ADTF3175 - 1MP iToF 3D Depth Module | Analog Devices
부품 번호: ADTF3175 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $275 | $2,750.00 |
| 100 | $255 | $25,500.00 |
| 500 | $243.52 | $121,760.00 |
| 1,000 | $230 | $230,000.00 |
ADTF3175 개요
A Time-of-Flight module is an optoelectronic subsystem that measures distance by emitting modulated infrared light and measuring the phase shift of the light reflected from a target. In an indirect ToF (iToF) architecture, every pixel simultaneously collects four phase-shifted samples in a single exposure, which are then mathematically combined to compute depth. The ADTF3175 sits in the system hierarchy as a depth-sensing subassembly above the image sensor (ADSD3100) and below the perception layer (typically paired with the ADSD3500 depth ISP).
Key features include a 1 megapixel CMOS iToF imager with 3.5 µm pixels, an integrated 940 nm IR illuminator with eye-safety class-1 consideration, and a calibrated depth range from approximately 0.2 m to several meters depending on mode. The 4-lane MIPI CSI-2 output is electrically compatible with common application processors and the bundled EVAL-ADTF3175D-NXZ kit pairs the module with the ADSD3500 depth ISP for full depth-map generation. Fully calibrated multi-mode operation reduces OEM integration time versus discrete iToF assemblies.
Typical applications include AR/VR depth capture, gesture recognition, robotics navigation, machine vision bin picking, people counting, and biometric 3D face authentication. The 75 x 75 mm open-frame form factor is intended for embedded integration rather than sealed consumer products. Compared to discrete iToF designs that require custom optics and per-unit calibration, the ADTF3175 delivers a factory-calibrated module that compresses optical, illumination, and power design into a single component.
드롭인 대체품: ADTF3175 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ADTF3175 (동일 폼 팩터 및 풋프린트) — 차이점: Product Type, Imager, Mounting Type, Resolution.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ADTF3175BMLZ
✅ 드롭인✓ 재고 있음
$243.52 / 개
데이터시트 보기 →ADTF3175 최대 정격 & 전기적 특성
| Product Type | Time-of-Flight (ToF) module |
| Imager | ADSD3100 CMOS indirect ToF (iToF) |
| 분해능 | 1024 H x 1024 V (1 megapixel) |
| Pixel Size | 3.5 µm x 3.5 µm |
| Output Interface | MIPI CSI-2 Tx (4-lane) |
| Integrated Components | Lens, optical band-pass filter, IR illuminator, power regulators |
| Module Form Factor | 75 mm x 75 mm open frame |
| Calibration | Factory calibrated, multi-range + multi-resolution modes |
| Packaging Type | Open-frame module (Distance Sensor Module) |
| 실장 유형 | Board mount (open frame) |
| Orderable Part Number | ADTF3175BMLZ |
| 수명 주기 상태 | Recommended for new designs |
| Matching Evaluation Kit | EVAL-ADTF3175D-NXZ (with ADSD3500 depth ISP) |
| RoHS 상태 | Compliant |
| Manufacturer | Analog Devices Inc. |
ADTF3175 standard 핀 구성 가이드
ADTF3175(standard 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: ADTF3175.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ADTF3175 적합 용도: 6 애플리케이션s: AR/VR Depth Sensing and Scene Reconstruction, Machine Vision and Bin Picking, Gesture Recognition and Human-Machine Interface, 3D Face Authentication and Biometrics, People Counting and Crowd Flow Analytics, Robotics Navigation and Obstacle Avoidance.
AR/VR Depth Sensing and Scene Reconstruction
The ADTF3175 is purpose-built for augmented and virtual reality depth sensing where high-resolution 3D scene capture is required at consumer-product cost targets. The 1 megapixel iToF resolution (1024 x 1024) at 3.5 µm pixel pitch delivers dense depth maps for occlusion handling and spatial mapping that lower-resolution ToF modules cannot match. The 4-lane MIPI CSI-2 Tx interface connects directly to embedded AR/VR vision SoCs, and pairing with the ADSD3500 depth ISP via the EVAL-ADTF3175D-NXZ kit accelerates real-time depth-map generation. The factory-calibrated optical band-pass filter and integrated IR illuminator remove the largest optical-integration risk in AR/VR product development.
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Machine Vision and Bin Picking
Industrial bin-picking and machine-vision cells require accurate 3D depth at sub-millimeter precision over typical 0.5 m to 2 m working distances. The ADTF3175's 1 megapixel iToF output provides the spatial resolution needed for object pose estimation and grasp planning that QVGA-class ToF modules cannot deliver. The 75 x 75 mm open-frame form factor simplifies integration into robot end-effectors and machine-vision enclosures. Factory calibration across multiple range and resolution modes lets engineers trade frame rate against range without per-unit optical recalibration, which is critical for high-mix manufacturing.
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Gesture Recognition and Human-Machine Interface
Gesture recognition systems benefit from the ADTF3175's full 1024 x 1024 depth resolution to detect fine hand and finger motion at typical 0.3 m to 1.5 m interaction ranges. The integrated IR illuminator and band-pass filter optimize depth Signal-to-Noise Ratio under indoor ambient IR, while the factory calibration eliminates the per-unit phase-wrapping calibration that discrete iToF assemblies demand. The MIPI CSI-2 output streams directly into SoCs running skeleton-tracking and gesture-classification neural networks, replacing multiple lower-resolution ToF sensors with a single high-resolution module that reduces system BOM and software complexity.
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3D Face Authentication and Biometrics
3D face authentication systems require high-resolution, depth-accurate imaging that resists 2D spoofing attacks. The ADTF3175's 1 megapixel iToF output captures facial topology with enough spatial detail for liveness detection and 3D facial-feature extraction. The integrated IR illumination at eye-safety class 1 powers the active illumination while the optical band-pass filter rejects visible-light contamination. The 75 x 75 mm open-frame module can be embedded behind an OEM front panel, and the factory-calibrated phase depth enables biometric-template generation with consistent depth accuracy across units, an essential property for face-recognition FAR/FRR targets.
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People Counting and Crowd Flow Analytics
People counting and crowd-flow analytics deployments need wide field-of-view depth with sufficient resolution to discriminate individuals across 2 m to 6 m retail and transit environments. The ADTF3175's 1024 x 1024 iToF resolution with calibrated multi-range modes supports head-and-shoulder segmentation at typical ceiling-mount heights. The integrated IR illuminator eliminates the need for an external lighting subassembly, simplifying deployment, while the MIPI CSI-2 output feeds embedded analytics processors. Factory calibration shortens on-site commissioning time, a major operational benefit when deploying thousands of ceiling-mounted sensors.
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Robotics Navigation and Obstacle Avoidance
Mobile robots and autonomous guided vehicles require real-time depth maps for obstacle avoidance and SLAM at 0.2 m to several meters working distance. The ADTF3175's iToF architecture delivers phase-accurate measurements at high modulation frequencies that correlate with strong centimeter-level accuracy across the calibrated range. The 4-lane MIPI CSI-2 interface streams depth into embedded navigation SoCs at low latency. The 75 x 75 mm open-frame footprint enables flush mounting on robot front panels, while the bundled ADSD3500 ISP and open-source multi-platform SDK reduce path-planning software integration time.
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추천 제품 요약
엔지니어링 참조 데이터: ADTF3175 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ADTF3175BMLZ | ADSD3100 |
|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices |
| Package / Form Factor | 75 x 75 mm open-frame module | 75 x 75 mm open-frame module (same) | Bare CMOS iToF imager die (no module) |
| Imager Silicon | ADSD3100 (inside module) | ADSD3100 (same silicon, full module) | ADSD3100 (bare die) |
| Resolution | 1024 H x 1024 V (1 MP) | 1024 H x 1024 V (1 MP) | 1024 H x 1024 V (1 MP, same imager) |
| Pixel Size | 3.5 µm x 3.5 µm | 3.5 µm x 3.5 µm | 3.5 µm x 3.5 µm |
| Output Interface | MIPI CSI-2 Tx (4-lane) | MIPI CSI-2 Tx (4-lane) | MIPI CSI-2 Tx (4-lane, raw sensor output) |
| Integrated Lens | Yes | Yes | No (customer-supplied optics) |
| Integrated IR Illuminator | Yes | Yes | No (customer-supplied illumination) |
| Factory Calibrated | Yes (multi-mode) | Yes (multi-mode) | No (bare die requires calibration) |
주요 차별점
- Complete factory-calibrated module vs bare iToF die (vs ADSD3100 bare imager)
- 1 megapixel iToF resolution vs typical QVGA ToF modules (vs STMicroelectronics VL53L5CX family)
- Integrated ADSD3500 depth ISP ecosystem (vs Discrete third-party ToF modules)
설계 노트
The ADTF3175 integrates an IR illuminator, lens assembly, and power regulators into a 75 x 75 mm open-frame module, so thermal management must account for both the imager and the illuminator LED array. At full modulation duty cycle the illuminator is the dominant heat source. Mount the module on a chassis spreader or thermal pad rather than relying solely on the open-frame plastic housing; allow at least 1 square inch of copper around the host connector to spread connector heat into the host PCB.
Route the 4-lane MIPI CSI-2 Tx traces from the ADTF3175 host connector to the application processor as a 100-ohm differential pair with matched length and continuous ground keep-out per the Analog Devices datasheet. Keep the MIPI traces on a single PCB layer to avoid via stubs, and place the host connector as close as practical to the module edge to minimize stub length. Provide a clean ground reference under the entire MIPI routing region to maintain signal-integrity compliance.
Do not assume the ADTF3175BMLZ is a fully sealed consumer-grade product - it is an open-frame module intended for embedding into a sealed enclosure. Deploying the module exposed will allow dust, moisture, and stray IR into the optical path, degrading depth accuracy. Also note that the ADTF3175 is recommended for new designs as of 2026-10-05, but the ADTF3175 ecosystem depends on the ADSD3500 depth ISP for full depth-map generation - plan your host processor and ISP pairing early in the BOM.
Although the ADTF3175 module handles its own internal illumination modulation, the 4-lane MIPI CSI-2 Tx output is the critical signal-integrity path. The output is rated for 4-lane operation; do not drop down to 1-lane or 2-lane without verifying the chosen ISP supports the lane count at the desired depth-map frame rate. Use the EVAL-ADTF3175D-NXZ kit as the reference layout for the host-side MIPI routing, as Analog Devices has characterized signal-integrity only for the documented reference design.
When integrating the ADTF3175 open-frame module into a host product, mechanical stability of the lens-to-imager optical axis is critical for depth-map accuracy. Provide at least three mechanical mounting bosses on the host chassis to constrain the module position, and avoid applying mechanical load on the host connector that could warp the lens barrel over time. The reference design in the EVAL-ADTF3175D-NXZ evaluation kit demonstrates the recommended mechanical mounting pattern for OEM integration.
규정 준수 정보
RoHS compliance per Analog Devices product page. AEC-Q100 not applicable because the ADTF3175 is an optoelectronic module, not an automotive-qualified IC. Halogen-free status not explicitly stated in verified data; recommend confirming with Analog Devices if halogen-free is required for your application.
