ATSAM4E8CA-CUR - 120MHz Cortex-M4 MCU, 512KB Flash | Microchip
부품 번호: ATSAM4E8CA-CUR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.1 | $5.10 |
| 10 | $4.62 | $46.20 |
| 100 | $4.15 | $415.00 |
| 500 | $3.72 | $1,860.00 |
| 1,000 | $3.24 | $3,240.00 |
ATSAM4E8CA-CUR 개요
A microcontroller (MCU) is a single-chip computer that integrates a processor core, memory, and peripherals on one die, sitting at the top of the embedded-processing hierarchy: MCU -> embedded processor -> system-on-chip -> semiconductor device. The SAM4E series belongs to Microchip's SMART ARM-based Flash MCU portfolio, which consolidates the former Atmel SAM product line under the Microchip brand.
Key features of the ATSAM4E8CA-CUR include the ARM Cortex-M4 core with a hardware floating point unit (FPU), enabling single-cycle MAC and DSP instructions, and a high data bandwidth bus architecture per the manufacturer's product page. The 512 KB Flash array supports in-system programming, and the 100-TFBGA footprint packs extensive I/O into a 9 x 9 mm ball grid array suitable for two-layer ball-out routing.
Technically, the SAM4E8C integrates the Cortex-M4 with the SAM4E peripheral set, which the manufacturer targets at connectivity-oriented embedded designs; the -CU ordering code denotes the TFBGA-100 package with industrial temperature ordering, delivered in tape-and-reel packing for automated pick-and-place assembly. Supply voltage references for this family are listed as 1.2V (core) / 3.3V (I/O) in distributor specification data.
Typical applications include industrial networking nodes, embedded control systems, data-acquisition and logging equipment, and connected devices where the combination of 120 MHz DSP-capable processing, 512 KB Flash, and compact BGA packaging fits space-constrained PCBs.
A key design consideration is that TFBGA packages require controlled-impedance, fine-pitch PCB fabrication; verify your board house supports the 0.8 mm ball pitch footprint and plan power distribution and decoupling per the manufacturer datasheet before layout.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: ATSAM4E8CA-CUR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM4E8CA-CUR (동일 폼 팩터 및 풋프린트) — 차이점: RoHS Status, Packaging, Supply Voltage, Package, Core Processor.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM4E8CB-CU
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ATSAM4E16CA-CU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6.68 / 개
데이터시트 보기 →ATSAM4E16CB-CN
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.79 / 개
데이터시트 보기 →ATSAM4N8CA-CUR
✅ 드롭인✓ 재고 있음
$1.74 / 개
데이터시트 보기 →ATSAM4S16CA-CU
✅ 드롭인✓ 재고 있음
$4.89 / 개
데이터시트 보기 →ATSAM4E8CA-CUR 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M4 (SAM4E) |
| Core Size | 32-Bit |
| 최대 클록 주파수 | 120 MHz |
| Flash Memory Size | 512 KB (512K x 8) |
| FPU | Yes (Cortex-M4 with floating point unit) |
| 패키지 | 100-TFBGA (9 x 9 mm) |
| 실장 유형 | Surface Mount |
| 공급 전압 | 1.2 V core / 3.3 V I/O (family listing) |
| Packaging | Tape & Reel (R suffix) |
| Program Memory Type | FLASH |
| RoHS 상태 | Compliant (LFBGA GREEN per Mouser listing) |
| Architecture | SMART ARM-based Flash MCU, high data bandwidth architecture |
ATSAM4E8CA-CUR 100-tfbga (9 x 9 mm) 핀 구성 가이드
ATSAM4E8CA-CUR(100-tfbga (9 x 9 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM4E8CA-CUR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM4E8CA-CUR 적합 용도: 6 애플리케이션s: Industrial Network Nodes, Embedded Data Acquisition and Logging, Connected IoT Devices, Motor Control and Actuation Systems, Building Automation and Gateways, Medical and Diagnostic Instrumentation.
Industrial Network Nodes
The ATSAM4E8CA-CUR fits industrial networking nodes because its 120 MHz ARM Cortex-M4 with hardware FPU handles protocol stacks and real-time control simultaneously, while the SAM4E series connectivity peripheral set - which Microchip explicitly targets at connected embedded designs - offloads communication tasks from the CPU. The 512 KB Flash accommodates a TCP/IP or fieldbus stack plus application logic, and the 100-TFBGA 9 x 9 mm package keeps the controller footprint small on dense industrial I/O boards. Deployed between a physical network interface and local sensors/actuators, the MCU provides deterministic interrupt handling with single-cycle MAC/DSP instructions for filtering tasks; the trade-off versus larger devices is the 512 KB Flash ceiling, which should be checked against final stack size before layout freeze.
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Embedded Data Acquisition and Logging
For data-acquisition and logging equipment, the ATSAM4E8CA-CUR provides a 120 MHz Cortex-M4 with an FPU that executes digital filtering, FFT windowing, and calibration math in hardware, while its high data bandwidth architecture moves samples between peripherals and RAM efficiently. The 512 KB Flash holds acquisition firmware, lookup tables, and a file-system layer, and the compact 100-TFBGA package integrates cleanly into handheld or panel-mounted instruments. Used as the system controller sampling sensor front ends and writing to local storage or a communication link, it sustains real-time buffering with DSP-class throughput; designers should budget SRAM for sample buffers against the device's on-chip RAM and verify the operating temperature range in the manufacturer datasheet for field instruments.
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Connected IoT Devices
The ATSAM4E8CA-CUR suits connected IoT endpoints where a 120 MHz processor must run a network stack, security routines, and application code concurrently. Its Cortex-M4 FPU accelerates sensor fusion and cryptography-adjacent math, and the SAM4E series connectivity orientation - per Microchip's product page - makes it a natural fit for wired connected nodes. The 512 KB Flash stores the stack and OTA-capable application images, and the 9 x 9 mm TFBGA supports miniaturized product enclosures. Integrated as the main controller bridging a communication interface with local sensors, it offers deterministic performance at moderate power; the key consideration is that BGA assembly requires capable manufacturing partners, which is usually acceptable for production-volume IoT hardware.
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Motor Control and Actuation Systems
The ATSAM4E8CA-CUR is appropriate for digital motor control because the 120 MHz Cortex-M4 with single-cycle MAC and FPU executes field-oriented control (FOC) loops and PWM update math with high headroom. The SAM4E peripheral suite provides timer and communication resources for coordinating inverter drive and supervisory links, and 512 KB Flash holds control firmware plus protection and diagnostics code. Positioned as the controller between current/voltage sensing front ends and gate-driver circuitry, it supports closed-loop bandwidths adequate for industrial drives; the 100-TFBGA ball map should be reviewed for fan-out of timer and analog signals, and thermal design must account for sustained switching-frequency computation loads.
추천
Building Automation and Gateways
Building automation controllers and small gateways benefit from the ATSAM4E8CA-CUR's combination of 120 MHz processing, FPU, and SAM4E connectivity peripherals, which Microchip markets toward connected embedded systems. The 512 KB Flash supports multi-protocol firmware such as Modbus plus a management web interface, while the 100-TFBGA (9 x 9 mm) package fits the dense mixed-signal boards typical of room controllers. Acting as the node controller linking field devices to an upstream network, the MCU provides responsive interrupt-driven I/O with DSP instructions for sensor conditioning; engineers should confirm the industrial temperature grade and plan the 3.3 V I/O supply with robust ESD protection on externally exposed network lines.
추천
Medical and Diagnostic Instrumentation
Portable diagnostic and laboratory instruments use the ATSAM4E8CA-CUR where signal-processing throughput matters: the 120 MHz Cortex-M4 with FPU performs digital filtering and analysis algorithms without an external DSP, and 512 KB Flash retains calibration data and application firmware in-system. The 9 x 9 mm 100-TFBGA supports compact handheld enclosures, and tape-and-reel supply suits regulated, validated production lines. As the instrument's main controller sequencing analog front ends and presenting results over a communication interface, it delivers deterministic latency for sample timing; designers must observe the manufacturer datasheet for supply sequencing and confirm the operating temperature range, since medical enclosures often impose demanding thermal constraints.
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추천 제품 요약
엔지니어링 참조 데이터: ATSAM4E8CA-CUR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM4E8CB-CU | ATSAM4E16CA-CU | ATSAM4E16CB-CN | ATSAM4N8CA-CUR | ATSAM4S16CA-CU |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9) | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 |
| Max Clock Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 512 KB | 1024 KB | 1024 KB | 1024 KB | 512 KB | 1024 KB |
| Series Connectivity Features | SAM4E (connectivity-oriented) | SAM4E - identical | SAM4E - identical | SAM4E - identical | SAM4N - reduced peripheral set | SAM4S - no SAM4E connectivity |
| Pin Compatibility | Reference (TFBGA-100) | Pin-to-pin compatible | Pin-to-pin compatible | Pin-to-pin compatible | Pin-to-pin compatible (verify ball map) | Pin-to-pin compatible (verify ball map) |
주요 차별점
- Full SAM4E connectivity peripheral set in 512 KB Flash (vs ATSAM4N8CA-CUR)
- 512 KB Flash right-sizing (vs ATSAM4E16CA-CU)
- 1:1 SAM4E family match (vs ATSAM4S16CA-CU)
설계 노트
The 100-TFBGA (9 x 9 mm) package requires fine-pitch BGA fabrication capability, typically 0.8 mm ball pitch with via-in-pad or dog-bone fanout. Confirm your PCB fabricator supports the specified finished pad diameter and solder-mask-defined versus non-solder-mask-defined pads per the Microchip datasheet footprint before release. Plan at least one solid ground plane under the ball field, place decoupling capacitors on the opposite side directly beneath the power/ground ball pairs, and route high-frequency peripheral signals first to avoid congestion under the die area.
Distributor data lists a 1.2 V core / 3.3 V I/O supply scheme for this family. Provide a clean, low-noise 1.2 V core rail (typically via the on-chip regulator per family design or an external solution - verify against the manufacturer datasheet for the exact configuration used by this ordering code) and 3.3 V for I/O and Flash. Sequence supplies per the datasheet power-up requirements and add bulk plus 0.1 uF local decoupling at each supply ball. Estimated: at 120 MHz with peripherals active, supply current budgeting should follow the datasheet's typical active-mode figures rather than assumptions.
Microchip's official product page for ATSAM4E8C explicitly recommends that new designs consider Revision B devices for prototypes and production. Ordering the -CUR without checking silicon revision can produce inconsistent behavior between prototype and production lots. Additionally, verify flash wait-state settings for 120 MHz operation and confirm the -CUR ordering code's package and temperature definition against the datasheet ordering-information table before finalizing the BOM, since Atmel-to-Microchip part-number transitions changed some ordering-code documentation locations.
규정 준수 정보
Mouser listing describes the package as LFBGA GREEN (halogen/green indicator per listing), implying RoHS-compliant green packaging. Full REACH, lead-free, and conflict-minerals status should be confirmed from the Microchip product compliance documentation.
