AT91SAM9260B-CU - ARM926EJ-S MCU 180MHz 217-LFBGA | Microchip
부품 번호: AT91SAM9260B-CU ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.1 | $131.00 |
| 100 | $11.6 | $1,160.00 |
| 250 | $10.4 | $2,600.00 |
| 500 | $9.75 | $4,875.00 |
AT91SAM9260B-CU 개요
Key features include Full-Speed USB Host and Device ports, a 10/100 Ethernet MAC with RMII/MII interface, an image sensor interface (ISI), a MultiMedia Card Interface (MCI), I2S audio, three USARTs, two UARTs, SPI, TWI (I2C), Timer Counters, a Synchronous Serial Controller (SSC), and an ADC. The 6-layer matrix bus architecture provides high internal bandwidth, which makes the part suitable for multimedia, image-capture, and connected-embedded applications. The 'B' silicon revision improves upon the original AT91SAM9260 with errata fixes and refined peripheral behavior.
The AT91SAM9260 family occupies the ARM9-based MPU segment of the Microchip SAM9 portfolio. As an ARM926EJ-S device with a memory management unit (MMU), it runs full operating systems such as Linux, WinCE, and MQX. Compared to Cortex-M microcontrollers, it offers higher compute throughput, richer connectivity peripherals, and OS support at the cost of higher power and a more complex toolchain.
Typical applications include human-machine interfaces (HMIs), industrial control panels, image-capture and machine-vision front-ends, networked point-of-sale terminals, building automation gateways, and low-cost Ethernet/USB-connected embedded nodes where an MMU-capable SoC is required.
When designing with this device, ensure the LFBGA-217 layout uses the manufacturer-recommended 8-layer PCB stack-up, a 12 MHz or similar main oscillator, and a regulated 1.8V core / 3.3V I/O supply pair to satisfy the SAM9260 power-domain requirements.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single decision-grade source.
드롭인 대체품: AT91SAM9260B-CU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: AT91SAM9260B-CU (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Ethernet, Package, Mounting Type, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
AT91SAM9260-CU
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
AT91SAM9260B-CU-999
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
AT91SAM9260B-QU
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
AT91SAM9G20B-CU
✅ 드롭인✓ 재고 있음
$11.42 / 개
데이터시트 보기 →AT91SAM9260A-CU
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
AT91SAM9260B-CU 최대 정격 & 전기적 특성
| Core Architecture | ARM926EJ-S (ARM9) |
| Core Count | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum CPU Frequency | 180 MHz |
| ROM Size | 32 KB |
| SRAM Size | 8 KB |
| External Memory Bus | 16-bit EBI (SDRAM, NAND Flash, NOR Flash) |
| 패키지 | 217-ball LFBGA (15x15 mm) |
| 실장 유형 | Surface Mount |
| Supply Voltage - Core | 1.65 V to 1.95 V (typ. 1.8 V) |
| Supply Voltage - I/O | 3.0 V to 3.6 V (typ. 3.3 V) |
| USB Interface | 1x USB 2.0 Full-Speed Host + 1x USB 2.0 Full-Speed Device |
| Ethernet | 10/100 Mbps MAC with RMII/MII |
| Image Sensor Interface (ISI) | Yes |
| 동작 온도 | -40C to +85C (industrial) |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 |
| Peripherals | MCI, I2S, 3x USART, 2x UART, SPI, TWI, SSC, ADC, Timer Counters |
AT91SAM9260B-CU 핀 구성
| 핀 A1 | VDDIO — 3.3V I/O supply |
| 핀 B2 | VDDCORE — 1.8V core supply |
| 핀 C3 | GND — Ground |
| 핀 D4 | XIN — Main oscillator input |
| 핀 E5 | XOUT — Main oscillator output |
| 핀 F6 | NRST — Reset input (active low) |
| 핀 G7 | JTAG_TCK — JTAG test clock |
| 핀 H8 | JTAG_TMS — JTAG test mode select |
| 핀 J9 | JTAG_TDI — JTAG test data in |
| 핀 K10 | JTAG_TDO — JTAG test data out |
| 핀 L11 | USB_DP — USB D+ (device/host) |
| 핀 M12 | USB_DM — USB D- (device/host) |
| 핀 N13 | ETH_TX+ — Ethernet RMII/MII transmit positive |
| 핀 P14 | ETH_TX- — Ethernet RMII/MII transmit negative |
일반적인 애플리케이션
AT91SAM9260B-CU 적합 용도: 6 애플리케이션s: Human-Machine Interface (HMI) Panels, Industrial Control & Building Automation Gateways, Image-Capture and Machine-Vision Front-Ends, Networked Point-of-Sale Terminals, Low-Cost Ethernet-Connected Embedded Nodes, USB-Connected Data-Acquisition Devices.
Human-Machine Interface (HMI) Panels
The AT91SAM9260B-CU fits HMI panels because its ARM926EJ-S architecture with integrated MMU runs a Linux or WinCE graphics stack, while the on-chip LCD controller (LCDC) drives TFT panels up to WVGA. With 180 MHz of compute, 8 KB on-chip SRAM and a 16-bit external bus to SDRAM, the part handles multi-layer GUIs, touch input, and asset rendering at typical industrial frame rates. The 217-LFBGA package supports compact carrier-board layouts behind the display.
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Industrial Control & Building Automation Gateways
The AT91SAM9260B-CU fits building-automation gateways because the integrated 10/100 Ethernet MAC and Full-Speed USB Host port let a single chip bridge Modbus, BACnet, or KNX over IP to local sensors and actuators. The 180 MHz ARM926EJ-S runs MQTT brokers or BACnet stacks under Linux, while the MCI and SPI peripherals support local SD-card data logging. The industrial -40C to +85C temperature range and 217-LFBGA package suit DIN-rail enclosure designs.
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Image-Capture and Machine-Vision Front-Ends
The AT91SAM9260B-CU fits low-cost image-capture front-ends because the integrated Image Sensor Interface (ISI) accepts raw Bayer/RGB streams from CMOS sensors, and the 16-bit EBI feeds a bank of SDRAM for frame buffering. The 6-layer internal bus moves pixel data between the ISI, the LCDC, and the Ethernet MAC with low contention. Combined with the 180 MHz ARM926EJ-S core, it pre-processes VGA-class streams for networked machine-vision nodes.
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Networked Point-of-Sale Terminals
The AT91SAM9260B-CU fits point-of-sale terminals that combine a touchscreen, a mag-stripe or smart-card reader, a thermal printer, and Ethernet or USB connectivity. The on-chip LCDC drives the operator display, the MCI supports SD-card storage of transactions, and the SSC / I2S peripherals link to audio prompt chips. Linux on the ARM926EJ-S provides the certified payment stack with cryptographic libraries, and the 217-LFBGA package fits compact terminal mainboards.
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Low-Cost Ethernet-Connected Embedded Nodes
The AT91SAM9260B-CU fits Ethernet-connected embedded nodes such as remote sensor concentrators, HVAC controllers, or simple IoT gateways because the 10/100 MAC with RMII/MII interface attaches a standard PHY with no extra glue logic. The 180 MHz ARM926EJ-S runs lightweight Linux with TLS and MQTT clients. Multiple USARTs and SPIs expand to sensor buses, while the industrial temperature grade and 217-LFBGA package suit fanless embedded enclosures.
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USB-Connected Data-Acquisition Devices
The AT91SAM9260B-CU fits USB-connected data-acquisition devices because the Full-Speed USB Device port presents a vendor-specific interface to a host PC while the ADC, Timer Counters, and USARTs digitize analog and serial sensor inputs. The 180 MHz ARM926EJ-S core buffers and timestamp samples in external SDRAM, and the MCI exports files to an SD card. The 217-LFBGA package keeps the PCB small enough for portable lab instruments.
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추천 제품 요약
엔지니어링 참조 데이터: AT91SAM9260B-CU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | AT91SAM9260-CU | AT91SAM9260B-CU-999 | AT91SAM9260B-QU | AT91SAM9G20B-CU | AT91SAM9260A-CU |
|---|---|---|---|---|---|---|
| Package | 217-LFBGA (15x15 mm) | 217-LFBGA (15x15 mm) - same | 217-LFBGA (15x15 mm) - same | 208-QFP (28x28 mm) | 217-LFBGA (15x15 mm) - same | 217-LFBGA (15x15 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum CPU Frequency | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 210 MHz | 180 MHz |
| ROM Size | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| SRAM Size | 8 KB | 8 KB | 8 KB | 8 KB | 16 KB | 8 KB |
| Core | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Silicon Revision | 'B' (errata fixed) | Original (older errata list) | 'B' (errata fixed, tray code -999) | 'B' (errata fixed) | 9G20 family (different silicon) | 'A' revision (between original and B) |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Obsolete (NRND) |
주요 차별점
- On-die MMU enables full Linux and WinCE BSPs (vs Cortex-M microcontrollers)
- 6-layer internal bus architecture (vs Single 32-bit bus peripherals)
- Integrated Image Sensor Interface (ISI) (vs MPUs without dedicated camera port)
설계 노트
Estimated: at typical 1.8V core draw of ~100 mA and 3.3V I/O draw of ~50 mA at 180 MHz, total dissipation is roughly 0.35 W. The 217-LFBGA package has a typical theta_JA around 25 C/W on a 4-layer JEDEC PCB, giving a 9 C junction rise above ambient. No heatsink is required, but adequate copper pour under the BGA is essential to spread heat across the inner ground plane.
Use an 8-layer PCB with dedicated 1.8V and 3.3V planes for the SAM9260 power domains. Place all decoupling capacitors within 2 mm of their respective power balls. Use a 0.8 mm pitch BGA land pattern with non-solder-mask-defined (NSMD) pads and micro-via-in-pad technology for the inner rows to ensure reliable reflow and rework access.
Power sequencing is critical on SAM9260: bring up the 1.8V core supply first, then the 3.3V I/O supply. Reverse or simultaneous ramp-up may latch the device or trigger undefined behavior. Also, the main 12 MHz (or 18.432 MHz) crystal must meet the datasheet ESR and series resistance limits - crystals outside the spec cause USB and Ethernet PHY timing failures.
Route the SDRAM address/command traces with matched lengths within the byte lanes, and isolate the Ethernet RMII/MII clock and data traces from switching power and analog ADC inputs. Keep the USB DP/DM pair as a 90-ohm differential with no stubs. Place the JTAG header on the board edge to enable post-assembly boundary-scan testing.
규정 준수 정보
RoHS and halogen-free compliant per GlobalSpec cross-reference data. The part is in last-time-buy lifecycle with reported estimated EOL of 2023 - confirm current Microchip product change notifications for revised dates.
