AM263P4ACOKFZCZRQ1 - 400MHz Quad-Core Cortex-R5F MCU | TI
부품 번호: AM263P4ACOKFZCZRQ1 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
AM263P4ACOKFZCZRQ1 개요
An MCU (microcontroller unit) integrates a processor core, memory, and peripherals on a single die, sitting within the broader hierarchy of embedded processors: microcontroller -> embedded processor -> semiconductor IC. Real-time MCUs like the AM263P4-Q1 prioritize deterministic interrupt latency and cycle-accurate peripheral control over raw throughput, which distinguishes them from application processors running general-purpose operating systems.
Key features include four Cortex-R5F cores programmable individually or in lockstep mode for functional-safety configurations (up to ASIL-relevant architectures), 400 MHz real-time processing, 6-channel 12-bit SAR ADC and 1-channel 12-bit DAC for analog sensing and feedback, and flash-in-package (FIP) storage that removes the need for an external flash device, saving board area and simplifying BOM in space-constrained automotive modules.
Technical depth: the R5F subsystem supports dual-core and lockstep execution, allowing developers to trade performance against diagnostic coverage. The wide 1.71 V to 3.46 V supply range accommodates automotive battery-condition scenarios. Serial interfaces, eCAP/ePWM-class control peripherals, and the ADC subsystem enable closed-loop control of traction inverters, PTC heaters, and pump motors with microsecond-level loop times.
Typical applications include electric-vehicle traction motor control, on-board charger and DC-DC converter control, domain and zonal controllers requiring deterministic real-time behavior, and industrial servo drives where the same functional-safety architecture applies.
Design consideration: the 324-ball NFBGA (15x15 mm) requires a controlled-impedance PCB with appropriate BGA fanout strategy; power integrity for four 400 MHz cores demands careful PDN design on the core-rail decoupling network.
This page synthesizes distributor availability, pin-to-pin compatible family alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: AM263P4ACOKFZCZRQ1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: AM263P4ACOKFZCZRQ1 (동일 폼 팩터 및 풋프린트) — 차이점: ADC Resolution, Core Processor, Package, Product Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
AM263P4ACOLFZCZR
✅ 드롭인✓ 재고 있음
$18.6 / 개
데이터시트 보기 →AM263P2ACOKFZCZRQ1
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
AM263P1ACOKFZCZRQ1
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
AM263P2ACOLFZCZR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
AM263P1ACOLFZCZR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
AM263P4ACOKFZCZRQ1 최대 정격 & 전기적 특성
| Core Processor | Arm Cortex-R5F |
| Number of Cores | 4 (Quad-Core) |
| Core Clock Speed | 400 MHz |
| 데이터 버스 폭 | 32 bit |
| Flash Memory | 256 KB (flash-in-package) |
| RAM Size | 3000 KB |
| ADC Resolution | 12 bit |
| ADC Channels | 6 (12b SAR) |
| DAC Resolution | 12 bit (1 channel) |
| Supply Voltage Range | 1.71 V to 3.46 V |
| 패키지 | 324-NFBGA (15x15 mm) |
| 실장 유형 | Surface Mount |
| Qualification | AEC-Q100 (automotive, -Q1) |
| Functional Safety | Cortex-R5F lockstep or dual-core mode |
| Programmability | Flash-in-package (FIP) |
| Product Family | AM263Px Sitara |
AM263P4ACOKFZCZRQ1 324-nfbga (15x15 mm) 핀 구성 가이드
AM263P4ACOKFZCZRQ1(324-nfbga (15x15 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: AM263P4ACOKFZCZRQ1.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
AM263P4ACOKFZCZRQ1 적합 용도: 6 애플리케이션s: EV Traction Inverter Motor Control, On-Board Charger (OBC) and DC-DC Converter Control, Industrial Servo and Robotics Drives, Automotive Domain and Zonal Controllers, Battery Management System (BMS) Real-Time Processing, Test, Measurement and HIL Systems.
EV Traction Inverter Motor Control
The AM263P4ACOKFZCZRQ1 fits traction inverter control because its four 400 MHz Cortex-R5F cores execute field-oriented control (FOC) loops with deterministic latency, while the 6-channel 12-bit SAR ADC samples phase currents and DC-link voltage at the microsecond resolution required for smooth torque production. The AEC-Q100 qualification of this -Q1 suffix part satisfies automotive quality gates for powertrain programs. In a typical topology, one core pair runs in lockstep for the safety-relevant torque path while remaining cores handle diagnostics and communication. The 3000 KB RAM accommodates concurrent control states and lookup-based motor maps; the flash-in-package removes external flash routing that would otherwise add EMI near gate drivers. Loop rates in the 10-20 kHz range are practical at 400 MHz.
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On-Board Charger (OBC) and DC-DC Converter Control
In OBC and auxiliary DC-DC converter designs, the AM263P4ACOKFZCZRQ1 provides the real-time PWM generation and closed-loop regulation needed for totem-pole PFC and CLLLC resonant stages. Its 400 MHz quad-core Cortex-R5F cluster runs voltage/current loops plus power-metering and CAN communication in parallel, and the 12-bit ADC channels capture input current, output voltage, and temperature feedback with sufficient resolution for control-law execution. The AEC-Q100 qualification suits the underhood and high-voltage environment. Flash-in-package firmware storage simplifies safety-related firmware updates without external memory. Placing control on a dedicated real-time MCU rather than an application processor avoids OS jitter, keeping current-loop bandwidth predictable across the wide 1.71-3.46 V logic supply and automotive battery-sag conditions.
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Industrial Servo and Robotics Drives
Industrial servo drives require the same deterministic multi-axis control that the AM263P4ACOKFZCZRQ1 delivers: four 400 MHz Cortex-R5F cores can dedicate one core per axis for FOC execution with hard real-time guarantees, while lockstep-capable subsystems support safety functions aligned with machinery functional-safety architectures. The 6-channel 12-bit SAR ADC handles multi-axis current sensing, and 3000 KB RAM stores trajectory data locally. EtherCAT- or PROFINET-class communication stacks run on a dedicated core without disturbing control loops. The flash-in-package allows field firmware updates in the enclosure without external memory footprints. Because the AM263Px family is pin-to-pin compatible, a single servo-drive PCB can be populated with different memory-density variants across product tiers without respin.
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Automotive Domain and Zonal Controllers
Zonal and domain controllers aggregate sensor, actuator, and network traffic in modern vehicle E/E architectures. The AM263P4ACOKFZCZRQ1 serves this role where deterministic real-time processing matters: its quad 400 MHz Cortex-R5F cores partition communication protocol handling, actuator control, and diagnostic monitoring, with lockstep operation available for safety-relevant partitions. The wide 1.71 V to 3.46 V supply range tolerates load-dump-affected rail conditions via upstream regulation, and AEC-Q100 qualification satisfies OEM component requirements. The 324-ball NFBGA (15x15 mm) provides the GPIO and peripheral count needed for heterogeneous I/O aggregation in a compact footprint. Flash-in-package boot avoids external-memory bus routing that would complicate EMC design in dense controllers.
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Battery Management System (BMS) Real-Time Processing
In an automotive BMS, the AM263P4ACOKFZCZRQ1 executes pack current integration, state-of-charge and state-of-health algorithms, and contactor control with cycle-accurate timing. The 6-channel 12-bit SAR ADC supports current shunt and temperature multiplexed sampling, while lockstep-capable cores back the safety-relevant over-current and over-voltage protection paths expected in ASIL-oriented designs. The 3000 KB RAM retains extensive measurement histories for aging analytics, and 256 KB flash-in-package stores boot and safety firmware on-die. Operating from the wide 1.71-3.46 V supply, the MCU interfaces with battery-monitor front ends over isolated serial links. AEC-Q100 qualification of the -Q1 variant aligns with the automotive deployment profile of traction-battery ECUs.
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Test, Measurement and HIL Systems
Hardware-in-the-loop (HIL) and automated test systems benefit from the AM263P4ACOKFZCZRQ1 as a deterministic real-time node emulating inverter, motor, or engine behavior. Four 400 MHz Cortex-R5F cores resolve nanosecond-class model time-steps at the kHz update rates demanded by power-HIL, while the 12-bit ADC and 12-bit DAC provide the analog stimulus/response channel pair for closed-loop interface with the device under test. The large 3000 KB RAM buffers high-rate capture data before streaming to a host. Because the AM263Px family is pin-to-pin compatible across memory densities, lab fixtures can be built once and re-populated with lower-cost variants for production test, preserving socket compatibility and test software investment.
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추천 제품 요약
엔지니어링 참조 데이터: AM263P4ACOKFZCZRQ1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | AM263P4ACOLFZCZR | AM263P2ACOKFZCZRQ1 | AM263P1ACOKFZCZRQ1 |
|---|---|---|---|---|
| Package | 324-NFBGA (15x15 mm) | 324-NFBGA (15x15) - same | 324-NFBGA (15x15) - same | 324-NFBGA (15x15) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| CPU Cores / Clock | 4x Cortex-R5F @ 400 MHz | 4x Cortex-R5F @ 400 MHz | 4x Cortex-R5F @ 400 MHz | 4x Cortex-R5F @ 400 MHz |
| AEC-Q100 Qualification | Yes (-Q1) | No (industrial) | Yes (-Q1) | Yes (-Q1) |
| Supply Voltage Range | 1.71 V to 3.46 V | 1.71 V to 3.46 V | 1.71 V to 3.46 V | 1.71 V to 3.46 V |
| ADC / DAC | 6x 12b SAR / 1x 12b | 6x 12b SAR / 1x 12b | 6x 12b SAR / 1x 12b | 6x 12b SAR / 1x 12b |
| Functional Safety Modes | Lockstep or dual-core | Lockstep or dual-core | Lockstep or dual-core | Lockstep or dual-core |
주요 차별점
- Automotive AEC-Q100 qualification (vs AM263P4ACOLFZCZR)
- Highest flash-in-package density in family (vs AM263P2ACOKFZCZRQ1)
- Functional safety flexibility (vs AM263P1ACOKFZCZRQ1)
설계 노트
The 324-ball NFBGA (15x15 mm, 0.8 mm ball pitch class) requires careful fanout planning. Use via-in-pad or a dog-bone fanout on outer rows, and reserve inner routing layers for the DDR-class and high-speed peripheral buses. Plan the layer stackup early: at minimum 6 layers is typical for full ball escape on a 15x15 mm BGA. Follow the TI AM263x hardware design guide for ball-multiplexing decisions before routing, since pinmux choices made in software must match the PCB escape pattern.
The 1.71 V to 3.46 V input range spans core and I/O rails, so a multi-rail PMIC sequencing solution is typically required. Ensure core-rail decoupling follows the TI reference design capacitor placement, because four 400 MHz cores create fast di/dt transients. Verify rail sequencing order and reset supervision against the AM263Px power-up requirements in the datasheet; incorrect sequencing can latch up I/O structures.
Estimated: thermal performance of the 15x15 mm NFBGA depends primarily on PCB copper area, as BGA packages dissipate largely through the board. For sustained operation of all four cores at 400 MHz, provide solid internal ground planes and thermal vias under the package footprint. Confirm theta-JA values for your specific stackup from the TI thermal application notes rather than assuming generic values.
Do not assume all AM263Px family members have identical flash-in-package content: AM263P4/AM263P2/AM263P1 suffixes denote different FIP densities, and code size must fit the chosen density. Also verify that the exact suffix ordering options (temperature grade, packaging) match your production environment before locking the BOM, since -Q1 automotive parts carry qualification and traceability requirements that industrial variants do not.
규정 준수 정보
AEC-Q100 qualification is implied by the -Q1 suffix per TI product page. RoHS/REACH/lead-free status not stated in the provided web data; verify on TI.com product page for AM263P4-Q1.
