AM263P4ACOKFZCZRQ1 - 400MHz Quad-Core Cortex-R5F MCU | TI
MPN: AM263P4ACOKFZCZRQ1 β Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for AM263P4ACOKFZCZRQ1 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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AM263P4ACOLFZCZR
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$18.6 / Unit
View Datasheet βAM263P2ACOKFZCZRQ1
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
AM263P1ACOKFZCZRQ1
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
AM263P2ACOLFZCZR
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
AM263P1ACOLFZCZR
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
AM263P4ACOKFZCZRQ1 Maximum Ratings & Electrical Characteristics
| Core Processor | Arm Cortex-R5F |
| Number of Cores | 4 (Quad-Core) |
| Core Clock Speed | 400 MHz |
| Data Bus Width | 32 bit |
| Flash Memory | 256 KB (flash-in-package) |
| RAM Size | 3000 KB |
| ADC Resolution | 12 bit |
| ADC Channels | 6 (12b SAR) |
| DAC Resolution | 12 bit (1 channel) |
| Supply Voltage Range | 1.71 V to 3.46 V |
| Package | 324-NFBGA (15x15 mm) |
| Mounting Type | Surface Mount |
| Qualification | AEC-Q100 (automotive, -Q1) |
| Functional Safety | Cortex-R5F lockstep or dual-core mode |
| Programmability | Flash-in-package (FIP) |
| Product Family | AM263Px Sitara |
AM263P4ACOKFZCZRQ1 324-nfbga (15x15 mm) Pin Configuration Guide
Complete pinout information for AM263P4ACOKFZCZRQ1 (324-nfbga (15x15 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for AM263P4ACOKFZCZRQ1.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
AM263P4ACOKFZCZRQ1 is suitable for 6 applications: EV Traction Inverter Motor Control, On-Board Charger (OBC) and DC-DC Converter Control, Industrial Servo and Robotics Drives, Automotive Domain and Zonal Controllers, Battery Management System (BMS) Real-Time Processing, Test, Measurement and HIL Systems.
EV Traction Inverter Motor Control
The AM263P4ACOKFZCZRQ1 fits traction inverter control because its four 400 MHz Cortex-R5F cores execute field-oriented control (FOC) loops with deterministic latency, while the 6-channel 12-bit SAR ADC samples phase currents and DC-link voltage at the microsecond resolution required for smooth torque production. The AEC-Q100 qualification of this -Q1 suffix part satisfies automotive quality gates for powertrain programs. In a typical topology, one core pair runs in lockstep for the safety-relevant torque path while remaining cores handle diagnostics and communication. The 3000 KB RAM accommodates concurrent control states and lookup-based motor maps; the flash-in-package removes external flash routing that would otherwise add EMI near gate drivers. Loop rates in the 10-20 kHz range are practical at 400 MHz.
Recommended
On-Board Charger (OBC) and DC-DC Converter Control
In OBC and auxiliary DC-DC converter designs, the AM263P4ACOKFZCZRQ1 provides the real-time PWM generation and closed-loop regulation needed for totem-pole PFC and CLLLC resonant stages. Its 400 MHz quad-core Cortex-R5F cluster runs voltage/current loops plus power-metering and CAN communication in parallel, and the 12-bit ADC channels capture input current, output voltage, and temperature feedback with sufficient resolution for control-law execution. The AEC-Q100 qualification suits the underhood and high-voltage environment. Flash-in-package firmware storage simplifies safety-related firmware updates without external memory. Placing control on a dedicated real-time MCU rather than an application processor avoids OS jitter, keeping current-loop bandwidth predictable across the wide 1.71-3.46 V logic supply and automotive battery-sag conditions.
Recommended
Industrial Servo and Robotics Drives
Industrial servo drives require the same deterministic multi-axis control that the AM263P4ACOKFZCZRQ1 delivers: four 400 MHz Cortex-R5F cores can dedicate one core per axis for FOC execution with hard real-time guarantees, while lockstep-capable subsystems support safety functions aligned with machinery functional-safety architectures. The 6-channel 12-bit SAR ADC handles multi-axis current sensing, and 3000 KB RAM stores trajectory data locally. EtherCAT- or PROFINET-class communication stacks run on a dedicated core without disturbing control loops. The flash-in-package allows field firmware updates in the enclosure without external memory footprints. Because the AM263Px family is pin-to-pin compatible, a single servo-drive PCB can be populated with different memory-density variants across product tiers without respin.
Recommended
Automotive Domain and Zonal Controllers
Zonal and domain controllers aggregate sensor, actuator, and network traffic in modern vehicle E/E architectures. The AM263P4ACOKFZCZRQ1 serves this role where deterministic real-time processing matters: its quad 400 MHz Cortex-R5F cores partition communication protocol handling, actuator control, and diagnostic monitoring, with lockstep operation available for safety-relevant partitions. The wide 1.71 V to 3.46 V supply range tolerates load-dump-affected rail conditions via upstream regulation, and AEC-Q100 qualification satisfies OEM component requirements. The 324-ball NFBGA (15x15 mm) provides the GPIO and peripheral count needed for heterogeneous I/O aggregation in a compact footprint. Flash-in-package boot avoids external-memory bus routing that would complicate EMC design in dense controllers.
Recommended
Battery Management System (BMS) Real-Time Processing
In an automotive BMS, the AM263P4ACOKFZCZRQ1 executes pack current integration, state-of-charge and state-of-health algorithms, and contactor control with cycle-accurate timing. The 6-channel 12-bit SAR ADC supports current shunt and temperature multiplexed sampling, while lockstep-capable cores back the safety-relevant over-current and over-voltage protection paths expected in ASIL-oriented designs. The 3000 KB RAM retains extensive measurement histories for aging analytics, and 256 KB flash-in-package stores boot and safety firmware on-die. Operating from the wide 1.71-3.46 V supply, the MCU interfaces with battery-monitor front ends over isolated serial links. AEC-Q100 qualification of the -Q1 variant aligns with the automotive deployment profile of traction-battery ECUs.
Recommended
Test, Measurement and HIL Systems
Hardware-in-the-loop (HIL) and automated test systems benefit from the AM263P4ACOKFZCZRQ1 as a deterministic real-time node emulating inverter, motor, or engine behavior. Four 400 MHz Cortex-R5F cores resolve nanosecond-class model time-steps at the kHz update rates demanded by power-HIL, while the 12-bit ADC and 12-bit DAC provide the analog stimulus/response channel pair for closed-loop interface with the device under test. The large 3000 KB RAM buffers high-rate capture data before streaming to a host. Because the AM263Px family is pin-to-pin compatible across memory densities, lab fixtures can be built once and re-populated with lower-cost variants for production test, preserving socket compatibility and test software investment.
Recommended
Recommended Products Summary
Engineering reference data for AM263P4ACOKFZCZRQ1 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | AM263P4ACOLFZCZR | AM263P2ACOKFZCZRQ1 | AM263P1ACOKFZCZRQ1 |
|---|---|---|---|---|
| Package | 324-NFBGA (15x15 mm) | 324-NFBGA (15x15) - same | 324-NFBGA (15x15) - same | 324-NFBGA (15x15) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| CPU Cores / Clock | 4x Cortex-R5F @ 400 MHz | 4x Cortex-R5F @ 400 MHz | 4x Cortex-R5F @ 400 MHz | 4x Cortex-R5F @ 400 MHz |
| Flash-in-Package | 256 KB | 256 KB (same P4 density) | [DATA_NEEDED: FIP density of AM263P2] | [DATA_NEEDED: FIP density of AM263P1] |
| RAM | 3000 KB | 3000 KB | [DATA_NEEDED] | [DATA_NEEDED] |
| AEC-Q100 Qualification | Yes (-Q1) | No (industrial) | Yes (-Q1) | Yes (-Q1) |
| Supply Voltage Range | 1.71 V to 3.46 V | 1.71 V to 3.46 V | 1.71 V to 3.46 V | 1.71 V to 3.46 V |
| ADC / DAC | 6x 12b SAR / 1x 12b | 6x 12b SAR / 1x 12b | 6x 12b SAR / 1x 12b | 6x 12b SAR / 1x 12b |
| Functional Safety Modes | Lockstep or dual-core | Lockstep or dual-core | Lockstep or dual-core | Lockstep or dual-core |
Key Differentiators
- Automotive AEC-Q100 qualification (vs AM263P4ACOLFZCZR)
- Highest flash-in-package density in family (vs AM263P2ACOKFZCZRQ1)
- Functional safety flexibility (vs AM263P1ACOKFZCZRQ1)
Design Notes
The 324-ball NFBGA (15x15 mm, 0.8 mm ball pitch class) requires careful fanout planning. Use via-in-pad or a dog-bone fanout on outer rows, and reserve inner routing layers for the DDR-class and high-speed peripheral buses. Plan the layer stackup early: at minimum 6 layers is typical for full ball escape on a 15x15 mm BGA. Follow the TI AM263x hardware design guide for ball-multiplexing decisions before routing, since pinmux choices made in software must match the PCB escape pattern.
The 1.71 V to 3.46 V input range spans core and I/O rails, so a multi-rail PMIC sequencing solution is typically required. Ensure core-rail decoupling follows the TI reference design capacitor placement, because four 400 MHz cores create fast di/dt transients. Verify rail sequencing order and reset supervision against the AM263Px power-up requirements in the datasheet; incorrect sequencing can latch up I/O structures.
Estimated: thermal performance of the 15x15 mm NFBGA depends primarily on PCB copper area, as BGA packages dissipate largely through the board. For sustained operation of all four cores at 400 MHz, provide solid internal ground planes and thermal vias under the package footprint. Confirm theta-JA values for your specific stackup from the TI thermal application notes rather than assuming generic values.
Do not assume all AM263Px family members have identical flash-in-package content: AM263P4/AM263P2/AM263P1 suffixes denote different FIP densities, and code size must fit the chosen density. Also verify that the exact suffix ordering options (temperature grade, packaging) match your production environment before locking the BOM, since -Q1 automotive parts carry qualification and traceability requirements that industrial variants do not.
Compliance Information
AEC-Q100 qualification is implied by the -Q1 suffix per TI product page. RoHS/REACH/lead-free status not stated in the provided web data; verify on TI.com product page for AM263P4-Q1.
