ATSAM4E16CB-CN - Cortex-M4 120MHz 1MB MCU | Microchip
부품 번호: ATSAM4E16CB-CN ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.6 | $4.60 |
| 10 | $4.25 | $42.50 |
| 100 | $4 | $400.00 |
| 500 | $3.88 | $1,940.00 |
| 1,000 | $3.79 | $3,790.00 |
ATSAM4E16CB-CN 개요
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals into one chip, forming the lowest layer of the embedded systems hierarchy: MCU -> embedded processor -> system-on-chip -> semiconductor device. The SAM4E family belongs to Microchip (formerly Atmel) ARM-based MCU portfolio, targeting industrial and connectivity applications that need both processing throughput and rich analog integration.
Key features of the ATSAM4E16CB-CN include an ARM Cortex-M4 core with a 2 KB cache, Memory Protection Unit (MPU), DSP instructions, and a hardware Floating Point Unit (FPU) executing Thumb-2 instructions. It integrates dual 12-bit ADC and 12-bit DAC channels, Full-Speed USB, an Ethernet MAC, and multiple serial interfaces (USART, SPI, TWI), giving it a high data-bandwidth architecture suited for communication-heavy designs.
Architecturally, the Cortex-M4 pipeline with FPU offloads float-intensive control loops and signal processing from software, while the 2 KB cache sustains execution efficiency from on-chip Flash at 120 MHz. The extended temperature (-CN suffix) grade and MRL B (Microchip Reel Label) TFBGA, GREEN packaging make it suitable for harsh environments and lead-free, RoHS-aligned assembly flows.
Typical applications include industrial automation controllers, networked sensor gateways using the Ethernet MAC and USB, and motor control or power conversion systems that leverage the FPU, dual ADCs, and PWM peripherals. The 9x9 mm TFBGA footprint also fits space-constrained embedded designs.
Design consideration: the 100-ball fine-pitch BGA requires controlled-impedance, microvia-capable PCB fabrication and X-ray inspection for assembly, so verify your manufacturing partner supports 0.8 mm ball-pitch BGA assembly before layout. Note that Microchip recommends Revision B parts for new designs and prototypes.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single verified reference for the ATSAM4E16CB-CN.
드롭인 대체품: ATSAM4E16CB-CN — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM4E16CB-CN (동일 폼 팩터 및 풋프린트) — 차이점: Flash Memory, Package, RoHS Status, SRAM, Core.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM4E16CB-CU
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ATSAM4E16CB-CNR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$9.64 / 개
데이터시트 보기 →ATSAM4S16CA-CU
✅ 드롭인✓ 재고 있음
$4.89 / 개
데이터시트 보기 →ATSAM4SD32CA-CU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$8.62 / 개
데이터시트 보기 →ATSAM4S16CB-CU
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ATSAM4E16CB-CN 최대 정격 & 전기적 특성
| Core | ARM Cortex-M4 with 2 Kbytes Cache |
| Core Size | 32-Bit |
| 최대 클록 주파수 | 120 MHz |
| Flash Memory | 1 MB (1M x 8) |
| Instruction Set | Thumb-2 |
| DSP Instructions | Yes |
| Floating Point Unit (FPU) | Yes |
| Memory Protection Unit (MPU) | Yes |
| ADC Resolution | 12 bit |
| DAC Resolution | 12 bit |
| USB | Full-Speed USB |
| 패키지 | 100-TFBGA (9x9 mm) |
| 실장 유형 | Surface Mount |
| Temperature Grade | Extended temperature (EXT TEMP) |
| Packaging Label | MRL B, GREEN |
| Series | SAM4E |
| RoHS 상태 | Compliant (GREEN package) |
ATSAM4E16CB-CN 100-tfbga (9x9 mm) 핀 구성 가이드
ATSAM4E16CB-CN(100-tfbga (9x9 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM4E16CB-CN.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM4E16CB-CN 적합 용도: 6 애플리케이션s: Industrial Automation Controllers, Networked Sensor Gateways, Motor Control and Power Conversion, Medical and Diagnostic Instrumentation, Building Automation and HVAC Control, Security and Video Surveillance Control.
Industrial Automation Controllers
The ATSAM4E16CB-CN fits programmable logic controllers and industrial I/O nodes because its 120 MHz Cortex-M4 with hardware FPU executes PID and motion-control math in real time, while the MPU supports functional software partitioning. The dual 12-bit ADCs digitize sensor and current-feedback channels, and multiple USART/SPI/TWI interfaces connect drives, encoders, and HMI panels. In a typical design the MCU runs the control loop from on-chip 1 MB Flash with the 2 KB cache sustaining deterministic execution. The extended temperature grade of the -CN variant tolerates cabinet environments without active cooling, reducing system cost. Its FPU offloads float arithmetic that would saturate a Cortex-M3, leaving headroom for communication stacks.
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Networked Sensor Gateways
The SAM4E family's integrated Ethernet MAC makes the ATSAM4E16CB-CN a natural fit for sensor-to-cloud gateways, where field data from RS-485, CAN, or analog inputs is aggregated and forwarded over Ethernet. The 1 MB Flash accommodates a TCP/IP stack plus application firmware without external memory, and Full-Speed USB provides local configuration or firmware update paths. The 120 MHz core with FPU handles protocol processing and data filtering concurrently. Placing the PHY chip adjacent to the MCU's RMII/MII pins on a 4-layer board yields a compact gateway; the extended temperature rating suits rooftop and outdoor cabinets. Unlike external-MCU-plus-Ethernet-chip solutions, the single-chip integration cuts BOM count and board area.
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Motor Control and Power Conversion
For FOC-based motor drives and digital power converters, the ATSAM4E16CB-CN combines the ingredients needed in one chip: a 120 MHz Cortex-M4 with hardware FPU for fast Clarke/Park transforms, dual 12-bit ADCs for phase-current sensing, PWM peripherals for inverter gating, and a 12-bit DAC for reference or monitoring outputs. The 2 KB cache and 1 MB Flash keep the control ISR and higher-level state machine resident on-chip. The FPU typically halves CPU load compared to fixed-point implementations, simplifying firmware and enabling higher switching-frequency control loops. The extended temperature -CN grade suits drives mounted near heat sources such as inverters and power supplies.
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Medical and Diagnostic Instrumentation
Benchtop medical devices such as glucose analyzers, pulse-oximeter modules, and portable diagnostic instruments benefit from the ATSAM4E16CB-CN's combination of 12-bit ADC sampling, FPU-accelerated signal processing (digital filtering, FFT, calibration math), and USB connectivity to host PCs. The MPU enables isolation of safety-critical measurement code from communication stacks, supporting structured software architectures demanded in regulated designs. The 1 MB Flash stores calibration tables, DSP coefficient sets, and UI assets without external memory. Full-Speed USB provides a standards-based data path to host software, while the extended temperature variant tolerates autoclave-adjacent warm environments. Board designers should follow the datasheet's analog layout guidance for ADC noise floor.
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Building Automation and HVAC Control
Air-handling units, chillers, and smart thermostats require long-term reliability across wide ambient temperatures, making the extended-temperature ATSAM4E16CB-CN appropriate. Its 120 MHz Cortex-M4 with FPU runs sensor-fusion and efficiency-optimization algorithms, multiple USART/TWI ports connect energy meters and occupancy sensors, and the Ethernet MAC integrates the controller into BMS networks. The 1 MB Flash supports OTA-style firmware updates over the network with dual-image schemes, and the 12-bit ADCs read temperature, pressure, and humidity channels directly. GREEN, RoHS-compliant packaging aligns with building-products environmental requirements. The 9x9 mm TFBGA keeps controller boards compact for installation inside ductwork enclosures.
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Security and Video Surveillance Control
Camera control boards, access-control panels, and NVR management modules use the ATSAM4E16CB-CN as the supervisory MCU: the Ethernet MAC links the unit to IP networks, UART/SPI interfaces talk to image sensors or RFID readers, and the 120 MHz FPU core performs motion-detection preprocessing and cryptographic-heavy housekeeping efficiently. The 1 MB Flash stores web-server assets and configuration, while the extended temperature rating suits outdoor camera housings that see -40 C to +85 C swings. The dual ADC and DAC channels support analog sensor and alarm loops. Compared with running all logic in an SoC, offloading reliable control and networking to this MCU improves system robustness and watchdog-able determinism.
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추천 제품 요약
엔지니어링 참조 데이터: ATSAM4E16CB-CN — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM4E16CB-CU | ATSAM4E16CB-CNR | ATSAM4S16CA-CU | ATSAM4SD32CA-CU |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | TFBGA-100 - same footprint | TFBGA-100 - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Frequency | Cortex-M4, 120 MHz | Cortex-M4, 120 MHz | Cortex-M4, 120 MHz | Cortex-M4, 120 MHz | Cortex-M4, 120 MHz |
| Flash Memory | 1 MB (1M x 8) | 1 MB | 1 MB | 1 MB | 512 KB x 2 (dual bank) |
| Ethernet MAC | Yes (SAM4E feature) | Yes | Yes | No (SAM4S family) | No (SAM4S family) |
| FPU / DSP Instructions | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
| Temperature Grade | Extended (EXT TEMP, -CN) | Industrial (-CU) | Extended (-CN) | Industrial (-CU) | Industrial (-CU) |
| Firmware Compatibility | SAM4E code base | Identical (same die) | Identical (same die) | Port required (SAM4S SDK) | Port required + Flash layout change |
주요 차별점
- Extended temperature grade in BGA package (vs ATSAM4E16CB-CU)
- Integrated Ethernet MAC (vs ATSAM4S16CA-CU)
- Single 1 MB Flash bank simplicity (vs ATSAM4SD32CA-CU)
설계 노트
The 100-TFBGA (9x9 mm) package uses fine-pitch BGA lands requiring microvia or via-in-pad fabrication. Specify an at least 4-layer stack-up with dedicated ground plane beneath the device to provide return paths for the 120 MHz core and Ethernet RMII signals. Verify your assembly house supports BGA X-ray inspection; solder bridging under the package is invisible optically. Follow Microchip's SAM4E datasheet land-pattern and ball-map annex exactly, and do not reuse SAM4S BGA layouts without checking the ballout, since peripheral multiplexing differs between families.
The SAM4E supports a core supply separate from the I/O and analog domains; use the recommended ferrite-bead or LC filtering on the analog 3.3 V rail feeding the 12-bit ADC reference to preserve effective resolution. Estimate: at 120 MHz typical core currents in the tens-of-mA range, a linear regulator dropping 5 V to 3.3 V at 50 mA dissipates roughly 85 mV*50 mA = 85 mW... more precisely (5-3.3)*0.05 = 0.085 W, which is acceptable without heatsinking; verify against the datasheet current-consumption tables for your clock configuration and enabled peripherals.
Microchip explicitly recommends Revision B devices for new designs and production; ordering older revision stock can produce silicon-errata mismatches with your firmware. Also, the -CN extended temperature variant is not a substitute reason to skip thermal derating: confirm your worst-case junction temperature against the datasheet theta-JA for the TFBGA on your board stack-up. Finally, when treating SAM4S parts (e.g., ATSAM4S16CA-CU) as alternatives, remember the SAM4E's Ethernet MAC and certain peripherals are absent, so firmware and ballout must be re-validated.
Ethernet MII/RMII traces to the PHY should be length-matched and routed over a continuous reference plane; keep RMII clock traces short (less than 50 mm as a practical rule) and avoid routing them across plane splits. USB Full-Speed D+/D- lines require 90-ohm differential impedance and should be routed as a matched pair without stubs. Estimated: at 120 MHz internal clocks, harmonics extend well into the 100+ MHz region, so place 100 nF decoupling capacitors at every supply ball grouping with low-inductance via connections.
규정 준수 정보
Mouser listing describes the part as 'TFBGA, GREEN, EXT TEMP, MRL B' - Microchip GREEN packaging indicates RoHS-compliant, lead-free, halogen-free construction. REACH and conflict-minerals declarations are not stated in the provided data.
