ATSAM3A8CA-CU - 84MHz Cortex-M3 MCU | Microchip Technology
부품 번호: ATSAM3A8CA-CU ✓ 활성ATSAM3A8CA-CU 개요
A microcontroller is a programmable semiconductor that integrates a processor core, nonvolatile program memory, volatile data memory, peripherals, and communication interfaces on one device. The ATSAM3A8C belongs to the SAM3A family of embedded microcontrollers and uses the ARM Cortex-M3 RISC architecture. Within the product hierarchy, it is an MCU, embedded controller, RISC processor, and system-on-chip for real-time control and connected applications.
The principal strengths of the ATSAM3A8CA-CU are its 84 MHz processing rate, 512 KB Flash organization, 96 KB SRAM, and broad set of mixed-signal and communications peripherals. The 12-bit ADC/DAC and integrated temperature sensor reduce the need for external sensing components in industrial monitoring designs. The dual-bank Flash organization and 64 KB plus 32 KB SRAM banking are useful for controlled firmware maintenance and memory-constrained real-time workloads.
The ARM Cortex-M3 revision 2.0 core includes a Memory Protection Unit, Thumb-2 instruction set, a 24-bit SysTick counter, and nested vector interrupt control. These features support deterministic interrupt handling, protected memory regions, and efficient embedded code execution. Connectivity includes CAN, ISUP2C, IrDA, LIN, MMC, SPI, SSC, and UART/USART, allowing the MCU to serve as the central controller for industrial, communications, and data-acquisition equipment.
Typical applications include industrial automation modules, CAN-connected controllers, motor and power-system control, communications equipment, environmental monitoring, and compact embedded gateways. In a CAN node, the integrated controller and transceiver interface logic simplify protocol handling. In a measurement system, the 12-bit ADC, temperature sensor, timers, and SRAM support concurrent sensing and control tasks.
The principal design consideration is the 100-TFBGA footprint: the device requires a multilayer PCB, fine-pitch assembly, and careful escape-routing before power, ground, high-speed signals, and analog inputs are assigned. Designers should also verify peripheral availability, pin multiplexing, operating-temperature limits, and transceiver requirements against the manufacturer datasheet before releasing a new PCB layout.
This page consolidates the verified distributor specifications, package information, memory characteristics, and connectivity details while clearly identifying engineering data that still requires datasheet confirmation. It also provides application-oriented guidance and same-package alternatives that help engineers evaluate migration without confusing compatibility with merely similar functionality.
드롭인 대체품: ATSAM3A8CA-CU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM3A8CA-CU (동일 폼 팩터 및 풋프린트) — 차이점: Connectivity, Flash Memory, Package, SRAM, Interrupt Controller.
ATSAM3A8CA-AU
✅ 드롭인가격 문의
데이터시트 보기 →ATSAM3X8EA-CU
✅ 드롭인가격 문의
데이터시트 보기 →ATSAM3A8CA-CU 최대 정격 & 전기적 특성
| Processor Core | ARM Cortex-M3 revision 2.0, 32-bit |
| Maximum CPU Frequency | 84 MHz |
| Instruction Set | Thumb-2 |
| Flash Memory | 512 KB |
| Flash Organization | 2 x 256 KB banks |
| SRAM | 96 KB |
| SRAM Organization | 64 KB + 32 KB banks |
| Supply Voltage Range | 1.62 V to 3.6 V |
| 패키지 | 100-TFBGA, 9 x 9 mm |
| 실장 유형 | Surface Mount |
| ADC | 12-bit |
| DAC | 12-bit |
| Temperature Sensor | Integrated |
| Timer | 32-bit timer and PWM timer |
| Real-Time Clock | Integrated RTC |
| Connectivity | CAN, ISUP2C, IrDA, LIN, MMC, SPI, SSC, UART/USART |
| Memory Protection | Memory Protection Unit (MPU) |
| System Timer | 24-bit SysTick counter |
| Interrupt Control | Nested Vector Interrupt Controller |
ATSAM3A8CA-CU 100-tfbga, 9 x 9 mm 핀 구성 가이드
ATSAM3A8CA-CU(100-tfbga, 9 x 9 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM3A8CA-CU.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM3A8CA-CU 적합 용도: 6 애플리케이션s: CAN-Connected Industrial Control, Industrial Sensor Acquisition, Environmental Monitoring Gateway, Communications Equipment, Motor and Power-System Control, Compact Embedded Gateway.
CAN-Connected Industrial Control
ATSAM3A8CA-CU fits compact industrial control nodes that need deterministic processing and standard field-bus connectivity. Its 84 MHz ARM Cortex-M3 core and 32-bit timers support protocol handling, acquisition sequencing, and real-time actuator control, while the verified interface list includes CAN and UART/USART. The 512 KB Flash provides room for application firmware, and 96 KB SRAM accommodates communication buffers and working state. In a CAN node, the MCU can manage frame filtering and state logic while an external transceiver connects the physical bus. The 100-TFBGA 9 x 9 mm package also supports compact controller layouts, although ball-escape routing and multilayer assembly must be planned before layout release.
추천
Industrial Sensor Acquisition
ATSAM3A8CA-CU is appropriate for multi-sensor acquisition equipment that combines analog measurement with embedded processing. The integrated 12-bit ADC supports sampled analog inputs, the 12-bit DAC supports excitation or reference generation, and the temperature sensor provides an additional local measurement resource. At 84 MHz, the Cortex-M3 core can service timed sampling, filtering, data formatting, and host communications without relying on a separate processor. The 96 KB SRAM is organized as 64 KB plus 32 KB banks, while 512 KB Flash supports firmware, calibration tables, and configuration data. Designers should still verify analog pin multiplexing, acquisition timing, reference requirements, and input voltage limits from the manufacturer datasheet.
추천
Environmental Monitoring Gateway
ATSAM3A8CA-CU supports environmental monitoring gateways because it combines low-voltage operation, local processing, and several communication interfaces. The 1.62 V to 3.6 V supply range fits compact embedded platforms, while the 84 MHz Cortex-M3 core can aggregate measurements, apply calibration, detect events, and manage protocol traffic. Verified connectivity includes UART/USART, SPI, CAN, and other serial options, allowing the device to interface with sensors and a local network. Its 512 KB Flash stores firmware and mapping data, and the integrated temperature sensor can monitor conditions near the controller. A production design should confirm the exact analog input limits and pin multiplexing and should use the MCU's low-power modes only after their timing and wake-up behavior are confirmed.
추천
Communications Equipment
ATSAM3A8CA-CU is suitable for embedded communications equipment requiring broad serial-interface support and local protocol processing. The verified connectivity set includes CAN, SPI, SSC, UART/USART, LIN, IrDA, ISUP2C, and MMC, allowing one controller to supervise multiple physical and logical links. Its 84 MHz Cortex-M3 performance provides useful headroom for framing, buffering, routing, and supervisory tasks, while 512 KB Flash accommodates stack configuration and firmware. In a communications module, the MCU can bridge a local sensor bus to a higher-speed host interface or maintain timing and error-handling logic. Before selecting it, verify the package-level alternate functions, electrical characteristics, DMA availability, and any transceiver or clock components required by the selected protocols.
추천
Motor and Power-System Control
ATSAM3A8CA-CU can serve as the control processor in compact motor-control or power-system modules where real-time computation and mixed connectivity are required. The 84 MHz Cortex-M3 core and 32-bit timers provide a platform for timing PWM generation, sampling feedback, and applying control algorithms. Its 12-bit ADC and DAC support analog measurement and control, while CAN and UART/USART enable supervisory communication with a system controller. The 96 KB SRAM provides space for control state and diagnostics, and 512 KB Flash supports algorithms plus operating parameters. This application requires careful separation of analog, digital, and power domains on the 100-TFBGA PCB; exact timer channels, comparator functions, PWM resolution, and pin assignments must be confirmed before hardware implementation.
추천
Compact Embedded Gateway
ATSAM3A8CA-CU is a compact gateway controller for equipment that must mediate between sensors, actuators, and an upstream network. Its 512 KB Flash and 96 KB SRAM support protocol stacks and buffering, while the 84 MHz Cortex-M3 core handles routing, status monitoring, and local fallback behavior. The verified list of CAN, SPI, UART/USART, MMC, and other interfaces enables connection to sensors, storage, and communication modules. The device's 1.62 V to 3.6 V operating range can simplify low-voltage power architecture, but rail sequencing and peak current still require board-level validation. The 100-TFBGA 9 x 9 mm package reduces footprint but makes escape routing, thermal management, and assembly capability central constraints for a successful design.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAM3A8CA-CU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM3A8CA-AU | ATSAM3X8EA-CU |
|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (9x9) | 100-TFBGA (9x9) | 100-TFBGA (9x9) |
| Processor Core | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit |
주요 차별점
- Verified 84 MHz Cortex-M3 performance with 512 KB Flash (vs ATSAM3X8EA-CU)
- Mixed-signal resources integrated into the MCU (vs ATSAM3X8EA-CU)
- Broad communications peripheral set (vs ATSAM3X8EA-CU)
- Closest supported ordering-path alternative (vs ATSAM3A8CA-AU)
설계 노트
Treat the 100-TFBGA 9 x 9 mm package as a fine-pitch BGA design rather than a conventional leaded component. Before schematic capture, assign every power, ground, analog, and communications ball from the exact manufacturer package drawing. Plan escape routing, via arrays, and layer transitions before placing decoupling capacitors. Validate the proposed stack-up, paste aperture, stencil, and assembly process with the package drawing and the PCB manufacturer's current capabilities.
The verified operating range is 1.62 V to 3.6 V, but that range does not identify the required sequencing relationship among supply rails. Review the manufacturer recommended operating circuit and pin table before connecting external modules. Place local high-frequency bypass capacitors immediately beside the relevant device pins, keep analog and digital return paths controlled, and confirm peak current, startup behavior, and whether any external transceiver contributes to the rail budget.
Because the supplied records confirm a 100-TFBGA package but do not provide the complete ball map, pin names, or alternate-function matrix, the PCB layout cannot safely be created from secondary summaries. Download the exact ATSAM3A8C package drawing, cross-check every selected peripheral signal against its ball and multiplexing options, and preserve documented keep-out, exposed-pad, and thermal-via requirements. Do not infer pins from the ATSAM3A8CA-AU or ATSAM3X8EA-CU ordering codes without the matching datasheet.
For CAN, SPI, SSC, MMC, UART/USART, or other high-speed links, route signals with continuous reference planes and avoid crossing plane splits. Match external transceiver, clock, termination, and pull-component requirements to the selected protocol and operating mode. The verified data establishes interface presence but not signal rates or routing constraints, so use the manufacturer interface specifications and application guidance for trace-length, impedance, grounding, and EMI requirements.
The most common migration error is treating a related SAM3 ordering code as interchangeable solely because it uses the same BGA size. Verify pin-to-pin compatibility, memory capacity, ADC and DAC channels, timer resources, communication peripherals, supply pins, temperature grade, and package markings against the exact alternative datasheet. In particular, ATSAM3X8EA-CU has the same broad family and 100-TFBGA class in the supplied comparison result, but its complete ball-level compatibility is not established by the provided evidence.
규정 준수 정보
The verified excerpts identify an industrial-temperature ordering option but do not explicitly state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status for ATSAM3A8CA-CU. Compliance must be confirmed from the current Microchip product declaration or material disclosure.
