NEEDED: temperature grade] | [DATA_NEEDED] | Industrial | Military screening |
Key Differentiators
- Full-speed -2 grade timing (vs A42MX36-1BG272MX39)
- Military-screened sibling availability (vs A42MX36-2BGG272M)
- Native 5.0V operation (vs Modern low-voltage FPGAs)
Design Notes
The A42MX36 operates from a single 5.0V supply. Provide solid VCCI/GND ball connections across the 272-BGA with a decoupling network of bulk (10 uF) plus high-frequency (0.1 uF) ceramics placed close to the package. Antifuse MX devices draw near-zero configuration current, but dynamic I/O switching current on 202 outputs must be budgeted; compute worst-case ICC from the DS2316 datasheet ICC tables for your toggle rates.
MX devices are one-time-programmable: a faulty bitstream permanently consumes a device. Always complete post-layout timing simulation (91 MHz -2 grade timing corners) and functional verification before programming production units. Reserve the ACTgen-generated FIFO/SRAM macros with matching depth/width parameters verified against your testbench to avoid wasting costly $700+ devices.
The 272-BBGA uses a 1.27 mm ball pitch, routable on legacy PCBs with standard via-in-pad or dog-bone escape patterns. For plastic-to-ceramic conversion paths, note that PQ208/CQ208 devices are pin-compatible per the datasheet, but the 272-BGA footprint is unique - if a future MIL-STD-883 ceramic requirement is plausible, consider planning the layout migration early. Follow datasheet ball assignment exactly; do not swap supply balls.
Compliance Information
Compliance data not present in provided verified web data. Note: the G (lead-free) suffix in BGG ordering codes typically indicates lead-free ball composition per Microchip ordering conventions, but this was not explicitly verified in the provided data.
