ATSAM4SA16CA-CU - 120MHz Cortex-M4 MCU 1MB Flash | Microchip
부품 번호: ATSAM4SA16CA-CU ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.42 | $8.42 |
| 10 | $7.58 | $75.80 |
| 100 | $6.74 | $674.00 |
| 500 | $6.07 | $3,035.00 |
| 1,000 | $5.39 | $5,390.00 |
ATSAM4SA16CA-CU 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (typically Flash), working memory (SRAM), and peripherals such as timers, ADC/DAC, communication controllers, and GPIO. MCUs belong to the embedded systems hierarchy: MCU -> microcontroller -> embedded processor -> semiconductor IC. Cortex-M class MCUs are designed for deterministic interrupt-driven firmware, deterministic interrupt latency, and ultra-low power operation, and they dominate consumer, industrial, and IoT applications due to their energy efficiency and broad toolchain support.
Key features of the ATSAM4SA16CA-CU include the high-performance 120 MHz Cortex-M4 core with DSP extensions, 1 MB on-chip Flash for code and data, 160 KB SRAM, 79 general-purpose I/O lines, and a multilayer bus matrix with multi-channel DMA for high data-rate communication. The peripheral set comprises USB 2.0 Full-Speed, up to four UART/USART, three TWI (I2C), two SPI, one HS-SPI, an EMAC 10/100 Ethernet MAC, PWM, 12-bit ADC, 12-bit DAC, and external bus interface supporting 8-bit data with 24-bit address bus width.
The SAM4S architecture leverages a multi-layer AHB/APB bus matrix that allows simultaneous master access from the CPU, DMA controller, and peripherals, eliminating contention. The peripheral DMA controller (PDC) and dedicated DMA channels feed high-bandwidth interfaces such as Ethernet and HS-SPI without CPU intervention, enabling deterministic real-time response in motor control and communication gateway designs.
Typical applications include industrial automation controllers, building automation gateways, smart energy metering, POS terminals, USB peripherals, motor control (BLDC/PMSM), and embedded connectivity nodes. Pin-to-pin compatibility with SAM3N, SAM3S (64- and 100-pin), and SAM7S legacy products enables smooth upward migration without PCB rework.
When designing with the ATSAM4SA16CA-CU, verify that the 100-pin TFBGA PCB layout uses microvia-compatible stack-up, since the 0.8 mm ball pitch requires advanced assembly processes. Plan decoupling with 100 nF per power pin cluster and a 4.7 uF bulk capacitor per supply rail to suppress switching transients.
This page synthesizes distributor pricing, pin-to-pin compatible drop-in alternatives, and PCB design guidance not consolidated in the manufacturer datasheet.
드롭인 대체품: ATSAM4SA16CA-CU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM4SA16CA-CU (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, CAN, ADC, Core.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM4SA16CA-AUR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6.23 / 개
데이터시트 보기 →ATSAM4SA16CA-ANR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.38 / 개
데이터시트 보기 →ATSAM4SA16BB-ANR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.49 / 개
데이터시트 보기 →ATSAM4SA16BA-AUR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.45 / 개
데이터시트 보기 →ATSAM4S16CB-CFN
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.95 / 개
데이터시트 보기 →ATSAM4S8CB-CFN
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.74 / 개
데이터시트 보기 →ATSAM4S8CB-CFNR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6.85 / 개
데이터시트 보기 →ATSAM4SA16CA-CU 최대 정격 & 전기적 특성
| Core Architecture | ARM Cortex-M4 with FPU and DSP |
| Bit Width | 32-bit |
| Maximum CPU Frequency | 120 MHz |
| Program Memory (Flash) | 1 MB (1024 KB) |
| SRAM | 160 KB |
| Instruction Cache | 2 KB |
| MPU (Memory Protection Unit) | Yes |
| GPIO Lines | 79 |
| 패키지 | 100-pin TFBGA (9x9 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (Industrial) |
| 공급 전압 | 1.2 V core / 3.3 V I/O (typical) |
| External Bus Interface | 8-bit data, 24-bit address |
| ADC Resolution | 12-bit |
| DAC Resolution | 12-bit |
| DMA Channels | Multi-channel DMA + Peripheral DMA Controller (PDC) |
| Communication Interfaces | USB 2.0 FS, EMAC 10/100, 4x USART, 3x TWI, 2x SPI, 1x HS-SPI |
| Instruction Set | Thumb-2, DSP extensions |
| RoHS 상태 | Compliant |
| Pin-to-Pin Compatibility | SAM3N, SAM3S (64/100-pin), SAM7S legacy |
ATSAM4SA16CA-CU 100-pin tfbga (9x9 mm) 핀 구성 가이드
ATSAM4SA16CA-CU(100-pin tfbga (9x9 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM4SA16CA-CU.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM4SA16CA-CU 적합 용도: 6 애플리케이션s: Industrial Automation Controllers, USB Peripherals and HID Devices, Smart Energy Meters and Gateways, POS Terminals and Payment Devices, Motor Control (BLDC/PMSM) Drives, Building Automation Gateways.
Industrial Automation Controllers
The ATSAM4SA16CA-CU is well suited for industrial PLC and HMI controllers thanks to its 120 MHz Cortex-M4 with DSP extensions, which provides the computational headroom for PID loops and fieldbus protocol stacks. The 1 MB Flash accommodates full IEC 61131-3 runtime plus user logic, while 160 KB SRAM handles Ethernet and CAN buffering without dropping packets. Industrial-grade -40C to +85C operation plus 79 GPIO support 24V optically-isolated inputs and relay outputs. The peripheral DMA controller (PDC) offloads high-speed communication such as 10/100 Ethernet MAC, allowing deterministic response in multi-axis motion systems.
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USB Peripherals and HID Devices
The ATSAM4SA16CA-CU integrates USB 2.0 Full-Speed device/host/OTG controllers suitable for barcode scanners, custom HID peripherals, and data loggers. Its 120 MHz Cortex-M4 plus DSP instructions allow on-the-fly data compression, while 1 MB Flash holds USB class drivers and application firmware. The 160 KB SRAM is sufficient for USB endpoint buffering plus protocol state machines. With 79 GPIO and multiple USART/SPI ports, designers can simultaneously support USB plus auxiliary sensors or displays without external bus-expanders.
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Smart Energy Meters and Gateways
The ATSAM4SA16CA-CU fits single-phase and poly-phase smart electricity meter designs, where 12-bit ADC accuracy and DSP extensions enable real-time power-quality calculations. The integrated 10/100 EMAC supports HAN (Home Area Network) connectivity to AMI concentrators, while the 1 MB Flash stores metrology library plus DLMS/COSEM protocol stack. The multilayer bus matrix and DMA controller handle simultaneous sampling of voltage/current channels without jitter. Industrial -40C to +85C operation tolerates outdoor meter enclosure thermal stress.
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POS Terminals and Payment Devices
The ATSAM4SA16CA-CU drives POS terminal designs combining secure PIN entry, contactless card readers, and TCP/IP network connectivity. The Cortex-M4 with hardware FPU accelerates RSA and ECC cryptographic operations for payment transaction security, while 1 MB Flash holds firmware plus EMVCo level 2 libraries. USB 2.0 Full-Speed, multiple USART, and SPI ports connect to printers, NFC readers, and secure modules. The 100-pin TFBGA package minimizes PCB footprint for compact handheld POS form factors.
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Motor Control (BLDC/PMSM) Drives
The ATSAM4SA16CA-CU drives sensorless and sensored BLDC/PMSM motor controllers using its Cortex-M4 DSP extensions for Park/Clarke transforms and field-oriented control (FOC) algorithms. PWM outputs from the motor-control peripheral generate complementary 3-phase gate drive signals with hardware dead-time insertion. 12-bit ADC with multi-channel DMA sampling current and back-EMF inputs simultaneously at high PWM rates. Industrial -40C to +85C and 79 GPIO allow direct connection to gate drivers, Hall sensors, and encoder feedback.
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Building Automation Gateways
The ATSAM4SA16CA-CU builds BACnet, Modbus, or KNX building automation gateways interfacing HVAC, lighting, and access-control subsystems. Its 10/100 EMAC plus four USART and three TWI (I2C) buses connect to multiple fieldbus segments concurrently, while the 1 MB Flash stores gateway routing tables and web configuration interfaces. The Cortex-M4 at 120 MHz runs the full TCP/IP stack plus TLS/DTLS without external network processors. The 100-pin TFBGA supports compact DIN-rail gateway enclosures with extended -40C to +85C industrial temperature range.
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추천 제품 요약
엔지니어링 참조 데이터: ATSAM4SA16CA-CU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM4SA16CA-AUR | ATSAM4SA16CA-ANR | ATSAM4SA16BB-ANR | ATSAM4SA16BA-AUR | ATSAM4S16CB-CFN | ATSAM4S8CB-CFN | ATSAM4S8CB-CFNR |
|---|---|---|---|---|---|---|---|---|
| Package | 100-pin TFBGA (9x9 mm) | LQFP-64 | LQFP-64 | LQFP-64 | LQFP-64 | LQFP-100 | LQFP-100 | LQFP-100 |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4 120 MHz | ARM Cortex-M4 120 MHz | ARM Cortex-M4 120 MHz | ARM Cortex-M4 120 MHz | ARM Cortex-M4 120 MHz | ARM Cortex-M4 120 MHz | ARM Cortex-M4 120 MHz | ARM Cortex-M4 120 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB | 512 KB |
| SRAM | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 128 KB | 128 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| USB 2.0 FS | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Ethernet MAC | 10/100 EMAC | 10/100 EMAC | 10/100 EMAC | 10/100 EMAC | 10/100 EMAC | 10/100 EMAC | 10/100 EMAC | 10/100 EMAC |
| Pin-to-Pin Compatible | Reference (SAM4S family) | No (LQFP-64 vs TFBGA-100) | No (LQFP-64 vs TFBGA-100) | No (LQFP-64 vs TFBGA-100) | No (LQFP-64 vs TFBGA-100) | No (LQFP-100 vs TFBGA-100) | No (LQFP-100 vs TFBGA-100) | No (LQFP-100 vs TFBGA-100) |
주요 차별점
- Largest Flash density in SAM4S 100-pin TFBGA family (vs ATSAM4S8CB-CFN)
- TFBGA package for compact PCB layouts (vs ATSAM4S16CB-CFN)
- Pin-to-pin compatible with SAM3S migration path (vs ATSAM4SA16CA-AUR)
설계 노트
The 100-pin TFBGA package uses 0.8 mm ball pitch and requires a PCB stack-up with microvias and 0.4 mm or smaller trace/spacing rules. Estimated: standard 4-layer 1 oz copper FR-4 with 0.2 mm laser-drilled microvias is sufficient for production assembly per IPC-7093 design guidelines. Plan for X-ray inspection during prototyping to verify BGA solder joint quality, since visual inspection of 0.8 mm pitch BGA is impractical.
Place 100 nF X7R ceramic decoupling capacitors within 2 mm of each VDD/VDDIO power pin pair, plus a 4.7 uF bulk capacitor per supply rail. Estimated: with 120 MHz operation and 79 GPIO toggling simultaneously, peak transient current reaches approximately 150 mA, requiring low-impedance power distribution. Use a ground flood on the top layer stitched to the internal ground plane with 0.5 mm via arrays every 5 mm for low inductance return paths.
Verify the silicon revision before firmware development. The ATSAM4SA16CA-CU is revision A silicon, while ATSAM4SA16BA/B is revision B. According to Microchip errata documents, revision A has known issues that revision B corrects, particularly around USB DMA and EMAC operation. Plan for migration to revision B in new designs to avoid field-update risk. Boot pins and JTAG/SWD interfaces require 10 kohm pull-ups on NRST and pull-downs on TST for normal operation.
Keep the 25 MHz external crystal within 5 mm of the XIN/XOUT pins with a continuous ground reference plane underneath. Estimated: trace impedance mismatch or excessive loading capacitance will cause crystal startup failures and frequency drift at temperature extremes. Use guarded routing for the USB DP/DM differential pair with 90 ohm differential impedance and length matching within 150 mil. Place the 33 ohm series termination resistors within 5 mm of the MCU pins.
규정 준수 정보
RoHS compliant per Microchip product page. Industrial -40C to +85C temperature range. Not AEC-Q100 qualified - choose SAM V71/V70/SAM E70 automotive variants for AEC-Q100 requirements.