ATSAME70N20A-CNT - 300MHz Cortex-M7 MCU 1MB Flash | Microchip
부품 번호: ATSAME70N20A-CNT ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.35 | $14.35 |
| 10 | $13.45 | $134.50 |
| 100 | $12.2 | $1,220.00 |
| 500 | $11.05 | $5,525.00 |
| 1,000 | $9.95 | $9,950.00 |
| 3,000 | $8.85 | $26,550.00 |
ATSAME70N20A-CNT 개요
An ARM Cortex-M7 MCU is a 32-bit microcontroller built around the ARM Cortex-M7 processor core, designed for deterministic real-time control combined with high-throughput signal processing. The Cortex-M7 sits at the top of the Cortex-M family, above Cortex-M4/M33, and offers a 6-stage superscalar pipeline, double-precision FPU, and tightly-coupled memory (TCM) for low-latency code execution. Microcontrollers such as the ATSAME70N20A-CNT function as the central processing unit in embedded systems, integrating CPU, memory, and peripherals on a single die.
Key features include a single-precision/double-precision FPU, 16 KB instruction cache and 16 KB data cache, tightly-coupled memory for time-critical routines, and a multi-layer bus matrix (AHB) capable of simultaneous peripheral DMA. The device integrates an extensive peripheral set including Ethernet MAC, USB 2.0 High-Speed PHY, CAN-FD, HS SDCard/eMMC interface, I2S audio, 12-bit 2 MSPS ADC, and motor-control PWM timers. Operating voltage is 1.62 V to 3.6 V core logic with separate 1.2 V internal regulator.
The architecture is built on a low-power CMOS process with multiple low-power modes (Sleep, Wait, Backup) and a fast wake-up controller. The integrated high-speed USB PHY eliminates external PHY components, while the 16-bit External Bus Interface (EBI) supports SRAM, NOR Flash, and SDRAM expansion up to 128 MB. A hardware cryptographic accelerator (TRNG, AES, SHA) is available on related variants.
Typical applications include industrial motor control (PMSM, BLDC, servo drives), graphical HMI panels with TFT LCD, automotive body and connectivity ECUs, IoT gateways with Ethernet/USB, audio processing equipment, and medical instrumentation requiring high computational throughput. The 300 MHz M7 core delivers 1500 CoreMark and 600 DMIPS, suitable for DSP-style workloads such as Kalman filtering and field-oriented control loops.
When designing with this MCU, plan for a 4-layer PCB with a solid ground pour under the TFBGA to manage thermal dissipation and signal-integrity on parallel bus interfaces. The high-speed USB traces require 90 ohm differential impedance and length matching within 150 mil. JTAG/SWD traces should be kept under 50 mm and isolated from switching power rails.
This page synthesizes distributor pricing, drop-in alternatives from the SAM E70 family, and practical PCB design guidance not consolidated in the manufacturer datasheet.
드롭인 대체품: ATSAME70N20A-CNT — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAME70N20A-CNT (동일 폼 팩터 및 풋프린트) — 차이점: Package, SRAM, Operating Temperature, ADC, Flash Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAME70N20A-CN
✅ 드롭인✓ 재고 있음
$7.75 / 개
데이터시트 보기 →ATSAME70N20B-CNT
✅ 드롭인✓ 재고 있음
$10.5 / 개
데이터시트 보기 →ATSAME70N21A-CNT
✅ 드롭인✓ 재고 있음
$8.85 / 개
데이터시트 보기 →ATSAMS70N20B-CNT
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAMS70N21B-CN
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
STM32F769NIH6
✅ 드롭인✓ 재고 있음
$15.85 / 개
데이터시트 보기 →ATSAME70N20A-CNT 최대 정격 & 전기적 특성
| Core Architecture | ARM Cortex-M7 with FPU (single + double precision) |
| 최대 클록 주파수 | 300 MHz |
| Core Performance | 1500 CoreMark / 600 DMIPS |
| Flash Memory | 1024 KB (1 MB) |
| SRAM | 384 KB |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Tightly-Coupled Memory (TCM) | Yes (ITCM + DTCM) |
| Operating Voltage | 1.62 V to 3.6 V (core 1.2 V internal) |
| 패키지 | 100-pin TFBGA (9x9 mm) |
| 동작 온도 | -40 C to +105 C (industrial) |
| 실장 유형 | Surface Mount (Tape & Reel, CNT suffix) |
| Supply Voltage Range | 3.0 V to 3.6 V typical (VDDIO/VDDIN) |
| USB Interface | USB 2.0 High-Speed PHY integrated |
| Ethernet | 10/100 Mbps MAC (GMII/RMII/MII) |
| CAN Interface | CAN-FD x2 |
| ADC | 12-bit, up to 2 MSPS, 24 channels |
| External Bus Interface (EBI) | 16-bit, supports SRAM/SDRAM/NOR up to 128 MB |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 (168 hours) |
ATSAME70N20A-CNT 100-pin tfbga (9x9 mm) 핀 구성 가이드
ATSAME70N20A-CNT(100-pin tfbga (9x9 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAME70N20A-CNT.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAME70N20A-CNT 적합 용도: 6 애플리케이션s: Industrial Motor Control (PMSM/BLDC), Graphical HMI with TFT LCD, Automotive Body and Connectivity ECU, Industrial IoT Gateway with Ethernet/USB, Audio Processing Equipment, Medical Instrumentation and Patient Monitoring.
Industrial Motor Control (PMSM/BLDC)
The ATSAME70N20A-CNT is well-suited for industrial PMSM, BLDC, and AC induction motor control applications requiring high-bandwidth field-oriented control (FOC) loops. The 300 MHz Cortex-M7 with single-cycle MAC and double-precision FPU executes complex control algorithms (Park/Clarke transforms, space-vector PWM, Kalman filters) within sub-microsecond cycle times, while the on-chip 12-bit 2 MSPS ADC with dual sample-and-hold enables simultaneous current sensing on two phases. Integrated PWM timers with 16-bit resolution support switching frequencies up to 100 kHz with center-aligned, complementary outputs and programmable dead-time insertion critical for three-phase inverter safety.
추천
Graphical HMI with TFT LCD
For graphical human-machine interface panels, the ATSAME70N20A-CNT's 16-bit External Bus Interface (EBI) connects directly to TFT LCD controllers or SDRAM, supporting displays up to WVGA (800x480) with hardware-accelerated 2D graphics. The 384 KB of SRAM combined with 128 MB external SDRAM expansion provides sufficient frame buffer memory, while the integrated USB 2.0 High-Speed and 10/100 Ethernet MAC enable connectivity for remote HMI panels. The 300 MHz M7 core renders emWin, TouchGFX, or LVGL interfaces at 60 fps without external graphics accelerators, reducing system BOM cost.
추천
Automotive Body and Connectivity ECU
The ATSAME70N20A-CNT operates over the -40 C to +105 C industrial temperature range and provides dual CAN-FD interfaces suitable for automotive body and gateway ECUs. Integrated USB High-Speed PHY and 10/100 Ethernet MAC support connectivity gateways bridging CAN, LIN, and IP networks. The Cortex-M7 core processes OSEK/ AUTOSAR stacks and security firmware, while hardware cryptographic accelerators (AES, SHA, TRNG on related variants) protect V2X communications. The device's 1 MB Flash supports bootloaders and secure firmware updates critical for automotive ECUs requiring ISO 26262 compliance flow.
추천
Industrial IoT Gateway with Ethernet/USB
The ATSAME70N20A-CNT's integrated 10/100 Ethernet MAC and USB 2.0 High-Speed PHY enable compact industrial IoT gateways without external PHY components. The Cortex-M7 core runs lightweight TCP/IP stacks (LwIP, CycloneTCP) and MQTT/CoAP application layers, while dual CAN-FD interfaces bridge to industrial fieldbus networks. With 384 KB SRAM and external SDRAM support via EBI, the device handles protocol translation, local data aggregation, and TLS-secured cloud connectivity for edge devices. The wide 1.62-3.6 V supply range tolerates industrial 24V rail transients with proper regulation.
추천
Audio Processing Equipment
For professional and prosumer audio equipment, the ATSAME70N20A-CNT's I2S peripheral supports multi-channel audio at 192 kHz sample rates, while the Cortex-M7 DSP extensions accelerate real-time audio processing (FFT, biquad filters, dynamics compression). The double-precision FPU maintains numerical accuracy for parametric EQ and crossover filter calculations, and 384 KB SRAM holds multiple audio buffers for low-latency processing. USB High-Speed Audio Class 2.0 compliance enables USB audio interface designs at 480 Mbps, while Ethernet supports Dante/AES67 networked audio transports for multi-channel installations.
추천
Medical Instrumentation and Patient Monitoring
The ATSAME70N20A-CNT's 12-bit 2 MSPS ADC with 24 channels acquires multi-lead ECG, EEG, and SpO2 signals in patient monitoring equipment, while the 300 MHz Cortex-M7 performs real-time DSP for heart-rate variability analysis, QRS detection, and noise filtering. The on-chip SRAM eliminates external memory access latency for time-critical signal processing, and hardware AES/SHA accelerators (on related variants) secure patient health information (PHI) per HIPAA requirements. The integrated USB and Ethernet enable connectivity to hospital information systems, while the wide operating temperature range supports portable bedside monitor designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAME70N20A-CNT — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAME70N20A-CN | ATSAME70N20B-CNT | ATSAME70N21A-CNT | ATSAMS70N20B-CNT | STM32F769NIH6 |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | STMicroelectronics |
| Package | 100-pin TFBGA (9x9 mm) | 100-pin TFBGA (9x9 mm) - same | 100-pin TFBGA (9x9 mm) - same | 100-pin TFBGA (9x9 mm) - same | 100-pin TFBGA (9x9 mm) - same | TFBGA-216 - different footprint |
| Core | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 216 MHz |
| Flash Memory | 1024 KB | 1024 KB | 1024 KB | 2048 KB | 1024 KB | 2048 KB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB | 512 KB |
| Ethernet MAC | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated | Not integrated | 10/100 integrated |
| USB HS PHY | Integrated | Integrated | Integrated | Integrated | Integrated | Integrated |
| CAN-FD | 2x | 2x | 2x | 2x | 2x | 2x |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +85 C |
주요 차별점
- Highest clock frequency in Microchip Cortex-M7 family (vs ATSAME54N20A-AU)
- Integrated USB 2.0 High-Speed PHY eliminates external component (vs STM32F769NIH6)
- Dual CAN-FD interfaces for automotive networking (vs ATSAME70Q20B-CFN)
- 16-bit External Bus Interface supports SDRAM expansion (vs ATSAM4SD32C)
설계 노트
Estimated: the 100-pin TFBGA at 9x9 mm with 0.8 mm pitch requires a 4-layer PCB with 0.5 oz copper pours for thermal dissipation and ground reference. Place the MCU on the top layer with a continuous ground plane directly below for signal return paths. Decoupling capacitors should be placed within 3 mm of each power pin, using 100 nF X7R ceramic in 0402 size for high-frequency decoupling and 4.7 uF bulk ceramic for transient suppression.
The high-speed USB 2.0 differential pair (D+/D-) requires 90 ohm differential impedance with intra-pair length matching within 150 mil (3.8 mm). Trace width should be approximately 8 mil on a 0.2 mm dielectric stackup. Keep USB traces away from switching regulator inductors and high-current motor drive traces. Place the ESD protection diode within 5 mm of the USB connector and minimize stub lengths to preserve signal integrity at 480 Mbps.
Estimated: the ATSAME70N20A-CNT core draws approximately 200 mA at 300 MHz with all peripherals active. Use a switching regulator with 500 mA rating for VDDIN/VDDOUT, followed by a low-dropout (LDO) regulator for VDDIO. The internal 1.2 V core regulator requires a 4.7 uF bulk capacitor on VDDCORE with ESR below 50 milliohm. Place a ferrite bead on analog supply pins (VDDANA) to isolate from digital switching noise.
Do not exceed the absolute maximum 3.6 V on any I/O pin - level shifters are required for 5V peripherals. The TCM (ITCM/DTCM) memory regions must be explicitly enabled in startup code or firmware will execute from Flash with full cache misses. JTAG and SWD pin multiplexing (TCK/TMS/TDO/TDI on PA0-PA3) must be configured before debug access is possible. When migrating from ATSAM4S/E70 revision A to revision B, review errata documents for changed peripheral behavior.
규정 준수 정보
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - SAM E70 industrial variant; for AEC-Q100 automotive applications consider the ATSAMV71 family. Halogen-free per JEDEC JS709B definitions.