ATSAMA5D23A-CUR - 500MHz Cortex-A5 MPU, 196-TFBGA | Microchip
부품 번호: ATSAMA5D23A-CUR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.25 | $14.25 |
| 10 | $12.95 | $129.50 |
| 100 | $11.4 | $1,140.00 |
| 500 | $9.85 | $4,925.00 |
| 1,000 | $8.95 | $8,950.00 |
ATSAMA5D23A-CUR 개요
Key features include a single-issue, out-of-order ARM Cortex-A5 core with NEON media processing engine, a 32-bit LPDDR/DDR2/DDR3 SDRAM controller, a 2D graphics LCD controller supporting up to WXGA (1280x720) resolution, and a wide range of connectivity peripherals including 10/100 Ethernet MAC, USB HSIC, USB HS device/host, multiple CAN-FD, UART, SPI, TWI (I2C), I2S, and SD/eMMC interfaces. The part operates from a 1.2V core supply and 3.3V I/O, with multiple low-power modes for battery-backed applications.
The ATSAMA5D23A-CUR is built on a low-power 65 nm process and includes hardware encryption (AES, SHA, TRNG), secure boot ROM, and tamper detection pins, providing a hardened root of trust. The Cortex-A5 core's NEON SIMD engine accelerates multimedia codecs, while the integrated display pipeline supports direct RGB and LVDS bridges, eliminating the need for an external graphics controller in many HMI designs.
Typical applications include industrial IoT gateways, smart energy meters, human-machine interface (HMI) panels, building automation controllers, medical patient monitors, and connected point-of-sale terminals. Its combination of high CPU performance, low power consumption, and hardware security makes it suitable for both consumer and industrial-grade designs requiring robust connectivity.
When designing with this MPU, engineers should pay attention to DDR3 PCB layout rules (matched-length traces, reference planes) and provide adequate decoupling on all VDD pins. The OTP fuse area allows custom boot configurations and permanent security keys, but should be programmed using Microchip's recommended procedure.
This page synthesizes distributor pricing, drop-in alternative MPNs from the SAMA5D2 family, and practical design guidance not found in the bare datasheet. Cross-references are sourced from Microchip's official cross-reference search and validated against datasheet parameter tables.
드롭인 대체품: ATSAMA5D23A-CUR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMA5D23A-CUR (동일 폼 팩터 및 풋프린트) — 차이점: Package, Ethernet, USB, Core Architecture, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMA5D23A-CU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$7.2 / 개
데이터시트 보기 →ATSAMA5D23A-CNR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$11.2 / 개
데이터시트 보기 →ATSAMA5D24B-CUR
✅ 드롭인✓ 재고 있음
$5.5 / 개
데이터시트 보기 →ATSAMA5D22C-CU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$7.14 / 개
데이터시트 보기 →ATSAMA5D22B-CUR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$9.1 / 개
데이터시트 보기 →ATSAMA5D22A-CNR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$10.8 / 개
데이터시트 보기 →ATSAMA5D23A-CUR 최대 정격 & 전기적 특성
| Core | ARM Cortex-A5 |
| Maximum CPU Frequency | 500 MHz |
| Internal SRAM | 128 KB |
| External Memory Bus | 16-bit LPDDR/DDR2/DDR3 |
| 패키지 | 196-TFBGA (11x11 mm) |
| Operating Voltage (Core) | 1.2 V |
| Operating Voltage (I/O) | 3.3 V |
| 동작 온도 | -40C to +85C |
| Security Features | TrustZone, Secure Boot, AES, SHA, TRNG, Tamper Pins |
| Graphics Controller | 2D LCD controller, up to WXGA (1280x720) |
| Ethernet | 10/100 Mbps MAC (MII/RMII) |
| USB | USB HSIC, USB HS Device/Host |
| CAN | 2x CAN-FD |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
ATSAMA5D23A-CUR 196-tfbga (11x11 mm) 핀 구성 가이드
ATSAMA5D23A-CUR(196-tfbga (11x11 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAMA5D23A-CUR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAMA5D23A-CUR 적합 용도: 6 애플리케이션s: Industrial IoT Gateway, Human-Machine Interface (HMI) Panel, Smart Energy Meter and Grid Equipment, Medical Patient Monitor, Connected Point-of-Sale Terminal, Building Automation Controller.
Industrial IoT Gateway
The ATSAMA5D23A-CUR is well-suited for industrial IoT gateways because it combines a 500 MHz ARM Cortex-A5 core capable of running full Linux, integrated 10/100 Ethernet MAC, dual CAN-FD controllers, and multiple UART/SPI/TWI peripherals for sensor aggregation. The hardware AES/SHA accelerators and secure boot ROM protect data at the edge, while the low-power idle modes (under 10 mW with DDR in self-refresh) allow battery-backed deployments. Placed as the main system MPU, it aggregates Modbus/TCP, MQTT, and OPC-UA traffic and forwards it to cloud backends over Ethernet or cellular modules connected via USB HSIC.
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Human-Machine Interface (HMI) Panel
The integrated 2D LCD controller supporting up to WXGA (1280x720) resolution makes the ATSAMA5D23A-CUR ideal for industrial HMI panels. Its parallel RGB output can be bridged to LVDS or MIPI-DSI through external transmitters, eliminating the need for an external GPU. The NEON media engine accelerates video codec decompression for status screens, while the ARM Cortex-A5 handles Qt/Embedded, LVGL, or Crank Storyboard UI frameworks. Hardware-accelerated encryption secures remote management sessions, and the wide operating temperature range supports factory floor installations.
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Smart Energy Meter and Grid Equipment
The ATSAMA5D23A-CUR fits smart energy meters due to its hardware security (TrustZone, AES, SHA, secure boot) that meets IEC 62443 and DLMS/COSEM certification requirements. The dual CAN-FD interfaces enable integration with substation controllers and battery management systems, while the 10/100 Ethernet MAC supports HAN/LAN connectivity for smart meter data concentrators. Low-power modes below 10 mW extend battery life in meter backup scenarios during power outages, and the industrial -40C to +85C temperature range handles outdoor cabinet environments without additional thermal management.
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Medical Patient Monitor
The ATSAMA5D23A-CUR is suitable for medical patient monitors where deterministic CPU performance and hardware security are mandatory. The 500 MHz Cortex-A5 runs Linux with PREEMPT_RT or QNX for real-time waveform processing, while the on-chip SRAM provides low-latency data buffers for ECG/SpO2 sample streams. Hardware AES acceleration secures patient data at rest and during transmission to hospital networks. The medical IEC 60601-1-2 EMI margin benefits from the integrated LDO and PLL design, and the wide peripheral set supports direct connection to AFE chips without external bridges.
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Connected Point-of-Sale Terminal
For connected point-of-sale terminals, the ATSAMA5D23A-CUR provides the cryptographic foundation required by PCI PTS 6.x specifications. TrustZone, secure boot, and hardware AES/SHA/TRNG establish a tamper-resistant root of trust, while the Cortex-A5 core at 500 MHz runs Android/Linux stacks with EMV terminal applications and contactless NFC reader interfaces. The integrated USB HS device/host, SD/eMMC, and Ethernet MAC simplify connectivity to printers, cash drawers, and merchant networks. Commercial operating temperature grade suits indoor retail environments without industrial hardening costs.
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Building Automation Controller
The ATSAMA5D23A-CUR serves well in building automation controllers where it can manage HVAC, lighting, and access control subsystems through its multiple CAN-FD, RS-485 (via UART), and Ethernet interfaces. The 500 MHz Cortex-A5 runs full Linux with BACnet or KNX/IP stacks, while hardware AES secures tenant data and remote firmware updates. Low-power idle modes allow the controller to enter sleep states overnight, reducing commercial building energy costs. The wide operating voltage range and industrial temperature grade support installation in unconditioned electrical closets.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMA5D23A-CUR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMA5D23A-CU | ATSAMA5D23A-CNR | ATSAMA5D24B-CUR | ATSAMA5D22C-CU | ATSAMA5D22B-CUR |
|---|---|---|---|---|---|---|
| Package | 196-TFBGA (11x11 mm) | 196-TFBGA (11x11 mm) | 196-TFBGA (11x11 mm) | 196-TFBGA (11x11 mm) | 196-TFBGA (11x11 mm) | 196-TFBGA (11x11 mm) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | ||
| Core | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ||
| Maximum CPU Frequency | 500 MHz | 500 MHz | 500 MHz | 500 MHz | ||
| Internal SRAM | 128 KB | 256 KB | 128 KB | 128 KB | ||
| CAN-FD Controllers | 2 | 2 | 0 (no CAN-FD) | 0 (no CAN-FD) | ||
| Hardware Crypto (AES/SHA/TRNG) | Yes (full accelerator set) | Yes (full accelerator set) | AES/SHA only (no TRNG accelerator) | AES/SHA only | ||
| LCD Controller | WXGA (1280x720), 2D | WXGA (1280x720), 2D | VGA (640x480) | |||
| Operating Temperature | -40C to +85C | -40C to +105C (extended) | -40C to +85C |
주요 차별점
- Full hardware crypto accelerator set including TRNG (vs ATSAMA5D22C-CU)
- Dual CAN-FD controllers for industrial protocols (vs ATSAMA5D22B-CUR)
- Higher WXGA display resolution support (vs ATSAMA5D22C-CU)
설계 노트
The ATSAMA5D23A-CUR 196-TFBGA package uses 0.65 mm ball pitch with microvia escape on top layers. Recommended stackup is a 6-layer PCB with dedicated GND and PWR planes under the BGA, and matched-length DDR3 traces routed on inner signal layers with reference to the GND plane. Estimated: with 1.2V core @ 500 MHz active, expect ~400 mW core dissipation; provide at least 4 thermal vias in the central ball array to dissipate heat.
Provide a low-noise 1.2V LDO or DC-DC for VDDCORE with at least 20% headroom above 400 mW peak load. Recommended PMIC companion is the MCP16502 or MIC2800. Decoupling: place 100 nF X7R capacitors within 2 mm of every VDD pin, plus 4.7 uF bulk capacitors on each supply rail. Use a star-ground topology to isolate analog and digital grounds, joined at the BGA thermal pad.
Do not assume any SAMA5D2 variant is drop-in compatible without verifying the boot mode pin strapping. The ATSAMA5D23A-CUR uses BMS (Boot Mode Select) pins that must match the desired boot source (SPI flash, SD card, eMMC, or UART). Mixing OTP fuse programming between D22 and D23 variants can brick the device. Always validate boot configuration against the SAMA5D2 datasheet boot ROM section before layout sign-off.
The DDR3 interface on the ATSAMA5D23A-CUR requires exact 50 ohm single-ended and 100 ohm differential impedance for the SDRAM traces, with trace length matching within 25 mils of the byte lane groups. Use IBIS-AMI models from Microchip (SAMA5D2 IBIS package) for SI simulation before fabrication. Add series termination resistors on clock and address/control nets if signal integrity margins are tight at 500 MHz DDR3 rates.
Estimated thermal analysis: at 25C ambient with no heatsink, the 196-TFBGA package dissipates roughly 400 mW into the PCB copper. With a 4-layer PCB and 4 thermal vias below the BGA, theta_JA is approximately 35 C/W, leading to ~14C junction temperature rise. For industrial -40C to +85C operation this is well within margin; for sealed enclosures add a copper pour area of at least 1 sq inch on top layer for additional cooling.
규정 준수 정보
Industrial temperature grade only (-40C to +85C). For AEC-Q100 automotive qualification choose the ATSAMA5D27C series with -WA suffix.